Abstract: Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

Abstract: A method for surface roughening a metal work piece includes disposing a region of the workpiece to be roughened proximate to a counter electrode. The region of the workpiece to be roughened and the counter electrode are subsequently disposed together in an electrolyte. An electric potential with current flow is applied between the work piece and the counter electrode to roughen the metal surface to a desired roughness.

Abstract: A method of patterning and an article having a patterned structure defined therein are provided. The method comprises the steps of providing a substrate having a patterned conductive metal film disposed thereon. The patterned conductive metal film has at least one raised feature. The patterned conductive metal film defines at least one recess therein that is adjacent to the at least one raised feature. A surface of the substrate is exposed in the at least one recess. The pattern is modified through electrolysis in an electrodeposition setup including an electrolyte and two electrodes. The patterned conductive metal film is one of the electrodes during electrolysis. The method is ideal for shrinking initial patterns having features that are on the magnitude of microscale dimensions to obtain a final pattern having features that are on the magnitude of nanoscale dimensions.

Abstract: Disclosed are a titanium material having excellent surface characteristics and a method for readily producing a titanium material having excellent surface characteristics. More specifically, provided is a titanium material including a surface film having a multilayer structure provided with at least two layers, namely a surface layer and an inner layer in contact with the inner side of the surface layer, wherein the surface layer is formed of titanium oxide with a hardness of 5 GPa to 20 GPa, and the inner layer contains at least one of titanium carbide and titanium nitride.

Abstract: A Moineau style stator includes a stator tube having a plurality of rigid helical lobes formed on an inner surface thereof. The helical lobes define a major internal tube diameter that is greater than a pass through diameter of the tube such that the major diameter undercuts the pass through diameter of the tube. A major liner diameter may also be less than the pass through diameter so as to provide a suitable interference fit between rotor and stator.

Abstract: Endoprostheses include an endoprosthesis wall that includes a surface layer that includes a metallic material and that defines a plurality of discrete pores. A porous material is disposed in one or more pores of the surface layer. The endoprostheses can, for example, deliver a therapeutic agent, such as a drug, in a controlled manner over an extended period of time.

Abstract: The invention discloses a microneedle array chip comprising metal microneedles and a substrate, wherein the microneedle consists of a needle head with a tip at its top, a needle bar and a needle seat, and is fixed onto the substrate via the needle seat; and the needle bar of the metal microneedle, having a cylindrical or conical shape, is inclined toward the substrate at a preset angle, and the needle head has a conical shape, or the upper surface of the tip is an oval plane or oval ring plane parallel to the substrate or inclined toward it at a preset acute angle. The metal microneedles in the microneedle array chip of the invention have firm structures to avoid fracture, and have sharp tips to facilitate puncturing. The maximal puncturing depth of the microneedles is easy to adjust and control. The microneedles in the array have good uniformity, and are safe and reliable to use.

Abstract: Various embodiments relate to interconnects for solid oxide fuel cells (“SOFCs”) comprising ferritic stainless steel and having at least one via that when subjected to an oxidizing atmosphere at an elevated temperature develops a scale comprising a manganese-chromate spinel on at least a portion of a surface thereof, and at least one gas flow channel that when subjected to an oxidizing atmosphere at an elevated temperature develops an aluminum-rich oxide scale on at least a portion of a surface thereof. Other embodiments relate to interconnects comprising a ferritic stainless steel and having a fuel side comprising metallic material that resists oxidation during operation of the SOFCs, and optionally include a nickel-base superalloy on the oxidant side thereof. Still other embodiments relate to ferritic stainless steels adapted for use as interconnects comprising ?0.1 weight percent aluminum and/or silicon, and >1 up to 2 weight percent manganese. Methods of making interconnects are also disclosed.

Abstract: A porous titanium dioxide film having photonic properties is made by etching a titanium substrate in an electrolyte solution in the presence of an electric field. The electrolyte solution can be an organic electrolyte solution. Etching involves providing an electrolyte solution in contact with a pair of electrodes and passing an electric current through the electrolyte solution. The titanium substrate can be one of the pair of electrodes. The current has a wave profile selected from a group consisting of a periodic square profile, a sine wave, a linear profile, or a quintic profile, and is provided either parallel of perpendicular to a plane of the substrate.

Abstract: There is disclosed a process for producing an aluminium alloy sheet, which comprises subjecting a surface of the sheet to anodising conditions to form on the surface an aluminium oxide barrier layer of thickness 10 to 50 nm and treating the oxide layer with an aqueous solution of alkali to remove the layer, thereby leaving a roughened surface on the alloy sheet.

Abstract: A method for selectively dissolving the beta (?) phase of a titanium alloy out of the surface of the alloy, thereby leaving behind a nano-scale porous surface having enhanced bonding properties with either a biological tissue, such as bone, or an adhesive material, such as a polymer or ceramic by immersing the alloy in an ionic aqueous solution containing high levels of hydrogen peroxide and then exposing the alloy to an electrochemical voltage process resulting in the selective dissolution of the beta phase to form a nano-topographic metallic surface.

Abstract: The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.

Abstract: A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.

Abstract: A water electrolysis apparatus includes a plurality of unit cells. A membrane electrode assembly of the unit cell includes an anode side power feeding element and a cathode side power feeding element stacked on an anode catalyst layer and a cathode catalyst layer on both surfaces of a solid polymer electrolyte membrane. A surface of the anode side power feeding element is subjected to a grinding process, and then, subjected to an etching process to form a smooth surface.

Abstract: The present invention is a wafer fixture comprising a housing body, a thrust plate, a flexure clamp, gaskets, flexure pins on an inner circumference of the housing body, locking grooves on an outer circumference of the flexure clamp, and a handle. A wafer may be placed between the gaskets of the housing body and the thrust plate. The flexure clamp may be placed over the thrust plate and secured to the housing body by rotating the flexure clamp such that locking grooves of the fixture plate mate with the flexure pins on the inner circumference of the housing body. The present invention in yet another embodiment is a wafer etch tool comprising a housing, a flexure clamp, and means for securing a wafer between the housing and the flexure clamp upon rotation of the flexure clamp within the housing.

Abstract: The invention provides a process for producing a metal body, which leads in a simple and reliable way to formation of a defined surface topography, if desired also combined, in the range from 10 nm to 500 ?m on a metal base body or blank which is to have, in particular, nanoscale pores. For this purpose, a pulsating current is applied to a metal base body in an electrolysis bath, with the electrolysis bath comprising salt former ions matched to the material of the metal base body. Furthermore, the invention provides a dental implant having particularly advantageous surface properties, in which a nanostructure is superimposed on a surface microstructure and nitrogen atoms and/or nitrogen compounds are attached and/or included in the region of the surface.

Abstract: The present invention provides panels for a microchannel heat exchanger core wherein the panels may have greater than about 36 fins per inch of the panel. The microchannels of the panels may have an aspect ratio of at least about 10. Panels are also provided having microchannels and fins on one side of the panel or on opposite sides of the panel. Methods are also provided for machining the panels of the present invention.

Abstract: It is an object of this disclosure to provide high productivity, low cost-of-ownership manufacturing equipment for the high volume production of photovoltaic (PV) solar cell device architecture. It is a further object of this disclosure to reduce material processing steps and material cost compared to existing technologies by using gas-phase source silicon. The present disclosure teaches the fabrication of a sacrificial substrate base layer that is compatible with a gas-phase substrate growth process. Porous silicon is used as the sacrificial layer in the present disclosure. Further, the present disclosure provides equipment to produce a sacrificial porous silicon PV cell-substrate base layer.

Abstract: An electrolysis device to separate water into its more economically valuable constituent hydrogen and oxygen gases. A neutral plate is interleaved between every magnetically charged electrode in an electrode stack to provide a means of spark suppression, a physical barrier between the hydrogen gas created at the cathode and oxygen gas created at the cathode, and to reduce deterioration of electrode surfaces caused by alternating polarity from an anode state to a cathode state. Scale of electrolysis cell electrodes are partially cleaned through a cycling of system polarity through a neutral electrode period. A means is provided to isolate and segregate dissociated hydrogen and oxygen gas.

Abstract: Even a site having a complicated curved surface shape, such as a welded spot on a bottom of a nuclear reactor core, is simply and electrolytically etched without discharging an etching liquid in a large amount, whereby grain boundary on the surface of the nuclear reactor core internals can be confirmed visually. When the surface of nuclear reactor core internals is electrolytically etched, a sponge provided with holes having a communicating structure is integrated with an etching liquid, and the etching liquid is gelled, while the integrated combination is disposed in front of an electrode, followed by the application of voltage to turn on electricity at a state in which said electrode is electrically connected to the cathode of a direct-current power supply, and brought into contact with or approximated to the surface of the core internals electrically connected to the anode of the direct-current power supply.

Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Abstract: An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.

Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Abstract: A method of removing coating from a substrate may include contacting at least a portion of a surface of a substrate to an electrolytic substance, where at least a portion of the surface includes cadmium; connecting a power source to the substrate and to an anode material; applying a current and a voltage; and removing at least a portion of coating from the substrate.

Abstract: A membrane structure is provided. The membrane structure includes a first layer having a plurality of pores; and a second layer disposed on the first layer. The second layer has a plurality of unconnected pores. At least a portion of the plurality of unconnected pores of the second layer is at least partially filled with a filler such that the first layer is substantially free of the filler. At least a portion of the plurality of unconnected pores of the second layer is in fluid communication with at least one of the pores of the first layer. A method of making a membrane structure is provided. The method includes the steps of providing a first layer having a plurality of interconnected pores; disposing a second layer on the first layer, and filling at least a portion of the unconnected pores of the second layer with a filler such that the first layer is substantially free of the filler.

Abstract: A method for altering a dimension of an element made of an amorphous metallic material is provided. The method includes providing an anode comprising the amorphous metallic material, wherein the amorphous metallic material comprises at least two primary constituents, providing a cathode disposed in a spaced-apart relationship with the anode, providing an electrolyte in contact with the anode and the cathode, and applying an electrical potential between the anode and the cathode.

Abstract: An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Abstract: An apparatus, a method, and an electrolytic solution are described for electropolishing metallic stents made, for example, of high-strength medical alloys. The apparatus may include an electropolishing container made from material of low thermal conductivity. The apparatus may include at least one spiral cathode for optimization of solution agitation and/or voltage distribution in the electrolytic solution. Further, an electrolytic solution including at least dimethylsulfate is described. A method for improved electropolishing to consistently produce smooth surfaces is also described.

Abstract: A porous silicon wafer including, on its upper surface side, multiple recesses, this upper surface being coated with a porous silicon layer having pores smaller than those of the wafer bulk.

Abstract: The present invention aim to provide a method of manufacturing an electropolishing pad, which is excellent in planarity, can reduce occurrence of scratches, and has a high polishing rate. The present invention relates to a method of manufacturing an electropolishing pad, including the steps of: laminating a tin sheet on and along a recessed structure surface of a resin layer to produce a laminated sheet having grooves in a tin sheet surface; and forming through holes penetrating the tin sheet and the resin layer in the laminated sheet.

Abstract: The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.

Abstract: A method for creating a nanostructure according to one embodiment includes depositing material in a template for forming an array of nanocables; removing only a portion of the template such that the template forms an insulating layer between the nanocables; and forming at least one layer over the nanocables. A nanostructure according to one embodiment includes a nanocable having a roughened outer surface and a solid core. A nanostructure according to one embodiment includes an array of nanocables each having a roughened outer surface and a solid core, the roughened outer surface including reflective cavities; and at least one layer formed over the roughened outer surfaces of the nanocables, the at least one layer creating a photovoltaically active p-n junction. Additional systems and methods are also presented.

Abstract: A method for fabricating lead frames of light emitting diodes (LEDs) including following steps is provided. First, a conductive frame tape is provided. The conductive frame tape includes a plurality of conductive frames arranged along an extending direction of the conductive frame tape. Each of the conductive frames has a first connection portion adapted to carry an LED chip. Next, a plurality of first sputter layers are selectively sputtered onto the conductive frame tape through at least one target, and the first sputter layers are formed on the first connection portions, respectively.

Abstract: This disclosure enables high-productivity fabrication of semiconductor-based separation layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers), optical reflectors (made of multi-layer/multi-porosity porous semiconductors such as porous silicon), formation of porous semiconductor (such as porous silicon) for anti-reflection coatings, passivation layers, and multi-junction, multi-band-gap solar cells (for instance, by forming a variable band gap porous silicon emitter on a crystalline silicon thin film or wafer-based solar cell). Other applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation).

Abstract: The performance and durability of static and dynamic seals for hydrogen storage and supply systems has been improved by utilizing a spring-energized and plastic coated radial seal in combination with at least a mating surface that has been treated by one of a variety of procedures. These procedures include applying to the mating surface a low-friction, hard, and hydrogen impervious coating, chemically polishing the mating surface, and electrochemically polishing the mating surface. Each of these procedures significantly reduces, on a microscopic scale, the surface roughness of the mating surface. The seal can thus form a tighter and more gas-tight seal with the smoother mating surface so as to decrease the loss of hydrogen gas across the seal. The smoother mating surface can also improve seal life by reducing seal surface wear.

Abstract: A method for making a lithographic printing plate support includes the steps of providing an aluminum support; graining the support in a graining electrolyte solution; and treating the grained support in a desmut electrolyte solution containing hydrochloric acid by applying a direct current resulting in a charge density Q; wherein the desmut electrolyte solution has a pH less than 1 and Q is at least 400 C/dm2.

Abstract: A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: A phosphoric acid fuel cell according to one embodiment includes an array of microchannels defined by a porous electrolyte support structure extending between bottom and upper support layers, the microchannels including fuel and oxidant microchannels; fuel electrodes formed along some of the microchannels; and air electrodes formed along other of the microchannels. A method of making a phosphoric acid fuel cell according to one embodiment includes etching an array of microchannels in a substrate, thereby forming walls between the microchannels; processing the walls to make the walls porous, thereby forming a porous electrolyte support structure; forming anode electrodes along some of the walls; forming cathode electrodes along other of the walls; and filling the porous electrolyte support structure with a phosphoric acid electrolyte. Additional embodiments are also disclosed.

Abstract: A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.

Abstract: A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

Abstract: A microscreen and its production method for filtering particles in microfluidics applications. The microscreen includes an at least regionally p-doped Si substrate having a recess, a macroporous membrane connected to the Si substrate via n-doped regions, the recess of the Si substrate being situated directly under the membrane to form a cavity.

Abstract: For electrolytically etching the surfaces of integrally bladed rotors (blisks) (6) made of nickel-base material for aircraft gas turbines, auxiliary cathodes (10), in addition to the main cathodes (3) provided in the electrolyte (1), are arranged in the area of the blades (9) remote from the electric contact points at the rotor disk (7). The auxiliary cathodes are adaptable in shape, arrangement and size to the blade and disk geometry, so that a uniform current flow from all parts of the rotor connected as anode via the electrolyte to the main and auxiliary cathodes is produced and an intense and uniform etching effect is achieved. This ensures a reliable structural assessment in all rotor areas and in particular also in the area of the integral blading.

Abstract: A micromechanical component is described which includes a substrate; a monocrystalline layer, which is provided above the substrate and which has a membrane area; a cavity that is provided underneath the membrane area; and one or more porous areas, which are provided inside the monocrystalline layer and which have a doping that is higher than that of the surrounding layer.

Abstract: In a method for producing a starting material (M, N, N?) for the production of a wear layer (420), a coating (40) with a composition which corresponds to that of the wear layer (420) which is to be produced is chemically undissolved from its substrate (30) and is detached as a solid body, and that the starting material (M, N, N?) is formed by the layer material (60) of the detached coating (40).

Abstract: A process for reducing secondary reaction zone formation articles includes the steps of non-selective removing an external surface of an as-cast article free of coating to form an as-cast article having a surface substantially free of residual surface stress; and applying a coating material upon the surface substantially free of residual surface stress to form a coated as-cast article having a coating layer disposed upon the surface substantially free of residual surface stress.

Abstract: A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishing pad, such that the pad electrode and conditioning disk form an electrode pair. An electric potential is established between the conditioning disk and the pad electrode. This causes debris from the polishing pad to become ionized, and attracted to the conditioning disk. The conditioning disk is then removed from the eCMP tool, allowing the eCMP tool to resume operation on normal semiconductor wafers.

Abstract: A method for removing a metal layer comprising the steps of providing a part having a slot, providing a porous metallic cathode comprising a recess bounded by a wall having an outer surface corresponding to the slot, inserting the porous metallic cathode into the slot, introducing an electrolyte into the recess of the porous metallic cathode, and removing a portion of an inner surface of the slot by flowing an electric current between the part and the porous metallic cathode.

Abstract: The invention is a method of electrochemical etching of a non-conductive insulator. The method entails inducing a current in the insulator by exciting electrons into the conduction band by supplying the needed energy through irradiation of the insulator. Alternatively, electrons may be supplied externally from an electron gun. The insulator is subject to an electrical bias, and the induced or supplied electrons then create a current in the insulator that effects the etch rated.

Abstract: The present invention is a wafer fixture comprising a housing body, a thrust plate, a flexure clamp, gaskets, flexure pins on an inner circumference of the housing body, locking grooves on an outer circumference of the flexure clamp, and a handle. A wafer may be placed between the gaskets of the housing body and the thrust plate. The flexure clamp may be placed over the thrust plate and secured to the housing body by rotating the flexure clamp such that locking grooves of the fixture plate mate with the flexure pins on the inner circumference of the housing body. The present invention in yet another embodiment is a wafer etch tool comprising a housing, a flexure clamp, and means for securing a wafer between the housing and the flexure clamp upon rotation of the flexure clamp within the housing.