Abstract: A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening method for processing and flattening a surface of a metal film formed on a workpiece and having initial surface irregularities, including: coating only recessed portions of the initial surface irregularities of the metal film with a solid or pasty coating material; and processing the surface of the metal film by electrolytic processing using no abrasive.

Abstract: Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Methods of refining using frictional refining, chemical refining, tribochemical refining, and electrochemical refining and combinations thereof are disclosed. A refining apparatus having magnetically responsive refining elements that can be smaller than the workpiece being refined are disclosed. The refining apparatus can supply a parallel refining motion to the refining element(s) for example through magnetic coupling forces. The refining apparatus can supply multiple different parallel refining motions to multiple different refining elements for example solely through magnetic coupling forces to improve refining quality and versatility. A refining chamber can be used. New methods of control are refining disclosed.

Abstract: A method of making an organic memory cell which comprises two electrodes with a controllably conductive media between the two electrodes is disclosed. The present invention involves providing a dielectric layer having formed therein one or more first electrode pads; removing a portion of the first electrode pad to form a recessed area on top of the pads and in the dielectric layer using reverse electroplating; forming a controllably conductive media over the first electrode pad in the recessed area; and forming a second electrode over the conductive media. The controllably conductive media contains an organic semiconductor layer and a passive layer.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: Medical devices, such as endoprostheses, and methods of making the devices are described. In some implementations, a stent has a surface region of magnesium with a protective surface layer of magnesium hydride obtained by hydrogen surface modification through an H-EIR process, offering enhanced corrosion resistance.

Abstract: A method of manufacturing an inkjet printer component and an inkjet printer component electropolishing device are provided. The method includes positioning an electrode in a fluid passageway of an inkjet printer component, the electrode including a conductive face and a nonconductive face; polishing a side of the fluid passageway by: biasing the nonconductive face of the electrode toward a side of the fluid passageway such that the conductive face of the electrode does not contact any portion of the fluid passageway; providing an electrolytic fluid to the fluid passageway of the inkjet printer component; and applying a voltage between the electrode and the inkjet printer component.

Abstract: The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More particularly, the electropolishing process of the invention is particularly suited for use on implantable medical devices, such as stents, due to the biocompatibility of cobalt-chromium alloys. The invention is directed to an improved stent formed from a cobalt-chromium alloy, that possesses an ultrasmooth shiny surface. This invention is also directed to a method of electropolishing such a stent using an acidic electrolytic solution comprising a mixture of 6 parts of about 98% sulfuric acid (H2SO4), 1 part of about 37% hydrochloric acid (HCl) and 1 part by of about 85% concentrated phosphoric acid (H3PO4) to produce an exceptionally smooth surface.

Abstract: A method of electrochemically treating a substrate is provided comprising the steps of: (a) providing an electrolyte in contact with the substrate; (b) providing a device which faces the substrate and is in contact with the electrolyte, the device having: (i) a common first electrode arranged to define cells therein; and (ii) a plurality of individually addressable second electrodes, wherein a plurality of the cells contain individually addressable second electrodes; and (c) altering the potential of at least one of the second electrodes relative to the common first electrode so that: (i) the common first electrode generates a first redox product; and (ii) the at least one of the second electrodes generate a second redox product which is able to modify a region of the substrate facing the at least one electrodes, wherein the electrolyte is such that the second redox product is quenchable by the first redox product.

Abstract: A system and method are described for radially positioning a workpiece for electrochemical machining. In one embodiment, a pressurized air chamber is configured to contain pressurized air. In addition, an expandable diaphragm is configured to position the workpiece radially relative to an electrode assembly in response to the pressurized air being released into the pressurized air chamber.

Abstract: A coupling (7) which is rotatable about a vertical axis of rotation and intended for the mounting of a workpiece support (15) which can be loaded, for example, with incorrectly coated or worn workpieces (18) is arranged in a removable holder (5) above a tank (2) filled with an electrolyte. Said workpiece support is connected via the coupling (7) to a current supply device, to the opposite pole of which an opposite electrode (12) is connected. A heating and cooling device (13) and an ultrasound generator (14) are also arranged in the tank (2). By current supply and simultaneous rotation, the coat is stripped from the workpiece support (15) and/or from the workpieces (18). After incorrect coating, the workpieces (18) together with the workpiece support (15) and in certain circumstances with the holder (5) can be taken over directly from a coating unit and, after coat stripping, transferred to such a coating unit for recoating.

Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

Abstract: A method of forming a perforate membrane (1) is disclosed for use in a liquid transport device. The membrane has at least plural nozzles (10) formed therethrough. Each of those nozzles has a throat portion (12) opening at opposite end through opposite surface (2?) of the perforate membrane and a smoothly curved outwardly diverging portion (11) extending from the first end of the throat portion to the first surface (2) of the perforate membrane. Laser energy is applied selectively to the first surface (2) of the membrane in the form of a pulsed, focused beam to form the nozzles (10) and thereafter the first surface (2) of the membrane and the surface of the diverging portion (11) of the nozzles (10) are electro-polished to remove surface imperfections. The electro-polishing is controlled so as to remove material from the surface of the diverging portion (11) of the nozzles to a depth less than the length of the throat portion (12).

Abstract: An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed.

Abstract: A method for removing a diamond-like carbon film on a substrate is provided. The diamond-like carbon film includes an amorphous carbon layer and an amorphous hydrogenated carbon layer formed on the amorphous hydrogen-free carbon layer. The method includes a step of electrolyzing the diamond-like carbon film in an acid solution. Compared with grinding, the electrolyzing process has advantages of low cost being cheaper, more convenient and results in a smoother surface.

Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

Abstract: An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the apparatus and method is that marks generated around the electrical contact between the anode and the medical implant are minimized. In addition, the medical implant is polished more evenly than conventional electropolishing systems.

Abstract: The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.

Abstract: A method of forming a hydrodynamic bearing surface on a workpiece is provided. The method comprises electrochemically etching away all material in a region of the surface, except for portions of the region defined by a land pattern on an etching cathode. The step of removing forms a continuous recessed region comprising grooves formed between the portions of the region defined by the land pattern, and a relief cut region circumscribing the workpiece.

Abstract: A method of forming a planarized layer on a substrate, where the substrate is cleaned, and the layer is formed having a surface with high portions and low portions. A resistive mask is formed over the low portions of the layer, but not over the high portions of the layer. The surface of the layer is etched, where the high portions of the layer are exposed to the etch, but the low portions of the layer underlying the resistive mask are not exposed to the etch. The etch of the surface of the layer is continued until the high portions of the layer are at substantially the same level as the low portions of the layer, thereby providing an initial planarization of the surface of the layer. The resistive mask is removed from the surface of the layer, and all of the surface of the layer is planarized to provide a planarized layer.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.

Abstract: A highly accurate, efficient, and non-mechanical method of removing material from the surface of a golf club head using the principles of electrolysis. The process generally includes positioning at least one electrode in close proximity to a portion of a rear surface of a striking plate, flowing a liquid containing an electrolyte between the rear surface portion and the electrode, and applying a low voltage between the rear surface portion and the electrode. The electrode has an overall negative charge and the golf club head has an overall positive charge, such that a pulsed high-density DC current passes between the electrode and the rear surface portion. This results in negatively charged electrolytes in the liquid attracting positively charged molecules of the rear surface portion, such that the designated amount of material from the rear surface portion is removed by electro-chemical oxidation and carried away by the liquid flow.

Abstract: A method and apparatus for forming a fluid dynamic pressure groove in a fluid dynamic pressure bearing is provided. The method is accomplished by initially positioning and securing multiple workpieces to be machined to their respective machining devices. An electrochemical dissolving effect is imparted to each target surface of the multiple workpieces and then at least one fluid dynamic pressure groove is formed on each target surface of the multiple workpieces. Each groove may have a specified shape, dimension and surface condition. An electrolyte is directed from a common electrolyte tank to each of the machining devices used on the multiple workpieces.

Abstract: A method of cleaning and polishing an alloy comprising at least one noble metal and at least one non-noble metal, the method including the steps of submerging said alloy in an electrolytic acidic bath comprising at least one chelating or complexing agent including sulfur, and applying a multiple pulse periodic reverse waveform, and articles cleaned and/or polished thereby.

Abstract: Devices for enhancing the sensitivity of a microsensor or any other micro device by providing on-line preconcentration. Microconcentrators that can be integrated with a sensor or a micromachined GC to enhance the signal to noise ratio can include a miniaturized sorbent trap fabricated on a microchip. The microconcentrator can be made on a silicon substrate so that a sensor can be integrated on the same chip. The microconcentrator is composed of at least one microchannel lined with a microheater for in-situ heating. Preconcentration may be achieved on a thin-film polymeric layer deposited above the heater in the microchannel. Rapid heating by the channel heater generates a “desorption pulse” to be injected into a detector or a sensor.

Abstract: A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.

Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract: A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.

Abstract: An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductive surface to be planarized is placed in the high resistance phase and adjacent a phase interface between the high resistance phase and the etching solution phase. A wiper is used to mechanically move the thin high resistance phase covering the conductive surface so that the raised regions of the non-planar conductive surface is briefly exposed to etching solution phase. The mechanical action of the wiper does not disturb the high resistivity phase filling the rescessed regions of the surface. As the raised surface locations are exposed, the etching solution phase contacts and electroetch the exposed regions of the raised regions until the surface planarized.

Abstract: A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface of the conductive material. The corner can be blunted or rounded, for example, by applying a voltage to an electrode in fluid communication with an electrolytic fluid disposed adjacent to the corner. Electrical current flowing through the corner from the electrode can oxidize the conductive material at the corner, and the oxidized material can be removed with a chemical etch process.

Abstract: An electrochemical method is provided for producing trenches for trench capacitors in p-doped silicon with a very high diameter/depth aspect ratio for large scale integrated semiconductor memories. Trenches (macropores) having a diameter of less than about 100 nm and a depth of more than 10 ?m can be produced on p-doped silicon having a very low resistivity at a high etching rate.

Abstract: Method for deburring and/or rounding a side face of a thin-sheet and annular metal element (1), such as a ring element (1) for use in a push belt for continuously variable transmission, wherein the ring element (1), in a machining step, is received in a device for electrochemical machining (“ECM”) of the ring element (1), an electrode (5) being positioned in the device opposite an axially oriented side face (3) of the ring element (1), which electrode (5), as seen in a thickness or radial direction of the ring element (1), has a dimension which is at least twice as great as a dimension of the ring element (1) in the said thickness direction.

Abstract: A method of forming a planarized layer on a substrate, where the substrate is cleaned, and the layer is formed having a surface with high portions and low portions. A resistive mask is formed over the low portions of the layer, but not over the high portions of the layer. The surface of the layer is etched, where the high portions of the layer are exposed to the etch, but the low portions of the layer underlying the resistive mask are not exposed to the etch. The etch of the surface of the layer is continued until the high portions of the layer are at substantially the same level as the low portions of the layer, thereby providing an initial planarization of the surface of the layer. The resistive mask is removed from the surface of the layer, and all of the surface of the layer is planarized to provide a planarized layer.

Abstract: In a method for photo-electrochemical etching of a semiconductor sample, the semiconductor sample is brought in contact with an electrolyte liquid. The contact area formed thereby is illuminated through the electrolyte liquid with UV light. The photo-current created by UV light irradiation at the contact area is measured. To increase the etching quality, a jet of fresh electrolyte liquid is repeatedly applied to the contact area. A device for carrying out the method includes a container to be filled with an electrolyte liquid, a UV source for illuminating the semiconductor sample with UV light through the electrolyte liquid, and a measuring instrument for measuring the photo-current created during UV light irradiation of the contact area. Further provided are an inlet for supplying fresh electrolyte liquid, directed towards the semiconductor sample, and a device attached to the inlet for repeated production of electrolyte fluid jets, directed towards the semiconductor sample.

Abstract: An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the workpiece support plate, has at least one opening coupled to a source of electrolyte for receiving an electrolyte solution therethrough and placing the electrolyte solution in contact with the support plate and workpiece. A first conductive element is coupled to, a first potential and positioned proximate the metallic surface, and the carrier is configured to position the workpiece proximate the support plate.

Abstract: In an electrolytic cell a membrane consisting of dielectric material such as an organic polymer, which separates two chambers of the electrolytic cell from each other is produced using an etching solution which is provided in one of the chambers, contains active etching ions, while the other chamber contains a solution, which does not have an etching action. An electrical field is generated through the membrane. The etching progresses along ion tracks in the membrane and first produces one funnel-shaped pore per ion track. Immediately prior to the breakthrough, the ions, which do not have an etching action, begin to penetrate the still existent thin layer with fine pores—the active layer—and displace the ions with an etching action. An intensified electric current, driven by the adjacent field, is established and the etching process at the bottom of the pore shifts sideways according to the concentration of etching ions still present. The process is stopped by deactivating the field and flushing the membrane.

Abstract: For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15?, 15?, transported on a conveying line through a treatment unit 1 and brought in contact with treatment fluid F1. During transportation, the material Fo is guided past at least one electrode arrangement, having at least one cathodically polarised electrode 6 and at least one anodically polarised electrode 7, both being brought in contact with the treatment fluid F1 and being connected to a current/voltage source 8. Current flows through the electrodes 6, 7 and the electrically conductive structures 4. The electrodes 6, 7 are screened from each other so that substantially no electric current is able to flow directly between oppositely polarised electrodes 6, 7. The material Fo is finally loaded back onto a store 15?, 15?.

Abstract: A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A structure is also provided that comprises a substrate, a platable metal barrier layer(s) located on the substrate and a relatively continuous uniform electroplated layer of a conductive material located on the platable resistive metal barrier layer.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed to come into contact with a metal layer formed on a substrate, the contact coming into contact at an approximate center of the substrate. Alternatively, a plurality of needle bodies are disposed to be in electrical contact with a metal layer of a substrate being treated, thereby power supply for electrolytic polishing/plating to a substrate being treated being implemented, without restricting to a periphery of a substrate, from a plurality of points on a surface thereof. Due to any one of these, liquid treatment equipment enables to improve uniformity in plane of an electric current sent to a surface being treated and of liquid treatment.

Abstract: The methods and systems described provide for an in-situ detection of planarity of a layer that is deposited on or etched off the surface of a substrate. Planarity can be detected using various detection mechanisms, including optical, electrical, mechanical and acoustical, in combination with the electrochemical mechanical processing methods, including electrochemical mechanical deposition and electrochemical mechanical etching. Once planarity is detected, a planarity signal can be used to terminate or alter a process that has been previously initiated, or begin a new process. In a preferred embodiment, an optical detection system is used to detect planarity during the formation of planar conductive layers obtained by electrochemical mechanical processing.

Abstract: Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.

Abstract: An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.

Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.

Abstract: A drive head for a bolt, fastener, coupling, nut or other driveable head made from a less malleable metal such as a powder metal nickel alloy. The drive head has an upper drive portion having at least six convex corners spaced around the outer periphery thereof, each corner terminating in an edge. The drive head also has a lower flange portion adjacent to the drive portion and having an edge extending radially outwardly to at least the edge of each corner. The drive portion and the flange portion of the drive head is formed by subjecting a blank having a generally circular head to electrochemical machining (ECM). A tool is also provided for the ECM method to form the drive portion and flange portion of the drive head.

Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions.

Abstract: A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium persulfate and titanium (111) chloride. Anode foils etched according to the method of the invention maintain high capacitance gains, electrical porosity and strength. The electrical porosity of the etched foils is sufficiently high such that the overall Equivalent Series Resistance (ESR) is not increased in multilayer anodes configurations. Also described is a low pH electrolyte bath composition. Anode foils etched according to the present invention and electrolytic capacitors incorporating the etched anode foils are also disclosed.

Abstract: A method and associated structure for increasing the rate at which a chromium volume is etched when the chromium body is contacted by an acid solution such as hydrochloric acid. The etch rate is increased by a metallic or steel body in continuous electrical contact with the chromium volume, both of which are in continuous contact with the acid solution. At a temperature between about 21° C. and about 52° C., and a hydrochloric acid concentration (molarity) between about 1.2 M and about 2.4 M, the etch rate is at least a factor of about two greater than an etch rate that would occur in an absence of the steel body. In one embodiment, the chromium volume is a chromium layer that rests upon a conductive layer that includes a metal such as copper, wherein the acid solution is not in contact with the conductive layer.

Abstract: Provided is a selective electrochemical etching method in which, when a facing electrode faces a substrate having at least one doping region on an upper surface and a contact layer on a bottom surface and a bias voltage is applied to the substrate, the doping region is selectively etched depending on a doping concentration of the doping region within a bath which contains an etchant. The bias voltage is applied to the bottom surface of the substrate, which is opposite to the upper surface on which the doping region is formed, so that a hole current is supplied to the substrate via the bottom surface of the substrate. Accordingly, a contact layer is formed on the bottom surface of a specimen so as to deliver a hole current to the substrate, whereby a more precise, more reproducible doping profile can be obtained than in a conventional electrochemical etching method.