Abstract: The invention relates to a fuel cell, having a first electrode, a second electrode, and a membrane element, in which the membrane element is disposed between the first electrode and the second electrode. At least one of the electrodes has a flow field plate and at least one flow conduit, through which a reactant can be conducted, extends in at least one outer surface of the flow field plate. According to the invention, it is provided that the flow field plate has at least one microreaction chamber, and the microreaction chamber is disposed in the outer surface and on the flow conduit. A catalyst is disposed on at least a part of the microreaction chamber in such a way that the catalyst has contact simultaneously with the membrane element and the inflowing reactant.

Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.

Abstract: A memory metal or Nitinol plug is inserted into a tube and heated to cause the plug to expand as it transforms from a martensitic state to an austenitic state. The plug is held by a tool connected to an electric conductor. The tube is then grounded and current is run through the holder, the plug, and, in turn, the tube. Electrical resistance causes the plug to heat up and revert to the austenitic state. The holder is preferably a tube with an internal collet, spring urged into a closed position adapted to grasp a post of the Nitinol plug. To separate the holder from the plug, the collet is pulled to an expanded position by pulling the holder from the tube. This allows the collet to open and separate from the plug.

Abstract: The invention at hand relates to a method for processing and repairing a metal component with at least one finished or nearly finished partial component surface and at least one working surface to be further processed by means of an electrochemical treatment process and abutting the at least one finished or nearly finished partial component surface, with the process comprising the following steps: a) application of an electrically conductive layer on at least one area of the at least one finished or nearly finished partial component surface abutting the working surface to be processed, with the layer containing a metal or a metal alloy that has a similar or the same as, or a desiredly different electrochemical erosion behavior than the metal component; and b) electrochemical treatment of the working surface and of the layer, with the layer being completely or nearly completely eroded. The invention moreover relates to a component of a gas turbine or of a high or low pressure compressor.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: A method and process for at least partially forming a medical device that is at least partially formed of a novel metal alloy which improves the physical properties of the medical device.

Abstract: Methods to etch a workpiece are described. In one embodiment, a workpiece is disposed within an etchant solution having a composition comprising a dilute acid and a non-ionic surfactant. An electric field is generated within the etchant solution to cause an anisotropic etch pattern to form on a surface of the workpiece.

Abstract: We propose to shape the leaf by the use of electro-chemical machining (ECM). ECM is a technique by which a blank is suspended within a mould, with a small gap therebetween. A conductive fluid is caused to flow through the gap, and a large electrical current is passed from the mould to the blank. The blank steadily erodes, dissolving into the fluid. The fluid should not provoke a reaction from the material of the blank, such as a surface oxide. Sodium Chloride solution is a common choice. The current that is passed can, if desired, be controlled to a profile that will affect the manner of erosion. Thus, the current profile can be a steady on/off current, or it can be pulsed. One known arrangement is for the current to rise to a peak, then fall to zero, followed by a brief reverse flow.

Abstract: An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.

Abstract: A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.

Abstract: On aspect is a method to manufacture an integrated circuit including a reshaping process of the wafer edge region and an apparatus to perform the reshaping process.

Abstract: An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution (48) comprising an organic solvent, such as propylene carbonate, and an electrolyte, such as lithium hexafluorophosphate, dissolved into the organic solvent, and optionally an inhibitor composed of a heterocyclic compound; and applying an electric potential, for example, a positive electric potential which is controlled at a value less than the decomposition voltage of the organic solvent, to the surface of the substrate (W) to carry out electrolytic processing of the substrate surface.

Abstract: Apparatus and method for making a metrological scale by electrochemical machining of a scale substrate using a tool having at least one feature. The method has the steps of passing an electrolyte solution between the tool and the scale substrate and forming an electrical connection between the scale substrate and the tool. Electrochemical dissolution of the scale substrate occurs adjacent to the feature of the tool to produce at least one scale marking. This is suitable for making linear, rotary and two dimensional scales.

Abstract: A method of manufacturing a metal housing (14) includes providing a first passage (10) through the metal housing (14) and providing a second passage (12) through the metal housing (14), wherein the second passage (12) includes a region of intersection (20) which intersects the first passage (10) to define an opening (22, 122, 222) into the first passage (10). The method further includes subjecting the metal housing (14) to a heat treatment process to carburise an internal surface of the first and/or second passage (10, 12) and, subsequent to the carburisation process, applying a hard stage electrochemical machining process to the carburised internal surface of the first and/or second passage (10, 12) to improve surface finish. Another aspect of the invention includes providing a second passage (12) through the metal housing (14) by means of a tool (46), such as an electrochemical machining electrode, having an active region without rotational symmetry about its axis (Y-Y).

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 ?m.

Abstract: A method and apparatus for removing conductive material from a microelectronic substrate is disclosed. One method includes disposing an electrolytic liquid between a conductive material of a substrate and at least one electrode, with the electrolytic liquid having about 80% water or less. The substrate can be contacted with a polishing pad material, and the conductive material can be electrically coupled to a source of varying electrical signals via the electrolytic liquid and the electrode. The method can further include applying a varying electrical signal to the conductive material, moving at least one of the polishing pad material and the substrate relative to the other, and removing at least a portion of the conductive material while the electrolytic liquid is adjacent to the conductive material. By limiting/controlling the amount of water in the electrolytic liquid, an embodiment of the method can remove the conductive material with a reduced downforce.

Abstract: A semiconductor substrate is anodized to be shaped into an optical lens. Prior to being anodized, the substrate is finished with an anode pattern on its bottom surface so as to be consolidated into a unitary structure in which the anode pattern is precisely reproduced on the substrate. The anodization utilizes an electrolytic solution which etches out oxidized portion as soon as it is formed as a result of the anodization, to thereby develop a porous layer in a pattern in match with the anode pattern. The anode pattern brings about an in-plane distribution of varying electric field intensity by which the porous layer develops into a shape complementary to a desired lens profile. Upon completion of the anodization, the semiconductor substrate is shaped into the lens by etching out the porous layer and the anode pattern from the substrate.

Abstract: An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process to change a contact point between the anodes and the medical device. A tilting mechanism can also be used for periodically tilting the anodes during the electropolishing process to allow bubbles to escape from one end of the stent.

Abstract: The present invention provides an electrochemical polishing method capable of increasing a polishing speed while preventing excessive polishing, such as dishing or erosion. In the electrochemical polishing method, when a voltage applied to a conductive film formed on the surface of a substrate is increased at a contact surface pressure of 0 between the surface of the substrate and a polishing pad, a voltage at a first change point C that allows a current density to start to decrease after an increase is referred to as a minimum voltage. In addition, when the voltage is increased at a contact surface pressure having a finite value, a voltage at a second change point B that allows the current density to be maintained constant after the decrease is referred to as a maximum voltage. In this case, the surface of the conductive film is polished while maintaining the voltage to be not lower than the minimum voltage and not higher than the maximum voltage.

Abstract: A continuous process of forming a highly smooth surface on a metallic tape by passing a metallic tape having an initial roughness through an acid bath contained within a polishing section of an electropolishing unit over a pre-selected period of time, and, passing a mean surface current density of at least 0.18 amperes per square centimeter through the metallic tape during the period of time the metallic tape is in the acid bath whereby the roughness of the metallic tape is reduced. Such a highly smooth metallic tape can serve as a base substrate in subsequent formation of a superconductive coated conductor.

Abstract: A method of fabricating a conductive prosthetic, such as a stent, with a dimpled surface comprising the steps of: (i) providing a blank; (ii) electrochemically eroding superfluous material to leave a structural skeleton, (iii) electropolishing, (iv) dimpling the surface of the structural skeleton by selectively electrochemically eroding recesses on the surface of the prosthetic and (v) impregnating the recesses with a bioactive material, and prosthetics such as stents with dimpled surfaces fabricated thereby.

Abstract: A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conducting material being electrically connected to at least one electrode current supply contact; said substrate comprising a top surface in contact with or arranged adjacent said first surface and having conducting material and/or structures of a conducting material arranged thereon, said substrate conducting material being electrically connected to at least one current supply contact; whereby a plurality of electrochemical cells are formed delimited by said cavities, said substrate conducting material and said electrode conducting material, said cells comprising an electrolyte; herein an electrode resistance between said electrode conducting material and said electrode current supply contact and a substrate resistance between

Abstract: A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.

Abstract: This invention discloses a proper process control to produce a highly pure stainless steel cable products, including electro skim to improve smoothness of the rough surface of said product, electrolyte bath, electropolishing for leveling of roughness on the surface of said product and for increased resistance to corrosion, activation with weak acid, bath cleaning, and drying.

Abstract: A high fatigue life superelastic nickel-titanium (nitinol) wire, ribbon, sheet, tubing, or the like is disclosed. The nitinol has a 54.5 to 57.0 weight percent nickel with a balance of titanium composition and has less than 30 percent cold work as a final step after a full anneal and before shape setting heat treatment. Through a rotational beam fatigue test, fatigue life improvement of 37 percent has been observed.

Abstract: A system and method for electrochemically machining a work-piece contains a fixture capable of receiving a work-piece and securing the work-piece to the fixture. An electrolyte source is also provided. In addition, the system contains a rotary drive subassembly capable of receiving a portion of the work-piece therein, motion of the rotary drive assembly being determined by a received control signal, wherein frequency and amplitude of the control signal increases and decreases motion of the rotary drive subassembly, and wherein the control signal is a trapezoidal waveform.

Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: A method of producing a highly etched electrode for a capacitor from a foil is disclosed. The method comprises first applying a laser beam to the foil to form a plurality of marks on the foil surface and then etching the foil. Preferably, the laser marks facilitate etching of foil surface in areas near the marks and retard etching of foil surface inside the marks. After etching, the foil is further processed in a combination of optional steps such as forming and finishing steps. The laser marking of the foil allows for positional control of tunnel initiation, such that tunnel initiation density and the location of tunnel initiation is controlled. By controlling the position of tunnel initiation, foils are etched more uniformly and have optimum tunnel distributions, thus allows for the production of highly etched foils that maintain high strength and have high capacitance.

Abstract: Provided is a particle that includes a first porous region and a second porous region that differs from the first porous region. Also provided is a particle that has a wet etched porous region and that does have a nucleation layer associated with wet etching. Methods of making porous particles are also provided.

Abstract: The methods and compositions described herein generally relate to methods and compositions for providing a non-stick surface on selected materials. In a method aspect, the methods and compositions described herein provide a method of making a non-stick surface on a metal substrate. The method includes the following steps: a) applying nanostructured zirconia or nanostructured titania to a metal substrate; and b) polishing the surface of the metal substrate.

Abstract: A method for surface roughening a metal work piece includes disposing the work piece proximate to a counter electrode. The work piece and the counter electrode are disposed in an electrolyte. An electric potential with current flow is applied between the work piece and the counter electrode to roughen the metal surface to a desired roughness.

Abstract: A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.

Abstract: Systems and methods for etching topographic features in non-crystalline or metallic substrates are provided. A protective material is placed and patterned on a surface of the substrate to define exposed and protected regions of the substrate for etching in a liquid etchant having etching rates that are thermally activated. A nonuniform temperature profile is imposed on the substrate so that the temperatures and hence the etching rates at surfaces in the exposed regions are higher than those in the protected regions. Arrangements for imposing the nonuniform temperature profile include heating designated portions of the substrate with light radiation. Alternatively, the non-uniform temperature profile is developed as etching progresses by passing current pulses through the substrate in a manner that causes geometrically non-uniform heating of the substrate.

Abstract: The invention concerns a process for the polishing of metallic dental prostheses, such as frames. In order to reproducibly obtain a defined surface roughness with no need for additional finishing, it is proposed for the dental prosthesis to be polished by means of plasma polishing.

Abstract: A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential difference between conductive surface and an electrode and establishing relative motion between the belt pad and the conductive surface result in material removal from the conductive surface. Electrical contact to the surface is provided through either contacts embedded in the belt pad or contacts placed adjacent the belt pad.

Abstract: A machine for electrochemically polishing indentations within the wall of an aluminum workpiece, such as a wheel, has a cathode attached to an upper platen. The workpiece is mounted upon a lower platen which acts as an anode. Electrolyte is passed between the cathode and the anode while simultaneously a current is applied which passes through the cathode and the anode. The current is selectively pulsed to maximize polishing but at the same time to permit the flushing away of residual material and to cool the cathode and the workpiece.

Abstract: A simple and cost-effective possibility is proposed for producing optically transparent regions (5, 6) in a silicon substrate (1), by the use of which both optically transparent regions of any thickness and optically transparent regions over a cavity in a silicon substrate are able to be implemented. For this purpose, first at least a specified region (5, 6) of the silicon substrate (1) is etched porous. Thereafter, the specified porous region (5, 6) of the silicon substrate (1) is oxidized.

Abstract: Disclosed herein, among other things, are high surface area electrodes and methods of making the same. In an embodiment, the invention includes a method of increasing the surface area of an electrode of an implantable medical device including immersing the electrode in an electrolyte solution and oxidatively removing material from the surface of the electrode. In an embodiment, the invention includes a method of increasing the surface area of an electrode of an implantable medical device including immersing the electrode in an electrolyte solution and applying an oscillating electrical potential. In an embodiment, the invention includes a method of manufacturing an implantable stimulation lead including welding an electrode to a conductor and increasing the surface area of the electrode by oxidatively removing a portion of the electrode surface. Other aspects and embodiments are provided herein.

Abstract: The invention relates to a method for manufacturing a tool electrode for the electrochemical machining of workpieces, particularly for components for fluid bearings with the following processing steps: (a) Providing an electrode body made of a conductive base material which has an essentially smooth surface; (b) Coating the surface of the electrode body with an insulating material; (c) Removing the insulating material from locations on the surface of the electrode body that correspond to a pattern which is to be formed on the surface of the piece by means of electromechanical machining.

Abstract: A method of construction of an electrochemical interconnect plate, the method comprising the steps of: (a) etching predetermined fluid flow channels in a first conductive sheet; and (b) coating the first conductive sheet with a corrosion resistant layer of nickel and tin.

Abstract: The invention relates to a tool for the electrochemical machining of a fuel injection device, the tool comprising an electrode holder and an electrode element which forms a cathode during the machining operation in order to be able to electrochemically remove material from the fuel injection device in a machining region. The electrode element is arranged in such a way that it can be displaced in relation to the electrode holder.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: A surface treatment device for applying a surface treatment medium to an article is provided with the surface treatment device having an application member for applying the surface treatment medium to the article and an electrode, which applies an electrical potential between the application member and the article. The device provides localised treatment to the article and can remove oxide layers or the like from metallic materials without removing or damaging the underlying metallic material.

Abstract: Medical devices, such as, for example, endoprosthesis, and related methods are disclosed.

Abstract: An electromachining process and apparatus includes providing both high-speed electroerosion functions for rapidly rough finishing a workpiece and electrodischarge machining functions for fine finishing by first using a rotary electrode to implement the high-speed electroerosion function, and then removing and replacing the rotary electrode with an EDM electrode to implement the electrodischarge machining functions.

Abstract: The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.

Abstract: An adjustable anode assembly for a wet processing apparatus to allow selective tuning of the electrical field density distribution within a wet process chemical of the apparatus, which in turn allows the process specification or specifications to be selectively varied across the process surface of a wafer when processed by the apparatus. The adjustable anode assembly includes an anode which may be divided into several plates, at least one of which is capable of being moved from a first plane to at least a second plane.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.