Abstract: The corrosion resistance of an aluminum or aluminum alloy component is enhanced by immersing an aluminum alloy to act as a cathode and an oxygen-evolving anode in an electrolyte comprising water, cerium ions, and an additive selected from among animal gelatin, derivatives of animal gelatin, and amino acids, then passing an electrical current through the electrolyte to deposit a cerium-based coating onto the aluminum-based component.

Abstract: In a method for fabricating a Bi thin film having a great MR (magnetoresistance) at room temperature and a method for fabricating a spintronics device using the same, the Bi thin film is fabricated by an electrodepostiting method and a sputtering method and has very great MR characteristics at room temperature, and it can be applied to various spintronics devices.

Abstract: A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper.

Abstract: An electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives dissolved in the non-aqueous non-aromatic organic solvent. Electrodeposition of a metal from the electroplating solution includes preparing an electroplating solution and electrodepositing the metal from the electroplating solution onto a conductive substrate under a cathodic current. An electroplating system has a plating chamber containing an electroplating solution, an entry point to the electroplating system, and a transporting system to convey a part to be electroplated from the entry point to the plating chamber. The electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives, the mixture dissolved in the non-aqueous non-aromatic organic solvent.

Abstract: A metal foil for a current collector of a secondary battery formed by electrodeposition and has a thickness (T) of 8 to 40 &mgr;m, the metal foil satisfying the following formulae:

Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

Abstract: The corrosion resistance of an aluminum or aluminum alloy component is enhanced by immersing an aluminum alloy to act as a cathode and an oxygen-evolving anode in an electrolyte comprising water, cerium ions, and an additive selected from among animal gelatin, derivatives of animal gelatin, and amino acids, then passing an electrical current through the electrolyte to deposit a cerium-based coating onto the aluminum-based component.

Abstract: Corrosion resistance of metallic components such as stainless steel components of vehicles, and especially aluminum-based components of aircraft, is enhanced by application of an e-coat paint or primer which is enhanced by incorporation of cerium ions into the e-coat electrolytic bath. The resulting overall coating includes a cerium-based layer under a cerium-enhanced e-coat paint or primer layer.

Abstract: A subject of the present invention is to provide a water based hydraulic fluid and a hydraulic pressure device able to prevent burning and wearing in a sliding portion of a member constructed by an iron-based material as much as possible. Therefore, the water based hydraulic fluid relative to the invention contains copper ions for forming a film on addendum surfaces of a drive gear and a driven gear constructed by the iron-based material. A gear pump as the hydraulic pressure device relative to the invention uses the water based hydraulic fluid containing metallic ions for forming the film on the addendum surfaces of the drive gear and the driven gear constructed by the iron-based material.

Abstract: The invention relates to a metal membrane filter (1) and to a method and apparatus for the production thereof. The metal membrane filter (1) has rectilinear, cylindrical filter pores (2), which are arranged statistically distributed on the metal membrane filter surface (3) in a density of from a single filter pore (2) per cm2 up to 107 filter pores (2) per cm2. The average diameter of the filter pores (2) is uniform for all filter pores (2) and is from a few tens of nm up to several micrometres. The metal membrane filter (1) comprises a metal electro-deposited with rectilinear, cylindrical filter pores (2) or a correspondingly electro-deposited metal alloy.

Abstract: A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/or at least one water-soluble sulfonic acid, at least one water-soluble nitro-containing substance, at least one water-soluble surface-active agent and at least one vitamin. The bath system galvanostatically applies high quality layers with uniform quality. The bath system can be kept free of harmful substances such as cyanides, sulfites and hard complexing agents.

Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

Abstract: The present invention is to provide a highly adhesive surface-coated cemented carbide which comprises a cemented carbide base material and a hard film formed on a surface of the base material, characterized in that both of the hard film at a proximate portion of an interface between the hard film and the cemented carbide base material and the cemented carbide at a proximate portion of an interface contain at least one diffusive element selected from chromium, molybdenum, manganese, copper, silicon and an iron group metal and a method for producing the same by uniformly coating at least part of a surface of the base material with a metal, an alloy, or a compound comprising at least one diffusive element selected from iron group metals, chromium, molybdenum, manganese, copper, and silicon followed by coating the surface with the hard film.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.

Abstract: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.

Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

Abstract: A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.

Abstract: An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2(NO2)2 or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate, comprises electroplating the substrate using this electrolyte and then aluminizing the electroplated substrate at an elevated temperature to grow a platinum modified aluminide diffusion coating.

Abstract: A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005×h2/w<D/&kgr;<0.5×h2/w, and 0.01≦&THgr;≦0.

Abstract: The invention encompasses a method of forming a container-shaped physical vapor deposition target. A conductive material is provided in a container-shape. The container-shape comprises an interior region and an exterior region, and the conductive material comprises an interior surface along the interior region as well as an exterior surface along the exterior region. A sputtering material is electrolytically deposited on at least one of the interior and exterior surfaces of the container-shaped conductive material. The invention also encompasses a container-shaped physical vapor deposition target. The target includes a first conductive material in a container-shape, with the container-shape comprising an interior region and an exterior region. The first conductive material comprises an interior surface along the interior region of the container-shape and an exterior surface along the exterior region of the container shape.

Abstract: The present invention discloses compositions for increasing the adhesion of a layer of silver deposited from an immersion plating bath as well as methods of increasing the adhesion of silver layers obtained using these compositions. Such compositions and methods are particularly useful in the manufacture of electronic devices.

Abstract: Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal and a radioisotope, which may be soluble or insoluble, and may further comprise a reducing agent. The radioactive sol-gel comprises at least one metal alkoxide and a radioisotope, which may be soluble or insoluble. Methods of making a substrate radioactive by coating with radioactive coating solutions or sol-gels are also disclosed, including electrodeposition, electroless deposition, spin coating and dip coating. In a particular embodiment, the radioactive coating formed by the method is a composite coating. Radioactive substrates are also disclosed, comprising a substrate and one or more radioactive coatings, which coatings may be the same or different.

Abstract: The present invention provides a composition and method for void-free plating of a metal into high aspect ratio features. The plating process is carried out in a plating solution containing metal at a molar concentration of between about 0.4 M and about 0.9 M, an acid at a concentration of between about 4 mg/L and about 40 mg/L, a suppressor at a concentration of between about 2 mL/L and about 15 mL/L, an accelerator at a concentration of between about 1.5 mL/L and about 8 mL/L, and a leveler at a concentration of between about 4 mL/L and about 11 mL/L.

Abstract: Disclosed are methods for depositing a conductive layer on a substrate having a barrier layer and/or a dielectric layer. Such methods are particularly suitable for depositing an electroplated copper layer on a substrate having small apertures, and preferably very small apertures.

Abstract: An electroplating process for filling damascene structures on substrates, such as wafers having partially fabricated integrated circuits thereon, includes immersing a substrate, under bias, into a copper plating solution to eliminate thin seed layer dissolution and reduce copper oxide, an initiation step to repair discontinuities in a copper seed layer, superfill plating to fill the smallest features, reverse plating to remove the adsorbed plating additives and their by-products from the substrate, a second superfill plating to fill intermediate size features, a second reverse plating to remove adsorbed plating additives and their by-products from the substrate, and a bulk fill plating with high current density to fill large features. The superfill and reverse plating operations may be repeated more than twice prior to bulk filling in order to provide the desired surface morphology.

Abstract: Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumption and pollutant emission, easy operation and low production costs are achieved.

Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.

Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyalkylene glycols (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 10 ppm to about 2000 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.1 ppm to about 1000 ppm of the plating solution. The plating solution may be further improved by adding 2-amino-5-methyl-1,3,4-thiadiazole which is used at concentrations from 0 ppm to about 20 ppm of the plating solution.

Abstract: Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.

Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a twostep process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

Abstract: A smooth layer of a metal is electroplated onto a microrough electrically conducting substrate by immersing the substrate and a counterelectrode in an electroplating bath of the metal to be electroplated and passing a modulated reversing electric current between the electrodes. The current contains pulses that are cathodic with respect to said substrate and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle less than about 50% and said anodic pulses have a duty cycle greater than about 50%, the charge transfer ratio of the cathodic pulses to the anodic pulses is greater than one, and the frequency of said pulses ranges from about 10 Hertz to about 12000 Hertz. The plating bath is substantially devoid of levelers and may be devoid of brighteners.

Abstract: The invention is directed to the use of electrochemical deposition to fabricate thin films of a material (e.g., bismuth) exhibiting a superior magnetoresistive effect. The process in accordance with a preferred embodiment produces a thin film of bismuth with reduced polycrystallinization and allows for the production of single crystalline thin films. Fabrication of a bismuth thin film in accordance with a preferred embodiment of the invention includes deposition of a bismuth layer onto a substrate using electrochemical deposition under relatively constant current density. Preferably, the resulting product is subsequently exposed to an annealing stage for the formation of a single crystal bismuth thin film. The inclusion of these two stages in the process produces a thin film exhibiting superior MR with a simple field dependence in the process suitable for a variety of field sensing applications.

Abstract: To provide a novel casting mold for use in continuous casting, which has long life and excellent heat resistance, yet capable of completely preventing corrosion, which frequently occurs on the lower portion of the casting mold. A continuous casting mold for steel made from copper or a copper alloy, wherein said casting mold comprises a plane in contact with molten steel partly or wholly covered with a tungsten alloy plating containing either or both of nickel and cobalt, and said plating containing tungsten carbide forming a solid solution therewith. To produce the casting mold above, there is used a plating solution containing either or both of a nickel salt and a cobalt salt and a tungstate, together with at least one selected from an oxycarboxylic acid and salts thereof, and at least one type of an organic compound and salts thereof having two or less of carbon atoms within the molecule, provided that its oxidation decomposition potential is lower than that of the oxycarboxylic acid or a salt thereof.

Abstract: An array of selectively addressible microelectrodes for combinatorial synthesis of complex polymers or alloys.

Abstract: An electroplating installation for coating the conducting surface of a part. The installation includes electrodes submerged in a bath. The electrodes rest on a support device that serves as a support and a current supply. The electrodes and the support device form an interface defining a plurality of grooves opening into the bath. The grooves may be formed in the electrodes, in the support device, or in both the electrodes and the support device.

Abstract: An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anodes (1), (2), and (3) are powered by power supplies (13), (12), and (11), respectively. Electrolyte (34) is pumped by pump (33) to pass through filter (32) and reach inlets of liquid mass flow controllers (LMFCs) (21), (22), and (23). Then LMFCs (21), (22) and (23) deliver electrolyte at a set flow rate to sub-plating baths containing anodes (3), (2) and (1), respectively. After flowing through the gap between wafer (31) and the top of the cylindrical walls (101), (103), (105), (107) and (109), electrolyte flows back to tank (36) through spaces between cylindrical walls (100) and (101), (103) and (105), and (107) and (109), respectively.

Abstract: Between a wafer and a holder holding a wafer, a seal member is disposed so that a contact surface is formed in an approximate plane, and an inner periphery surface is formed in an approximate plane and approximately vertical to a contact surface. The seal member, in a sealed state, has a brim portion of a radius of curvature of 0.5 mm or less at a boundary portion between an inner periphery surface of a seal member and a contact surface. Due to a brim portion, a gap between a contact surface of a seal member and a surface being plated of a wafer W can be made smaller, resulting in reducing bubbles entering in a gap.

Abstract: A sliding bearing, which comprises a lining and a bismuth or bismuth-alloy overlay having improved compatibility and fatigue resistance is provided. The overlay is characterized by the following orientation. The relative ratio of the X-ray diffraction intensity I[hkl] of the bismuth or bismuth-alloy overlay defined below satisfies the following conditions (a) and (b): (a) the relative ratio of the X-ray diffraction intensity I[hkl] of planes other than the {012} planes is from 0.2 to 5 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.2I[012]≦I[hkl]≦5I[012] (b) the relative ratio of the X-ray diffraction intensity I[hkl] of three or more planes other than {012} planes ranges from 0.5 to 2 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.5I[012]≦2I[012].

Abstract: An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.

Abstract: The present invention relates to the electrodeposition of transition metal and rare earth alloys from aqueous solutions to form thin films. The present invention which comprises the preparation of suitable mixtures of water soluble compounds containing the desired transition metal (TM) and rare earth (RE) elements, establishing appropriate bath conditions and applying specific current densities across the bath solution to cause a film with the desired properties to be deposited on a target substrate.

Abstract: An electrolyte for use in electrolytic platinum platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2(NO2)2 or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs).

Abstract: The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode.

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, such as magnesium or aluminum minimizes weight and simultaneously improves both electrical and thermal conductivity compared to conventional carbon parts. For service in electrochemical cells these components must be protected from corrosion. This is accomplished by plating the surface of the light weight metal parts with a layer of denser, but more noble metal. The protective metal layer is deposited in one of several ways. One of these is deposition from an aqueous solution by either electroless means, electrolytic means, or a combination of the two. Another is deposition by electrolytic means from a non-aqueous solution, such as a molten salt.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfonic acid electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. An additional significant appearance is to reduce the overall costs of this type of bath with the more economical salts of alkyl and alkanol sulfonic acids. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, tin/lead, tin/lead/copper, tin/zinc and zinc/nickel.