Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

Abstract: The invention discloses a new electrode suitable for use as an anode for oxygen evolution from electrolytes containing fluorides or fluoride-complex anions even in high concentrations.The anode of the invention comprises a titanium substrate provided with a protective interlayer resistant to the aggressive action of fluorides, and an electrocatalytic coating for oxygen evolution.The protective interlayer is made of tungsten, oxides or oxyfluorides, optionally containing metals of the platinum group in minor quantities, metallo-ceramic compounds and intermetallic compounds either per se or as mixed oxides.

Abstract: Salts of aromatic hydroxy compounds are used as brighteners in acidic electroplating baths. Furthermore, acidic electroplating baths for the electrolytic deposition of metallic layers onto shaped articles comprise, as brighteners, at least one novel salt of an aromatic hydroxy compound. Finally, shaped articles are electroplated by a process using the novel acidic electroplating baths.

Abstract: A process for forming adjacent moats or holes in an electrically non-insulating substrate wherein an electrically insulating masking layer is deposited on the substrate. To form two adjacent moats or holes, the masking layer has an opening whose width is chosen so that it extends over a part of the overall width of the two moats or holes to be formed, and whose shape corresponds to the shape of the moats or holes to be formed. The surface of the masked substrate is then subjected to an anodic oxidation, with the oxidation voltage chosen to be so high that two adjacent moats or holes are formed per opening in the masking layer.

Abstract: A process for enhancing the corrosion resistance of an aluminum-containing component with a cerium based coating. An aluminum-containing cathode and an oxygen-evolving anode are immersed in an electrolyte comprising water, solvent, oxidizing agent and cerium ions. An electrical current is passed through the electrolyte by applying electrical current to deposit a cerium based coating onto the cathode. An electrolyte for use in depositing a cerium based coating. An electrodeposited cerium-based coating. An aluminum aircraft structural component having a cerium-based coating thereon.

Abstract: An iron immersion composition of matter is disclosed comprising a compound having a divalent or trivalent iron ion, a compound having a fluoride ion, and a compound having an acid hydrogen ion. A process for treating an aluminum substrate to improve the adhesion of metal layers to the substrate is also disclosed comprising contacting the substrate with the acidic iron immersion composition to produce an iron immersion coating on the alloy, and contacting the iron immersion coating with an etchant to substantially remove the coating and produce a microporous surface on the substrate.

Abstract: A method for electroplating a silicon substrate in manufacturing a semiconductive device is provided. Electroplating process chamber contacts or fingers used in positioning a silicon substrate or wafer during an electroplating process are plated with a metal layer to prevent oxidation of the contacts. Oxidation of the contacts may result in increased and varying resistance of the contacts and thus nonuniform plating of the silicon wafer and possibly even deplating of a seed layer. A 20 mA/cm.sup.2 current is applied to the contacts which are immersed in an electrolyte solution before loading a silicon wafer. A silicon wafer is then loaded into the electroplating process chamber containing the electrolyte solution. The preplating of the contacts enables the formation of a uniform metal layer on the silicon substrate. Additionally, voltage then may be applied to the contacts after unloading the silicon wafer to reduce oxidation.

Abstract: An article is coated with a multilayer coating comprising a semi-bright nickel layer deposited on the surface of the article, a bright nickel layer deposited on the bright nickel layer, a palladium strike layer deposited on the semi-bright nickel layer, a ruthenium layer deposited on the palladium strike layer, a refractory metal, preferably zirconium, strike layer deposited on the ruthenium layer, and a refractory metal compound, preferably zirconium nitride, deposited on the refractory metal strike layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.

Abstract: An existing, usually used radial lead anode in an electroplating cell is machined to a specific radius. This provides a curved, machined surface for the lead anode to serve as a support structure. A thin gauge, dimensionally stable sheet anode of a multitude of side-by-side strip anodes is formed, with each strip anode being typically formed to a larger radius then the radius of the support structure. The sheet anode strips may be precurved into a series of chords. The strip anodes are flexed into place onto the surface of the lead support structure. Fastening these strips and the support structure together can be accomplished by a series of fastening means attached to the back of each strip anode, which means can project into or through holes in the lead support structure. Electrical connection can be provided, such as through the fastening means, with the lead support structure serving as a current distributor member.

Abstract: An electrolytic conversion solution for metal surface treatment comprises (A) a vanadate or a vanadium salt of an inorganic acid and (B) an organic acid having a reducing ability, and has a pH of not less than 7. The electrolytic conversion solution can be employed in a method for electrolytic conversion treatment which comprises the steps of immersing a subject to be treated in the treating solution and then cathodically electrolyzing the subject in the solution. The electrolytic conversion solution is free of any chromate compound and permits the formation of uniform corrosion-resistant film on the surfaces of various kinds of metallic materials without impairing the working environment and causing any environmental pollution.

Abstract: The present invention relates to an electrode preferably an insoluble electrode for an electrolytic cell. The electrode is located within an enclosure defining a chamber, a wall of said enclosure being formed by a membrane allowing ions to pass therethrough. The enclosure has an opening for feeding electrolyte, an opening for evacuating electrolyte and means conducting the upward current of electrolyte with a velocity in the vicinity of the electrode of at least 0.01 m/s. The invention relates also to plants and processes using such electrode for the plating or deplating of metal strips.

Abstract: A process is recited for plating elongated current collectors with indium. The current collectors have particular utility in alkaline electrochemical cells, particularly zinc/manganese dioxide alkaline cells containing "zero-added" mercury. The process of the invention involves electroplating conductive wire with indium and then drawing the plated wire to a lesser diameter. The drawn plated wire may then be cut to the desired lengths, typically in the shape of a nail, for use as current collectors within the alkaline cell.

Abstract: A composite plating coating includes a metal plating coating which is dispersed with an antibacterial and antifungal composition and/or a fragrant composition. Particularly, by dispersing carriers absorbed with an antibacterial and antifungal composition and a fragrant composition in a metal plating coating, a composite plating coating with an antibacterial and antifungal effect and a fragrance effect can be obtained.

Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.

Abstract: A process is provided for the recovery of bismuth from an ion exchange eluent solution consisting of at least 50% sulfuric acid maintained at a temperature of 95.degree.-100.degree. C. The process comprises the step of electrowinning bismuth from the sulfuric acid solution in an electrochemical cell at a current density up to 30 A/m.sup.2 using an insoluble anode and a cathode that is impervious to the highly corrosive environment of hot sulfuric acid, for a time interval such as to reduce the bismuth content of the solution down to about 3-5 g/L.

Abstract: A novel method for making metals and homogeneous metal alloys comprises the steps of (a) providing a polymetallic complex of the general formula(.mu..sub.4 -0)L.sub.4 M'M"M'"M""X.sub.nwherein L is a ligand selected from the group consisting of organic and inorganic ligands, wherein M', M", M'", and M"" are metal atoms two or more of which may be the same, wherein X is a halogen atom, and wherein n is an integer ranging from 4 to 6; and (b) electrochemically depositing at least one of the metals from said polymetallic complex.

Abstract: Acid, electroplating baths having consistent leveler activity contain levelers which are quaternized near-monodisperse polymers of acrylic or methacrylic trialkyl amine esters. The polymers may contain hydroxyalkyl acrylate or methacrylate ester components, unquaternized acrylic or methacrylic amine component as well as other polymeric components.