Abstract: The present invention provides an apparatus for adding or subtracting an amount charge to or from a charge packet in a CCD as the packet traverses the CCD. The apparatus uses a “wire transfer” device structure to perform the addition or subtraction of charge during the charge packets traversal across the device. A pair of electrically interconnected diffusions are incorporated within the charge couple path to provide an amount of charge which can be added or subtracted from packets as the packets traverse the CCD.

Abstract: Apparatus including a support body; an organic semiconductor composition body on the support body, —and a first body including a hydrogenated vinylaromatic-diene block copolymer on the organic semiconductor composition body. Apparatus including a support body, —a first body including a hydrogenated vinylaromatic-diene block copolymer on the support body; and an organic semiconductor composition body on the first body. Techniques for making an apparatus.

Abstract: A method of fabricating a pixel cell having a shutter gate structure. First and second charge barriers are respectively created between a photodiode and a first charge storage region and between the first storage region and a floating diffusion region. A global shutter gate is formed to control the charge barrier and transfer charges from the photodiode to the first charge storage region by effectively lowering the first charge barrier. A transfer transistor acts to transfer charges from the first storage region to the floating diffusion region by reducing the second charge barrier.

Abstract: A demodulation device (1) in semiconductor technology is disclosed. The device (1) is capable of demodulating an injected modulated current. The device (1) comprises an input node (IN1), a sampling stage (DG1, IG1, GS1, IG2, DG2) and at least two output nodes (D1, D2). The sampling stage DG1, IG1, GS1, IG2, DG2) comprises transfer means (GL, GM, GR) for transferring a modulated charge-current signal from the input node (IN1) to one of the output nodes (D1, D2) allocated to the respective time interval within the modulation period. The small size and the ability to reproduce the device (1) in standard semiconductor technologies make possible a cost-efficient integration of the device (1).

Abstract: A pixel circuit, and method of forming a pixel circuit, an imager device, and a processing system include a photo-conversion device, a floating diffusion region for receiving and storing charge from the photo-conversion device, and a transparent transistor for use in operation of the pixel, wherein the transparent transistor is at least partially over the photo-conversion device, such that the photo-conversion device receives light passing through the transparent transistor.

Abstract: A charge coupled device having a plurality of non-adjacent first gate electrode pairs; a plurality of second gate electrode pairs placed in every second space between the first gate electrode pairs; a plurality of third gate electrode pairs placed in the spaces between the first gate electrode pairs not occupied by the second gate electrode pairs; wherein, in a full resolution mode, the first gate electrode pairs are clocked substantially 180 degrees out of phase with respect to the second and third gate electrode pairs and the second and third gate electrode pairs are clocked substantially equally; and wherein, in a half resolution, double speed mode, the second and third gate electrode pairs are clocked substantially 180 degrees out of phase with respect to each other and substantially 50% duty cycle and the first gate electrode pairs are clocked with 25% or less duty cycle and 90 degrees out of phase with respect to the second gate electrode pairs.

Abstract: A pixel cell comprises a photo-conversion device for generating charge and a gate controlled charge storage region for storing photo-generated charge under control of a control gate. The charge storage region can be a single CCD stage having a buried channel to obtain efficient charge transfer and low charge loss. The charge storage region is adjacent to a gate of a transistor. The transistor gate is adjacent to the photo-conversion device and, in conjunction with the control gate, transfers photo-generated charge from the photo-conversion device to the charge storage region.

Abstract: A molecular single electron transistor (MSET) detector device (14) is described that comprises at least one organic molecule (87) connecting a drain electrode (84) and a source electrode (82). In use, said at least one organic molecule (87) provides a quantum confinement region. At least one analyte receptor site (90, 92) is provided in the vicinity of said at least one organic molecule (87) that bind molecules of interest (analytes). A fluid analyser (2) is also described that includes the MSET detector, a pre-concentrator (4) and a fluid gating structure (6). The fluid gating structure (6) is arranged to selectively route fluid from the pre-concentrator (4) to either one of the detector (14) and an exhaust port (12). The pre-concentrator (4), fluid gating structure (6) and detector (14) are each formed as substantially planar layers and arranged in a stack or cube.

Abstract: An HCCD includes a channel 21 that transfers electric charges in an X direction, a channel 25 that transfers the electric charges in a Z1 direction, a channel 23 that transfers the electric charges in a Z2 direction, and a channel 22 that connects the channels 23, 25 to the channel 21. The following relation is satisfied in impurity concentration of the channels: channel 21 channel 22 channel 23, 25. A fixed DC voltage is applied to branch electrodes 12a, 12b above the channel 22. The channel 22 has protrusion portions 19 that protrude inward from an outer circumference, which connects T1 and T2, and an outer circumference, which connects T3 and T4. The protrusion portions 19 causes charges below the transfer electrode 11b to move near the center of the channel 22 in a Y direction. Thereby, the travel distance of the charges in the channel 22 is reduced.

Abstract: A charge coupled device comprises a semiconductor substrate of one conductive type, a first charge couple device having a series of electrodes linearly arranged on the semiconductor substrate, a second charge coupled device diverged into tow lines at an end of the first charge coupled device, detectors, each of which detects a signal transferred by one of two lines of the diverged second charge coupled device, and output devices, each of which outputs the signal detected by one of the detectors, wherein a plane shape of a last electrode of the first charge coupled device connecting to the diverged second charge coupled device is a shape wherein a length of a transfer channel of the last electrode becomes shorter as going far from a right angled direction of a transfer direction of the first charge coupled device starting from a boundary part of divergence of the diverged second charge coupled device.

Abstract: A solid state imaging apparatus comprises a semiconductor substrate, photoelectric conversion elements, a vertical electric charge transferring device, a horizontal electric charge transferring device that temporarily stores the signal electric charges transferred from the vertical electric charge transferring device and transfers the signal electric charges to a horizontal direction in a sequential order, wherein the horizontal electric charge transferring device comprises at least two lines of horizontal shift registers and an electrode structure with which one-- shift register can transfer the signal electric charges to a direction that is 180 degrees different from another shift register and also can transfer the signal electric charges to a same direction as the another shift register continuously with the other shift register by changing driving of at least one of the shift registers, and output detecting devices.

Abstract: An ADC implementation of a bucket brigade type charge transfer pipeline using Metal Oxide Semiconductor (MOS) Bucket Brigade Devices (BBDs) that can be used in Analog-to-Digital (A/D) converters and other applications. In one embodiment a control circuit provides independent control of charge storage and charge transfer timing. Other arrangements provide high-speed and high-accuracy (A/D) conversion by employing a “boosted” charge-transfer circuit. The implementation can also achieve lower power consumption and improved resolution compared to other charge-domain methods by the use of a tapered pipeline, in which the amount of charge being processed is reduced in later pipeline stages compared to earlier ones. Still other embodiments enable implementing more than one decision threshold per stage, to support multi-bit resolution per stage and RSD-type A/D conversion algorithms.

Abstract: A solid image capturing element comprising a plurality of vertical shift registers arranged to each correspond to a column of a plurality of light receiving pixels in a matrix arrangement, a horizontal shift register provided on an output side of the plurality of vertical shift registers, and an output section provided on an output side of the horizontal shift register. In this solid image capturing element, a reverse conductive semiconductor region is formed over one major surface of one conductive semiconductor substrate, the plurality of light receiving pixels, the plurality of vertical shift registers, the horizontal shift register, and the output section are formed in the semiconductor region, and a portion of the semiconductor region where the output section is formed has a higher dopant concentration than the portion of the semiconductor region where the horizontal shift register is formed.

Abstract: A nitride semiconductor device includes: a conductive substrate; a first semiconductor layer provided on the substrate; a second semiconductor layer provided on the first semiconductor layer; a third semiconductor layer on the second semiconductor layer; a first main electrode connected to the third semiconductor layer; a second main electrode connected to the third semiconductor layer; and a control electrode provided on the third semiconductor layer. The first semiconductor layer is made of AlXGa1?XN (0?X?1) of a first conductivity type. The second semiconductor layer is made of a first nitride semiconductor. The third semiconductor layer is made of a second nitride semiconductor which is undoped or of n-type and has a wider bandgap than the first nitride semiconductor.

Abstract: A solid-state image pickup device for preventing crosstalk between adjacent pixels by providing an overflow barrier at the deep potion of a substrate. A partial P type region is provided at the predetermined position of a lower layer region of the vertical transfer register and a channel stop region. This P type region adjusts potential in the lower layer region of the vertical transfer register and the channel stop region. Accordingly, since the potential in the lower layer region of the vertical transfer register and the channel stop region at both sides of the lower layer region is low, electric charges photoelectrically-converted by the sensor region are blocked by this potential barrier and cannot be diffused easily.

Abstract: CMOS image sensor devices are provided, wherein active pixel sensors are designed with non-planar transistors having vertical gate electrodes and channels, which minimize the effects of image lag and dark current.

Abstract: A solid-state imaging device includes an N-type semiconductor substrate, an N-type impurity region provided in the surficial portion of the N-type semiconductor substrate, a photo-electric conversion unit formed in the N-type impurity region, a charge accumulation unit formed in the N-type impurity region so as to contact with the photo-electric conversion unit, and temporarily accumulating charge generated in the photo-electric conversion unit, a charge hold region (barrier unit) formed in the N-type impurity region so as to contact with the charge accumulation unit, and allowing the charge accumulation unit to accumulate the charge, and a charge accumulating electrode provided to the charge accumulation unit. The charge accumulation unit and the charge hold region are formed to be N?-type.

Abstract: A trench isolation having a sidewall and bottom implanted region located within a substrate of a first conductivity type is disclosed. The sidewall and bottom implanted region is formed by an angled implant, a 90 degree implant, or a combination of an angled implant and a 90 degree implant, of dopants of the first conductivity type. The sidewall and bottom implanted region located adjacent the trench isolation reduces surface leakage and dark current.

Abstract: A solid-state imaging device for enlarging an operating margin of a pixel portion and achieving complete transfer of a signal charge by using a plurality of power supply voltages, wherein a plurality of power supplies having different power supply voltage values are supplied to portions of a semiconductor chip 1.

Abstract: An integrated circuit device includes a CMOS image sensor and a MIM capacitor therein. The CMOS image sensor includes a transfer gate electrode on a semiconductor substrate and a P-N junction photodiode within the semiconductor substrate. The photodiode is located adjacent a first side of the transfer gate electrode. A floating diffusion region is also provided within the semiconductor substrate. This floating diffusion region is located adjacent a second side of the transfer gate electrode. An interlayer insulating layer is provided on the semiconductor substrate. The interlayer insulating layer extends opposite the transfer gate electrode, the P-N junction photodiode and the floating diffusion region. An optical shielding layer of a first material is provided on the interlayer insulating layer. The optical shielding layer has a single opening therein, which extends opposite the P-N junction photodiode. This single opening inhibits optical crosstalk between adjacent unit cells within the sensor.

Abstract: An optical waveguide structure includes an air-via region that receives an optical signal from an optical source. A photonic crystal cladding region is formed on the surface of the air-via region. The photonic crystal cladding region confines the optical signal within the air-via region and propagates the optical signal along the axial direction while ensuring near complete transmission of the optical signal.

Abstract: The invention proposes an image sensor comprising a picture capture matrix having N rows and K columns of image dots, a read register at the free end of the K columns. In order to improve the read speed of the matrix, the invention proposes that the horizontal transfer into the read register be continued even while the vertical signals for shifting from one row to the other are operative, without however continuing the horizontal transfer while the transfer gate between columns and horizontal register is open. The unloading time of the horizontal read register therefore overlaps the time reserved for each vertical transfer step, instead of these times being added together. The gain in time, being repeated for each row, will be all the more significant the higher the number of rows. Means are provided for limiting the effect of the column transfer switching operations on the reading of the charges at the output of the read register.

Abstract: A charge transfer device 1 has an P-type region, an N-type well provided to the surficial portion of the P-type region, and transfer electrodes having P-type conductivity, provided over the N-type substrate while placing an insulating film in between.

Abstract: A CCD containing circuit and method for making the same. The circuit includes a CCD array and a protection circuit. The CCD array is constructed on an integrated circuit substrate and includes a plurality of gate electrodes that are insulated from the substrate by an insulating layer. The gate electrodes are connected to a conductor bonded to the substrate. The protection circuit is also constructed on the substrate. The protection circuit is connected to the conductor and to the substrate and protects the CCD array from both negative and positive voltage swings generated by electrostatic discharge events and the like. The protection circuit and the CCD can be constructed in the same integrated circuit fabrication process.

Abstract: In the solid-state imaging device of the present invention having a photoelectric conversion section and a charge transfer section equipped with a charge transfer electrode for transferring an electric charge generated in the photoelectric conversion section, the charge transfer electrode has an alternate arrangement of a first layer electrode including a first layer electrically conducting film and a second layer electrode including a second layer electrically conducting film, which are formed on a gate oxide film including a laminate film consisting of a silicon oxide film and a metal oxide thin film, and the first layer electrode and the second layer electrode are separated by insulation with an interelectrode insulating film including a sidewall insulating film formed by a CVD process to cover the lateral wall of the first layer electrode.

Abstract: A method of driving a solid-state image sensing device comprises plural photoelectric conversion devices arranged in rows and columns perpendicular to the rows, VCCDs through which charges generated by the photoelectric conversion devices are transferred in the column direction, and an HCCD through which the charges transferred from the VCCDs are transferred in the row direction. The photoelectric conversion devices include plural photoelectric conversion device rows including the photoelectric conversion devices arranged in the rows include first photoelectric conversion device rows each of which different kinds of photoelectric conversion devices are mixed and second photoelectric conversion device rows each of which has one kind of photoelectric conversion devices.

Abstract: Provided are methods for producing multiple distinct transistors from a single semiconductor layer, and apparatus incorporating transistors so produced.

Abstract: A solid state image pickup device includes: a first area defined on a principal surface of a semiconductor substrate; a second area defined in an area adjacent to the first area along a first direction; and a third area defined in an area adjacent to the second area along the first direction, wherein the first area includes: a plurality of photoelectric conversion elements; and a plurality of vertical transfer channels formed adjacent to the plurality of photoelectric conversion elements; the second area includes: a horizontal transfer channel; and a floating diffusion region and a first stage drive FET of an amplifier; and the third area includes: a first state load FET, a second stage drive FET, a second stage load FET, a third stage drive FET and a third stage load FET, respectively of the amplifier. The solid state image pickup device can be made compact.

Abstract: A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.

Abstract: Shift register electrodes are formed in an imaging area and a peripheral area through use of a single layer of conductive film, and a thick insulating film is deposited over those electrodes and planarized. The thick insulating film overlying the shift register electrodes in the peripheral area is kept as it is and on the other hand, the thick insulating film overlying the shift register electrodes is etched to just fill gaps between the shift register electrodes with the film, thereby allowing a light shielding metal layer overlying the shift register electrodes in the peripheral area and insulating films sandwiched therebetween to be formed without discontinuity. Since metal interconnect lines in the peripheral area have a thick and planarized insulating film formed thereunder, parasitic capacitance between diffusion layers/electrodes and the metal interconnect lines can be reduced, leading to reduction in power consumption of image sensor.

Abstract: A charge splitter for separating an incoming charge packet into two outgoing packets while the charge is in a static state, i.e., not while it is flowing down a channel or over a barrier. A splitting gate may have a biasing charge impressed upon it, such as via the application of voltage or current sources to opposite ends thereof, applying a bias to a semiconductor body portion of the gate structure, or by physically separate the splitting gate into multiple sections that each have different applied voltages or currents When discharge barrier gates are operated, different amounts of charge will thus flow to different output storage gates.

Abstract: A solid-state image sensing device that is free of kTC noise, can eliminate black smear and dark current, has a larger numerical aperture, and can eliminate the problem of insufficient area of the light-receiving portion. Photodiode PD is formed as the light-receiving portion in the formation region of first semiconductor region 15. Light is received by semiconductor layer 14 in this region, and the generated signal charge is accumulated. Semiconductor layer 12, 14, gate electrode for pixel selection 13a, first semiconductor region 15, second semiconductor region 16, third semiconductor region 17, etc., form transistor Tr1 for pixel selection. The threshold of junction transistor JT1, composed of semiconductor substrate 10, semiconductor layer 14, and second semiconductor region 16, etc., is modulated by means of the signal charge accumulated in semiconductor layer 14 in the light-receiving portion. When transistor Tr1 for pixel selection is ON, a voltage modulated according to the signal charge is output.

Abstract: An imager apparatus and associated starting material are provided. In one embodiment, an imager is provided including a silicon layer of a first conductivity type acting as a junction anode. Such silicon layer is adapted to convert light to photoelectrons. Also included is a semiconductor well of a second conductivity type formed in the silicon layer for acting as a junction cathode. Still yet, a barrier is formed adjacent to the semiconductor well. In another embodiment, a starting material is provided including a first silicon layer and an oxide layer disposed adjacent to the first silocon layer. Also included is a second silicon layer disposed adjacent to the oxide layer opposite the first silicon layer. Such second silicon layer is further equipped with an associated passivation layer and/or barrier.

Abstract: A CMOS image sensor and a method for fabricating the same is disclosed, to decrease a darkcurrent generated in the boundary between a diffusion area of a photodiode and a device isolation layer, which includes a first conductive type semiconductor substrate having an active area and a device isolation area, the active area including a photodiode and a transistor; a device isolation layer formed in the device isolation area of the semiconductor substrate; a second conductive type diffusion area formed in the photodiode of the semiconductor substrate at a predetermined interval from the device isolation layer; a gate insulating layer and a gate electrode formed in the transistor of the semiconductor substrate; and a first conductive type first diffusion area formed in the semiconductor substrate of the boundary between the second conductive type diffusion area and the device isolation layer.

Abstract: A solid-state imaging element converts light intensity into an electric charge signal and stores the thus-converted electric charge signal through use of a plurality of photoelectric conversion elements arranged in a square lattice pattern on the surface of a semiconductor substrate in a row direction and a column direction. Vertical transfer sections transfer the electric charges from the first and second photoelectric conversion elements in the column direction. The vertical transfer section comprises a first electric charge reading region for reading electric charge from the first photoelectric conversion element to a vertical transfer channel; and a second electric charge reading region for reading electric charge from the second photoelectric conversion element. The first and second electric charge reading regions are provided at positions corresponding to a vertical transfer electrode, which are activated in difference phases.

Abstract: The present invention provides an apparatus for adding or subtracting an amount charge to or from a charge packet in a CCD as the packet traverses the CCD. The apparatus uses a “wire transfer” device structure to perform the addition or subtraction of charge during the charge packets traversal across the device. A pair of electrically interconnected diffusions are incorporated within the charge couple path to provide an amount of charge which can be added or subtracted from packets as the packets traverse the CCD.

Abstract: In a semiconductor device an electric field is controlled in direction or angle relative to a gate, or a channel to adjust a gain coefficient of a transistor. In some embodiments, there are provided a first gate forming a channel region in a rectangle or a parallelogram, and a second gate forming a channel region substantially containing a triangle between the channel region formed by the first gate and each of a source region and a drain region. In some embodiments, there is included a channel region formed by the first gate that is sandwiched by the channel region formed by the second gate, all the channel regions together substantially forming a rectangle or a parallelogram. As such, a semiconductor device allowing a gain coefficient ? of an MOS transistor to be modulated by voltage in an analog manner can readily be produced by conventional processing technology and incorporated into any conventional LSIs configured by a CMOS circuit.

Abstract: A charge transfer device whose output end is electrically connected to a charge detector circuit is driven by negative pulse voltage trains to reduce power consumption of the charge detector circuit.

Abstract: A micromechanical structure and device and methods of forming and using the structure and device are disclosed. The structure includes an ion conductor and a plurality of electrodes. Mechanical properties of the structure are altered by applying a bias across the electrodes. Such structures can be used to form device such as actuators and air-gap devices.

Abstract: The organic photoelectric conversion element according to the invention has enhanced the light-absorbing property by incorporating two or more kinds of electron donating organic materials 4a and 4b in the photoelectric conversion region 14. With such measure, it has become possible to efficiently absorb the incident light and enhance the photoelectric conversion characteristic. In addition, a light-to-light conversion material 7 is incorporated in the photoelectric conversion region, too. With this measure, even the light of such a wavelength that an electron donating organic material cannot inherently absorb comes to be absorbed since the light-to-light conversion material 7 converts the wavelength, thus enabling the light to be utilized for carrier generation. Accordingly, an organic photoelectric conversion element with a high conversion efficiency can be obtained.

Abstract: The present invention is made to provide a fixing structure for solid state image forming device made inexpensively and easily by simple caulking adhering method with keeping high positional accuracy, by which it is achieved that the solid state image forming device can be separated easily from the image focusing lens holding member when the image focusing lens holding member has a defect. In the fixing structure of present invention, an image focusing lens holding member 3 and an intermediate holding member 6 are adhered by caulking adhering method.

Abstract: A compact semiconductor device having a contact hole that improves stability of electric connection between a wire and an electrode. The semiconductor device includes an insulation layer formed on a semiconductor substrate, first electrodes formed on the insulation layer and spaced from one another by an interval, an insulation film covering the first electrodes, and spaced second electrodes formed on the insulation film. Each second electrode includes an intermediate portion filling the space between two adjacent first electrodes, two edge portions respectively laid above the two adjacent first electrodes in an overlapping manner, and an upper surface connected to a wire by a contact. Thickness, t1, of the insulation film, thickness, t2, of each edge portion of the second electrode, and interval, S, between the first electrodes are adjusted to satisfy the expression of S<(2t1+2t2).

Abstract: A first p+-type region on a surface of a photodiode unit is formed over a region from a surface of the photodiode unit through a surface of a signal charge read-out unit until reaching the charge transfer unit. Also, the following structure is adapted: the structure in which a boundary between the first p+-type region and a p++-type region is not on a same plane with a boundary of an n-type impurity region which forms the photodiode unit on a side of the signal charge read-out unit. Further, a second p+-type region is formed between the first p+-type region and the p++-type region on the surface of the photodiode unit. The second p+-type region has an impurity concentration between the impurity concentrations of the first p+-type region and the p++-type region.

Abstract: In the present invention, a charge transfer unit is arranged on a first-plane side of a thinly-formed semiconductor base. Charge accumulating units are arranged on a second-plane side, the opposite side. A depletion prevention layer is arranged closer to the second-plane side than the charge accumulating units. The depletion prevention layer prevents a depletion region around the charge accumulating units from reaching the second plane of the semiconductor base. The depletion prevention layer can suppress surface dark current going into the charge accumulating units. Meanwhile, an energy ray incident from the second-plane side pass through the depletion prevention layer to generate signal charges in the charge accumulating units (depletion regions). The charge accumulating units collect, on a pixel-by-pixel basis, the signal charges which are to be transported to the charge transfer unit under voltage control or the like, and then are read to exterior as image signals.

Abstract: A pixel cell comprises a photo-conversion device for generating charge and a gate controlled charge storage region for storing photo-generated charge under control of a control gate. The charge storage region can be a single CCD stage having a buried channel to obtain efficient charge transfer and low charge loss. The charge storage region is adjacent to a gate of a transistor. The transistor gate is adjacent to the photo-conversion device and, in conjunction with the control gate, transfers photo-generated charge from the photo-conversion device to the charge storage region.

Abstract: A charge-coupled device imager including an array of super pixels disposed in a semiconductor substrate having a surface that is accessible to incident illumination. For each super pixel there is provided a plurality of subpixels which each correspond to one in the sequence of image frames. Each subpixel includes a doped photogenerated charge collection channel region opposite the illumination-accessible substrate surface, a charge collection channel region control electrode, doped charge drain regions adjacent to the channel region, a charge drain region control electrode, and a doped charge collection control region. To each subpixel are provided channel region and drain region control voltage connections, for independent collection and storage of photogenerated charge from the substrate at the charge collection channel region of a selected subpixel during one in the sequence of image frames and for drainage of photogenerated charge from the substrate to a drain region.

Abstract: In an X-Y address imaging device having an electronic shutter function, a vertical driving section includes a vertical scanning circuit and a vertical shutter scanning circuit. A horizontal driving section includes a horizontal scanning circuit and a horizontal shutter scanning circuit. The horizontal shutter scanning circuit selects, on a pixel basis, a pixel for which to perform a shutter operation from the pixels of a read pixel row selected by the vertical scanning section. After a lapse of an exposure time that is an integral multiple of a one-pixel selection period, a signal of the selected pixel is read out by scanning by the horizontal scanning circuit. This realizes an electronic shutter that enables not only an exposure time that is an integral multiple of 1H but also an exposure time having a time shorter than 1H as a unit.

Abstract: A semiconductor device includes a transfer channel for transferring charge generated by photoelectric conversion, an insulating film formed on the transfer channel, and a transfer electrode for applying a transfer voltage to the transfer channel via the insulating film. The insulating film has the first thickness and a second thickness that is thinner than the first thickness. The insulating film has the first thickness below both ends of the transfer electrode in a width direction of the transfer channel that is orthogonal to a charge transfer direction through the transfer channel, and the insulating film has the second thickness on a part including a center of the transfer channel in the width direction.

Abstract: The present invention provides a solid-state image pickup apparatus which is able to easily discharge signal charges in a signal accumulating section and which is free from reduction in the dynamic range of the element, thermal noise in a dark state, an image-lag and so forth even if the pixel size of the MOS solid-state image pickup apparatus is reduced, the voltage of a reading gate is lowered and the concentration in the well is raised. The solid-state image pickup apparatus according to the present invention incorporates a p-type silicon substrate having a surface on which a p+ diffusion layer for constituting a photoelectric conversion region and a drain of a reading MOS field effect transistor are formed. A signal accumulating section formed by an n-type diffusion layer is formed below the p+ diffusion layer. A gate electrode of the MOS field effect transistor is, on the surface of the substrate, formed between the p+ diffusion layer and the drain.

Abstract: A camera includes a charge-coupled device having a substrate or well of a first conductivity type; a buried channel of a second conductivity type; a dielectric disposed on the substrate; six gates disposed on the dielectric that are space oriented sequentially 1 through 6 in which six gates, in a first mode, receives signals in which alternating gates receive substantially complimentary clock cycles, and in a second mode the gates receive signals in which gates 1 and 4 receive complimentary clock cycles and gates 2 and 5 are approximately held at a first constant voltage and gates 3 and 6 are approximately held at a second constant voltage.