Abstract: Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: A method for protecting a work piece for use in abrasive environments with hardbanding is provided. The layer is deposited onto at least a portion of the work piece to be protected. The deposited layer exhibits a hardness of at least 50 Rc, a wear rate of less than 0.5 grams of mass loss as measured according to ASTM G65-04, Procedure A, a wear rate on a contacting secondary body comprising carbon steel of less than 0.005 grams as measured according to modified ASTM G77 wear test. The deposited alloy forms an iron matrix comprising embedded hard particles in an amount of less than 15 vol. %. The embedded hard particles have an average particle size of ranging from 100 nm to 5 ?m. In one embodiment, the deposition is via welding.

Abstract: The invention relates to a method for joining objects made of metal, plastic, hybrid structures or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles as heat is being applied to the joint.

Abstract: A method of creating a watertightness barrier for a wall of a watertightened thermally insulating tank, involves steps of: arranging a repeating structure including alternately a strip of sheet metal and an elongate welding flange connected to the support surface, so that the turned-up lateral edges of the strip of sheet metal are positioned against the adjacent welding flanges, welding the turned-up lateral edge to the welding flange using a straight welded seam along a first longitudinal portion, continuing the straight welded seam with an end portion which is deviated in the direction of an upper edge corner, and producing a watertight edge corner welded seam along a second longitudinal portion of the strip of sheet metal such that the edge corner welded seam watertightly meets the end portion of the welded seam.

Abstract: A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.

Abstract: The present invention is directed to a method for forming a metal mask. The method includes mounting a metal frame to a periphery of a supporting structure of a worktable, next placing a thin metal plate in a flat manner on a top surface constructed by the metal frame and the supporting structure, next forming a prototype mask by welding the thin metal plate with the metal frame, next forming multiple mesh holes in the thin metal plate by performing a laser drilling process to the prototype mask using a laser drilling apparatus.

Abstract: A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.

Abstract: A method of manufacturing a vehicle cross-member assembly includes: adding adhesive to an adhesive reservoir in an interconnecting member composed of a first material; overlapping a first rail composed of a second material with the interconnecting member; and welding the interconnecting member to a second rail in a position perpendicular with respect to the second rail. The second rail is composed of a different material than the first rail.

Abstract: A method for connecting a semiconductor chip to a metal layer of a carrier substrate is disclosed. A semiconductor chip is provided which has a first side, a second side opposite the first side, a glass substrate bonded to the second side of the semiconductor chip and including at least one opening leaving an area of the second side of the semiconductor chip uncovered by the glass substrate, and a metallisation region arranged in the opening of the glass substrate and electrically contacting the second side of the semiconductor chip. The semiconductor chip with the bonded glass substrate is brought onto a metal layer of a carrier substrate. A firm mechanical and electrical connection is formed between the metal layer of the carrier substrate and the metallisation region.

Abstract: Electric miniature motor comprises bearings; stationary assemblies having end faces; metallic configurations for seating the bearings are formed at the end faces of the stationary assemblies; and at least one of the bearings is a roller bearing wherein an inner ring of the roller bearing is connected by at least one welded joint to a shaft of the motor.

Abstract: Provided in one embodiment is a method of forming an inorganic nanowire, comprising: providing an elongated organic scaffold; providing a plurality of inorganic nanoparticles attached to the organic scaffold along a length of the organic scaffold; and fusing the nanoparticles attached to the organic scaffold to form an inorganic nanowire.

Abstract: Some embodiments include a reinforced face of a club head. Other embodiments for related reinforced faces of club heads and related methods are also disclosed.

Abstract: An umbilical for use in the offshore production of hydrocarbons, the umbilical comprising at least one electric cable, the electric cable comprising at least one electric conductor (18), and at least one electric conductor (18) comprising plurality of electric strands having interstices (15), wherein the interstices are filled with a metal-based material. In this way, there is provided an umbilical with a ‘void-free1 or completely gap-filled conductor construction which therefore prevents water or gas migration or transport along such a conductor.

Abstract: The invention relates to a starter material for a sintering compound, said starter material comprising first particles of at least one metal having a first coating which is applied to the first particles and consists of an organic material, and second particles which contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the fundamental elemental metal and/or precious metal. The invention is characterized in that the second particles have a core of at least one metal and a second coating which is applied to the core and contains the organic metal compound and/or precious metal oxide. Furthermore, the first coating contains a reducing agent by means of which the organic metal compound and/or the precious metal oxide is/are reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Abstract: The present invention is a vacuum insulated panel (VIP) for increasing the thermal insulation surrounding a structure or volume, and a novel method for manufacturing the VIP. The VIP comprises at least two pieces of thin metal foil welded together adjacent the edges of said metal foil, said thin metal foil material defining the exterior of a sealed and gas evacuated vacuum enclosure; and a vacuum insulation panel core located between said at least two pieces of welded thin metal foil material, said vacuum insulation panel core located inside said sealed and gas evacuated vacuum enclosure.

Abstract: A secondary stave support for a furnace stave with a water pipe having a first portion of the water pipe external to the furnace stave and a second portion of the water pipe also external to a furnace shell wall comprising: a protection pipe having first and second ends, wherein the protection pipe is coaxially disposed about the water pipe with the first end nearest the stave; and a first gas-tight seal, disposed between the first end of the protection pipe and a third portion of the water pipe, prevents gas flow from within the furnace shell wall into an annular space between the protection pipe and the water pipe.

Abstract: The invention relates to a method for positioning two components to be joined to each other along a common joint line. According to the invention, the two components are connected to each other by limited-length tack welds firmly connecting the two components, particularly by way of bonding, to each other. In order to obtain reliable and robust positioning of the components for tacking during the joining process, without requiring extensive production apparatuses, such as is required for the high-precision setting of the focal point of the welding laser relative to the joint line, the tack welds are designed such that they cross the joint line.

Abstract: A full face fabricated euroflange vehicle wheel comprises a full face wheel disc defining an axis and having an outer end and a wheel rim having an outer end joined to the outer end of the wheel disc by at least one weld to produce the full face fabricated euroflange vehicle wheel. The full face fabricated euroflange vehicle wheel includes only a generally radially outwardly extending outer end formed by a combination of at least a portion of two of the outer end of the wheel disc, the outer end of the wheel rim and the at least one weld.

Abstract: A double-walled tube includes: a plurality of double-walled tube forming members, each having an inner tube and an outer tube, connected by welding at welding portions of axis direction end portions thereof; and each of the welding portions of the double-walled tube forming members including a groove having a length in an axis direction set to be equal to or greater than ½ of a width of a weld bead formed by the welding at the welding portion.

Abstract: A damped brake rotor has at least one friction disk connected to a hat portion. At least one cavity in located in the friction disk. An insert is located within the cavity. A braze ring is located within the cavity and radially outward from the insert. A braze located within the cavity and radially outward from the braze ring.

Abstract: The present application relates to a method of manufacturing a heat sink from a plurality of extruded lamellas, each lamella including a base portion having a top surface, a bottom surface, and two side surfaces, each lamella further including a fin portion extending from the top surface of the base portion, wherein the base portion is wider than the fin portion. The method includes aligning the base portions of the plurality of lamellas with the fin portion of each lamella extending in the same direction and the side surfaces of adjacent base portions facing each other; pressing the base portions of adjacent lamellas into contact with each other by applying a force to the side surface of at least one of the base portions; and welding the bottom surfaces of adjacent base portions together. A heat sink and a lamella for use in manufacturing a heat sink are also disclosed.

Abstract: The present invention provides a method and a thermal compression head for flip chip bonding. The thermal compression head includes a main body and a contact portion. The main body has a main body opening. The contact portion has a contact surface and a plurality of openings. The openings communicate with the main body opening. When the contact surface of the contact portion is used to adsorb a chip, the contact surface of the chip has a plurality of adsorbed zones corresponding to the contact surface openings. After the chip is bonded to a substrate, the protrusions of the adsorbed zones are relatively slight. Therefore, the interconnection between the chip and the substrate is ensured.

Abstract: The invention relates to a steel plate, the chemical composition of which comprises, the contents being expressed by weight: 0.010%?C?0.20%, 0.06%?Mn?3%, Si?1.5%, 0.005%?Al?1.5%, S?0.030%, P?0.040%, 2.5%?Ti?7.2%, (0.45×Ti)?0.35%?B?(0.45×Ti)+0.70%, and optionally one or more elements chosen from: Ni?1%, Mo?1%, Cr?3%, Nb?0.1%, V?0.1%, the balance of the composition consisting of iron and inevitable impurities resulting from the smelting.

Abstract: The invention relates to a combination of an electrical heating element and a heat dissipater to be heated thereby; the heating element comprises a substrate, an insulating layer located on the substrate and a thick film conductor located on the insulating layer, wherein the second side of the metallic substrate is in contact with the heat dissipater, comprising a layer of metallic material on its face towards the heater and wherein the substrate is brazed to the heat dissipater and the surface of the heating element over which the thick film conductor extends, is substantially equal to the surface of the heat dissipater. The brazing leads to a permanent contact between the heating element and the heat dissipater, so that the possible tendency for warping as caused by the heating and cooling cycles will be withstood.

Abstract: A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste including a precious metal powder and an organic solvent, in which the precious metal powder has a purity of 99.9 mass % or more and an average particle diameter of 0.1 to 0.5 ?m, the organic solvent has a boiling point of 200 to 350° C., and a thixotropy index (TI) value calculated from a measurement value of a viscosity at a shear rate of 4/s with respect to a viscosity at a shear rate of 40/s at 23° C. by means of a rotational viscometer is 6.0 or more.

Abstract: The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio.

Abstract: A co-planar differential pressure sensor module is provided. The module includes a base having a pair of recesses. A pair of pedestals is also provided where each pedestal is disposed in a respective recess and is coupled to a respective isolation diaphragm. A differential pressure sensor has a sensing diaphragm and a pair of pressure sensing ports. Each port of the differential pressure sensor is fluidically coupled to a respective isolation diaphragm by a fill fluid. The module also includes circuitry coupled to the differential pressure sensor to measure an electrical characteristic of the sensor that varies with differential pressure. The base is constructed from a material that is suitable for submersion in seawater. A method of constructing a co-planar differential pressure sensor module is also provided. In another embodiment, a pressure sensor module is provided. The pressure sensor module includes a base having a recess. A pedestal is disposed in the recess and is coupled to an isolation diaphragm.

Abstract: A polyamide composition for surface-mounted components is described. Also described are compositions for surface-mounted components (SMCs) including a semiaromatic polyamide modified by a hydroxyaromatic compound, reinforcing fillers, and a flame retardant. Further, the compositions have many advantages linked to the uses thereof in lead-free reflow soldering processes, in particular a good dimensional stability and a blistering resistance during the use of articles produced from these compositions.

Abstract: An assembly includes a first plate member with a first generally planar abutting surface and a second plate member with a second generally planar abutting surface. The first abutting surface being generally planar and having a plurality of micro reservoirs for storing brazing material. The first abutting surface and the second abutting surface being positioned adjacent each other and being joined by brazing material from the plurality of micro reservoirs.

Abstract: A method of forming a wire includes providing a first wire segment and a second wire segment. The first and second wire segments are inserted into opposite ends of a coupling segment. The coupling segment is laser welded such that the laser creates an indent in the coupling segment that penetrates into at least one of the first and second wire segments.

Abstract: In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.

Abstract: A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.

Abstract: Earth-boring tools comprise a body comprising at least one pocket extending into the body. A first discrete cutting element segment is secured within the at least one pocket. At least another discrete cutting element segment is secured within the at least one pocket. Methods of forming a cutting structure secured to an earth-boring tool comprise disposing at least one discrete cutting element or at least one cutting element segment within a pocket or recess formed in a blade extending longitudinally and radially over a face of a body. At least one discrete wearable element or at least another discrete cutting element segment is disposed within the pocket or recess. The at least one discrete cutting element or at least one discrete cutting element segment and the at least one discrete wearable element or at least another discrete cutting element segment are secured to the blade within the pocket or recess.

Abstract: A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of adjacent input coils together to form one continuous length of rod, the fusing creating fused areas and a heat-affected zone at each fused area. The method also includes the step of treating each of the heat-affected zones to alleviate irregularities induced during fusing. Additionally, the method includes the step of winding the continuous length of rod into a finished coil.

Abstract: A mirror or mirror assembly fabricated by molding, pressing, assembling, or depositing one or more bulk metal glass (BMG), bulk metal glass composite (BMGMC), or amorphous metal (AM) parts and where the optical surface and backing of the mirror can be fabricated without machining or polishing by utilizing the unique molding capabilities of this class of materials.

Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.

Abstract: A first printed circuit board (PCB) assembly can include an embedded electrical connector configured to be mechanically coupled to a corresponding tab-shaped portion of a second PCB assembly, such as to permit insertion of the tab-shaped portion of the second PCB assembly into the embedded electrical connector when the second PCB assembly is aligned in a specified orientation. In an example, the second PCB assembly can include an approximately planar conductive antenna.

Abstract: To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage. Zn layer 21 or Zn alloy layer, Ni layer 22, and Sn layer 23 or Sn alloy layer are formed on a connecting terminal part 10a of a positive electrode composed of Al by plating. Accordingly, this can solder Cu negative electrode, which is composed of metal that is different species from Al, through Sn layer 23 or Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced.

Abstract: A transport tanker and a method of reinforcing a transport tanker are generally provided. The transport tanker may include a tank body, and a coupling structure, including a web extending from the tank body, for transferring a towing load to the tank body. A load spreading structure may be affixed to the tank body and configured to spread at least a portion of a load experienced by the tank body in a region proximate a terminal end of the web. The load spreading structure may include a reinforcing member including a elongated U-shaped member including two legs joined at a first end by an arcuate section. A respective one of the two legs may be at least partially disposed on opposed sides of the web with web at least partially received within an open second end of the U-shaped member.

Abstract: A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.

Abstract: A composition suitable for use as a target containing antimony to be irradiated by accelerated charged particles (e.g., by protons to produce tin-117m) comprises an intermetallic compound of antimony and titanium which is synthesized at high-temperature, for example, in an arc furnace. The formed material is powdered and melted in an induction furnace, or heated at high gas pressure in gas static camera. The obtained product has a density, temperature stability, and heat conductivity sufficient to provide an appropriate target material.

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract: A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.

Abstract: Mounting rings and methods for mounting structures to shafts are provided. The rings and methods may be used to mount other rings or housings to a shaft. The rings are characterized by having flexible inner diameters that can deflect under a radial load. The radial deflection of the inner diameter permits the rings to deflect and engage an outer diameter of a shaft. The engagement of the rings with a shaft provides at least some resistance to movement, for example, rotation and/or axial displacement, of the shaft relative to the ring and structure. In one aspect, the ring has a closed, hollow, construction, for example, a circular, oval, or polygonal closed, hollow construction. The ring may include a plurality of indentations, such as slots, on the inside diameter of the ring that may relieve at least some of the circumferential stress in the ring. Methods for using the rings to mount a structure to a shaft are also disclosed.

Abstract: A method for welding half shells and thus a method for producing large volume components, such as an inner housing for a steam turbine is disclosed. Two half shells are connected to each other forming a tube-like cross section, and are welded by means of a girth weld to two further half shells that are connected to each other.

Abstract: Disclosed is a method of fabricating and installing a riser tower structure, preferably in a welding chamber, and a welding chamber suitable for the method. The method includes fabricating sections of the riser tower structure at a site remote from the site of installation; transporting the sections of the riser tower structure to within the vicinity of the installation site; and assembling together the sections of the riser tower structure in the vicinity of the installation site. The welding chamber includes a plurality of guide means, each providing a guide for one of the elongate elements of the riser tower structure, and floats on the sea surface when in use.

Abstract: Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an inner layer of the multi-layer materials can be provided with or form internal features that can be for attaching parts or components to the multi-layer materials. In another embodiment, processing of an inner layer of the multi-layer materials can facilitate part formation with increased curvature and/or internal part clearance. In another embodiment, the multi-layer materials can include an intermediate layer that facilitates creation of internal features that can be for attaching parts or components to the multi-layer materials.

Abstract: Rotary tool, such as a drill or milling cutter, having a main tool body, which extends along a center longitudinal axis, which has a flute and which, at a distance from the center longitudinal axis, has an insert seat which is introduced into the flute wall and in which a cutting insert, in particular made of a superhard material such as PCD or PCBN, is fastened integrally, wherein, for fixing both a radial and also an axial position of the cutting insert, the insert seat has an abutment wall which has a contour for positioning the cutting insert in a rotationally locked manner.

Abstract: A MEMS gyroscope is provided. A substrate can be formed with a substantially planar surface, a substantially hemispherical cavity extending into the surface, an actuation electrode, and a plurality of sensing electrodes. A resonator formed from a substantially hemispherical shell can be suspended within the cavity by a stem coupling the center of the bottom of the cavity to the center of the bottom of the shell. An electronic processor can be configured to cause a voltage to be applied to the actuation electrode, receive signals from the sensing electrodes, and process the received signals to determine rotation of the MEMS gyroscope.

Abstract: A conductor for a communications cable includes an elongated metal wire and a metal sheet that includes a plurality of carbon nanotubes that at least partially surrounds the elongated metal wire. The metal wire may include copper, and the metal sheet may likewise include copper and may be welded to an outside surface of the metal wire to surround the metal wire. This conductor may be used in a variety of communications cables that carry high frequency signals.