Abstract: A heat exchanger for connecting thermal elements to one another and an external circuit in series, in parallel or according to a mixed configuration which limits the risk of leakage and the number of connections. The heat exchanger includes calorie-emitting and negative calorie-emitting thermal elements, and a conduit which passes through each of the thermal elements and has inlet and outlet orifices that are connected to one another and to at least one thermal fluid circuit by an interface plate. The interface plate includes two supply orifices and two discharge orifices for connecting the interface circuits to external hot and cold circuits for using the calories and the negative calories recovered from the thermal fluid.

Abstract: Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus) 1 includes: housing 31 that forms sealed inner space 33; circuit unit 39 that is provided in inner space 33; first partition plate 34 that is provided in inner space 33 and that has upper/lower partition portion 7, wherein upper/lower partition portion 7 at least partially extends in a lateral direction extending above at least a part of circuit unit 39 and that terminates in front of both lateral sides of housing 31; and first fan 5, 6 that is provided through upper/lower partition portion 7.

Abstract: A portable computer system is disclosed according to the invention. The portable computer system comprises: a multi-functional processing unit with power consumption of no more than approximately 10 watts consisting of a single chip having a plurality of processors thereon, wherein each processor is operable for at least one task selected from a group consisting of computing, graphic processing and audio processing; a mother board to which the multi-functional processing unit is connected; a memory unit connected to the motherboard and in communication with the multi-functional processing unit; and an I/O interface connected to the motherboard and in communication with the multi-functional processing unit, the portable computer system is configured to insert into a interface of a peripheral device to communicate between the portable computer system and the peripheral device.

Abstract: In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block.

Abstract: Various embodiments in accordance with the present invention provide a housing, a support, and a heat-dissipating assembly for an electronic device. A heat-dissipating opening is disposed on a rear cover of the housing. The heat-dissipating opening is disposed in correspondence with a heat-generating means of the electronic device. A covering means is also disposed on the rear cover of the housing, and the covering means is configured to enable the heat-dissipating opening to be opened and closed. The housing for the electronic device enables the covering means to be operated according to the heat condition of the electronic device, and prevents significant heat accumulation in the electronic device.

Abstract: Apparatuses for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component are provided. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component.

Abstract: A wiring structure for an electronic apparatus has a structure in which a first wiring path where a first harness that is used for transmitting a primary power is wired and a second wiring path where a second harness that is used for transmitting a secondary power is wired are formed, and a structure related to the first wiring path is formed so that, in a case where the first harness is wired, the first harness is integrated with the structure related to the first wiring path.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the at least some of the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The frame has such a shape that at least some of the electronic components constituting the internal unit are disposed inside the frame. The frame includes a terminal block on which input/output terminals for inputting and outputting controlled power are mounted for providing connection between the input/output terminals and external devices.

Abstract: A disclosed cooling structure includes a casing including a bottom plate arranged in a bottom portion of the casing and having a through hole formed in the bottom plate; a heat source to be cooled accommodated in the casing; a suctioning unit configured to suction outer air from an outside of the casing to an inside of the casing via the through hole in the bottom plate; an open and close member including an outer air path for carrying the suctioned outer air and being capable of opening and closing relative to the casing; and an outer air applying unit configured to cool the heat source by the carried outer air received from the open and close member.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

Abstract: A power-supply controlling system includes an integrated circuit that outputs a first instruction signal, which instructs an electricity-supply unit to supply electricity to a device that releases heat, a detecting unit that detects an operating status of a cooling unit that cools the device, a state signal generating unit that generates a state signal in accordance with the detected operating status, the state signal indicating whether or not the cooling unit is being driven, and an output unit that generates a second instruction signal by using the first instruction signal and the state signal, and outputs the second instruction signal to the electricity-supply unit, the second instruction signal giving an instruction to supply electricity to the device.

Abstract: A semiconductor recording medium recording and/or reproducing apparatus includes: a medium holder that has a medium housing unit in which a semiconductor recording medium is detachably housed; an exterior case that has a medium entrance through which the semiconductor recording medium is inserted and ejected, and in which the medium holder is housed in a state where the medium housing unit is opposed to the medium entrance; an openable and closeable cover that opens and closes the medium entrance; a heat sink that is contactable with the semiconductor recording medium housed in the medium housing unit; and a heat sink moving unit that moves the heat sink in cooperation with an opening and closing operation of the openable and closeable cover.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: A semiconductor device includes at least one arm series circuit, a conductive first thermal buffer member, and a conductive second thermal buffer member. The arm series circuit includes an upper arm, a lower arm, a positive-electrode terminal, a negative-electrode terminal, and an output terminal. The first thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the first switching device and smaller than a linear expansion coefficient of one of the positive-electrode terminal and the output terminal. The second thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the second switching device and smaller than a linear expansion coefficient of one of the negative-electrode terminal and the output terminal.

Abstract: An electronic equipment enclosure system with an airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a magnetic filler panel.

Abstract: This present invention provides a high power electronic device which is used for transforming the alternating current into the direct current, or transforming the direct current into the alternating current: a thyristor valve module, there are two same thyristor valve segments in the whole thyristor valve module; each segment includes saturated reactor, thyristor valve unit, direct current equalizing resistor unit, acquiring energy unit, damped resistor unit, damped capacitor unit, gate series unit and water cooling system. This device series connects the thyristor valves to meet different transmission powers and different voltage ranks. This device is the key element of the high voltage direct current transmission. It can be used for different voltage ranks AD transmission system and can also be used for different voltage ranks DC system, including the ultra-high voltage 800 kV and above system.

Abstract: Thermal conductivity in a stacked IC device can be improved by constructing one or more active temperature control devices within the stacked IC device. In one embodiment, the control devices are thermal electric (TE) devices, such as Peltier devices. The TE devices can then be selectively controlled to remove or add heat, as necessary, to maintain the stacked IC device within a defined temperature range. The active temperature control elements can be P-N junctions created in the stacked IC device and can serve to move the heat laterally and/or vertically, as desired.

Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract: A method for limiting temperature variation of an electrical component includes detecting a switch from passive to active states and, in response, varying a potential difference between capacitor electrodes from a first value to a second value, the electrodes being mechanically and electrically insulated from each other by a layer of electrocaloric dielectric, and in response to detecting a switch from active to passive states, varying the potential difference between the electrodes from the second to the first value.

Abstract: Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.

Abstract: A power conversion apparatus is provided which includes a semiconductor module which include a switching element, a cooler which cools the semiconductor module, and has a pair of cylindrical pipes which introduce a cooling medium to a channel therein or discharge the cooling medium, a frame which holds the cooler, and a pair of clamps which fix the cylindrical pipes to the frame. Each of the clamps has a fastener portion which is fastened to the frame, and a pressing portion which presses the cylindrical pipe toward the frame. Each of the cylindrical pipes is held between a concave support portion, which is formed in the frame, and the clamp. Each of the cylindrical pipes is supported by two support surfaces of the concave support portion and the pressing portion of the clamp at three support points when viewing from the direction in which the cylindrical pipe extends.

Abstract: An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources. An interposer 24 comprises a body having a cavity 23 maintained in vacuum; insulating layers 22a and 22b formed respectively on upper and lower walls 20a and 20b of the body; and heat reflecting layers 21a and 21b formed respectively on the insulating layers 22a and 22b. The interposer 24 thermally insulates semiconductor devices 11a and 21a mounted respectively on upper and lower sides of the interposer 24.

Abstract: A cooling box for electric or electronic components, consisting of a material, wherein the cooling box is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity that is enclosed by the material, wherein cavity being closed or provided with at least one opening.

Abstract: A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank.

Abstract: A power supply apparatus includes a first electronic device, a second electronic device, and plural power modules. The first electronic device includes a first compartment. The first compartment has a first width. The second electronic device includes a second compartment. The second compartment has a second width. Each of the power modules has a third width. The third width is determined according to the first width and the second width, so that a specified number of power modules are selectively accommodated within the first compartment or the second compartment.

Abstract: A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack, and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.

Abstract: An electrical power supply device for a motor vehicle, which includes a tray made of a heat-conducting material, in which there is positioned at least one ultra-high capacity energy storage unit liable to emit heat, the tray including at least one housing to accommodate at least one electrical energy storage unit with the presence of a heat-conducting layer made of a heat conducting adhesive or a heat-conducting resin interposed without clearance between the storage unit and the interior face of the wall of the associated housing so as to conduct the heat emitted by the unit.

Abstract: An electronic system includes an electronic device and a heat exchanger for exchanging heat with the device. The heat exchanger includes a flow duct for receiving a fluid, at least a portion of the flow duct being arranged in thermal communication with the device. The system further includes a pump associated with the flow duct and a Venturi tube for reducing the pressure of the fluid in the portion of the flow duct to a value less than the pressure external to the duct, to minimize any leakage of the fluid onto the device in the event the portion of the flow duct develops a leak.

Abstract: A modular power supply (1) includes a primary input portion (2) operating with predetermined input parameters, and an output portion (3) comprising at least two modules (4) to be selected for modifying the power supply's output parameters. It is further provided a container (5) in which the primary input portion and the output portion are housed. The container comprises an inaccessible portion (6) adapted to house the primary input portion separated from the output portion, and a cover (7) hinged on a base structure (8) of the container for access to the output portion. The inaccessible portion of the container comprises a partition (9) disposed between the primary input portion and the output portion and provided with openings (10) for cooling the primary input and secondary portions. The openings are such disposed that access to the primary input portion is not allowed.

Abstract: An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.

Abstract: A heat exhaustion structure for a heat dissipating device is provided. The present invention relates to a heat exhaustion structure for a heat dissipating device, and more particularly, to a heat exhaustion structure that may effectively exhaust an internal heat generated by heat dissipating devices included in a semiconductor package and in a large number of electronic products.

Abstract: An electronic device includes a power supply, a heat generating module, a detecting module, a switching module presetting a predetermined voltage, and a heat dissipation module. The heat generating module is powered by the power supply to generate heat. The detecting module detects the heat of the heat generating module and generates a control voltage variable with the heat of the heat generating module. The switching module establishes the electrical connection between the power supply and the heat dissipation module when the control voltage is smaller than the predetermined voltage and generates a working voltage variable with the control voltage. The heat dissipation module is powered by the working voltage to dissipate the heat of the heat generating module with different heat dissipation efficiency. The heat dissipation efficiency is variable with the working voltage.

Abstract: A system and method for evaluating equipment in an improper cluster in a data center, the equipment including a plurality of equipment racks, and at least one cooling provider. In one aspect, the method includes receiving data regarding each of the plurality of equipment racks and the at least one cooling provider, the data including a layout of the improper cluster of equipment racks and the at least one cooling provider, storing the received data, identifying at least one gap in the layout, determining cooling performance of at least one of the plurality of equipment racks based, at least in part, on characteristics of the at least one gap, and displaying the layout of the data center, wherein the layout includes an indication of the cooling performance of the at least one of the plurality of equipment racks.

Abstract: A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

Abstract: The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).

Abstract: An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Abstract: A battery pack including battery cells, a housing to house the battery cells, and a cooling device that cools air flowing through the housing. The cooling device may be installed on an intermediate portion of the housing. The cooling device may include a cooling pipe, in which water flows.

Abstract: A power conversion apparatus includes a plurality of semiconductor modules and a plurality of bus bars. The plurality of bus bars include a positive electrode bus bar connected to a positive electrode power terminal, a negative electrode bus bar connected to a negative electrode power terminal, and a plurality of AC bus bars connected to an AC power terminal. Of a DC bus bar group Including the positive electrode bus bar and the negative electrode bus bar, and an AC bus bar group including the plurality of AC bus bars, part of one of the bus bar groups is sealed with insulating resin, and the other of the bus bar groups is not sealed with insulating resin. A seat is formed on the insulating resin sealing the one of the bus bar groups, and the other of the bus bar groups is mounted on a seat face of the seat.

Abstract: According to one embodiment, a television apparatus includes an exothermic component, a heat transfer mechanism, a plurality of heat releasing fins, a fan, and a deflecting member. The exothermic component is housed in a housing. The heat transfer mechanism is at least partially housed in the housing. The heat transfer mechanism includes a heat receiving portion that receives heat from the exothermic component, a heat releasing portion that releases heat, and a heat transferring portion that houses a medium to transfer heat from the heat receiving portion to the heat releasing portion. The heat releasing fins are thermally connected to the heat releasing portion and arranged with gaps therebetween. The fan generates an air flow flowing through the gaps. The deflecting member is located at least downstream of the gaps to cover the gaps. The deflecting member deflects the air flow toward an exhaust outlet formed in the housing.

Abstract: Systems and methods of controlling a fan in an electronic system are disclosed. One example method includes obtaining a control setting of the fan and current speed of the fan. The example method further includes determining a fan speed threshold associated with the obtained control setting. The example method further includes comparing the fan speed threshold to the current speed. The example method further includes generating an alert based on the comparison.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Abstract: An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.

Abstract: An explosion protection housing constructed according to an explosion protection requirement having a temperature control system. The temperature control system includes a temperature control device that includes a pipe coil thermally connected to at least one of the walls of the housing. Optionally, temperature control fluid is directed through the pipe coil by means of circulating pump in order to increase or decrease the temperature of the housing, depending upon the explosion protection requirements.

Abstract: A detachable USB fan module mounting structure includes a machine case having a top opening and two guide rails at two opposite lateral sides of the top opening, a circuit board with one a USB connector accommodated in the machine case, a cover member detachably covered on the top opening of the machine case and having a coupling structure detachably coupled to the guide rails of the machine case and a bottom bracket with a fan module positioning structure to hold a USB fan module that has a power cord with a USB plug connected to the USB connector of the circuit board.

Abstract: The invention relates to a monitoring device for sliding closures, casting tube changers or the like on a foundry ladle or a similar metallurgical vessel, wherein the device has an electronics system (4) for detecting the parameters of the monitored device that are functionally important during casting. In order to ensure trouble-free functioning of the electronics system (4), according to the invention said system is housed in a unit (3) fastened to the foundry ladle. Said unit has thermal insulation (8) and is provided with an air cooling system (10) which is operated with purified cooling air and can be electrically driven both by an energy source (15) supplied by the waste heat of the foundry ladle and by an external energy source (16).

Abstract: A disaster-proof data safe with multiple, insulated, surrounding solid structural metal walls for housing functioning digital electronic computing, data processing, data storage, communications and high power density blade server systems has one or more coaxial helical coil coolant tubes circulating a coolant liquid encircled around an interior hexahedral, housing space for removing heat generated in the housing space and insulating the housing space from sources of heat external to the safe. Features of the safe include a plurality of longitudinal heat sink bars thermally coupled to the encircling helical coil coolant tubes supported either by the helical coil coolant tubes or the interior structural metal sidewalls of the housing space. The helical coil coolant tubes and the heat sink bars are preferably composed from metals such as copper, aluminum and their alloys that have a high thermal conductivity and that retain structural integrity at temperature ranging up to 500° C.

Abstract: Arc resistant enclosures for dry-type transformers. More particularly, transformer enclosures having one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums, and methods for providing same.