Abstract: An epoxy resin curing agent which provides good adhesiveness to polyester in addition to excellent performance and high gas-barrier properties of epoxy resins, an epoxy resin composition containing the epoxy resin curing agent, an adhesive for laminating which mainly contains the composition, a laminate film obtained by using the adhesive, a multi-layer packaging material, and a packaging bag. The epoxy resin curing agent is a reaction product of (A) m-xylylenediamine or p-xylylenediamine, (B) a polyfunctional compound having one acyl group, which forms amide linkage by a reaction with polyamine and is capable of forming an oligomer; and (C) an aromatic dicarboxylic acid, an ester thereof, an amide thereof, an acid anhydride thereof, or an acid chloride thereof.

Abstract: There is provided a polymer ceramic composite which includes one or more particulate ceramics and a mixture of polymers. There is further provided methods of manufacture and application of the polymer ceramic composition. The composition finds use as a mouldable armour strike face, particularly in personal protective equipment and in vehicle or aircraft armour.

Abstract: A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3, and a processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Abstract: A thermochromic ink contains scented microcapsules.

Abstract: A resin primer which can stick an insulator layer to a conductor foil, whose surface is not much roughened, with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing the same. The resin primer includes a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin includes a conductor foil and the aforesaid resin primer. The laminated sheet includes the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer including the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate including the aforesaid conductor foil with resin, and a prepreg laminated on this resin.

Abstract: There is provided a polyamic acid resin composition, a method for preparing the same and a polyimide metal clad laminate using the same, in which the polyamic acid resin composition includes an epoxy compound represented by Chemical Formula 1 is defined in specification.

Abstract: There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hardmask. A resist underlayer film forming composition for lithography, includes as a silane compound, a hydrolyzable organosilane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof, wherein the hydrolyzable organosilane is a hydrolyzable organosilane of Formula (1): R1aR2bSi(R3)4?(a+b)??Formula (1) wherein R1 is Formula (2): in which R4 is an organic group, and R5 is a C1-10 alkylene group, a hydroxyalkylene group, a sulfide bond, an ether bond, an ester bond, or a combination thereof, X1 is Formula (3), Formula (4), or Formula (5): R2 is an organic group, and R3 is a hydrolysable group.

Abstract: The invention relates to a resin curing agent having the formula (I), wherein R1 to R4 are each individually selected from linear or branched C1 to C5 alkyl, a process for its manufacture, blends of the reaction products, and two-component curable resin systems.

Abstract: A method of producing a color filter by using the ink jet system. The method includes a step of preparing a specific ink-jet ink for color filter, the ink containing a pigment, a pigment dispersing agent, a binder forming system and a solvent, a step of forming an R ink layer, a G ink layer and a B ink layer respectively by the ink jet system and a step of curing each of the ink layer to form an R pixel, a G pixel and a B pixel, which each have an average film thickness range from 1.5 ?m to 2.5 ?m and a film thickness distribution range from 1.0 ?m to 3.0 ?m, wherein the ratio of the total area of the regions having a film thickness of 1.5 ?m or less or 2.5 ?m or more in one pixel is 5% or less.

Abstract: The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B? having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.

Abstract: Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B).

Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a curing accelerator; (D) a specific silicone resin; and (E) a specific alcohol compound.

Abstract: A product and method for repairing holes and cracks in roads, parking lots, sidewalks and other similar surfaces using a mixture of powder coating (i.e. dry paint) and a filler. The first step is to obtain the powder coating material. Any suitable powder coating material may be used, however, it is preferable to use the excess or waste powder coating material obtained from a powder coating operation. The next step is to mix the powder coating material with a filler, such as sand, pea gravel, or another suitable material. After the components are mixed together, it is applied to a surface needing repair such as a pothole in a road or a crack in a sidewalk. The mixture is cured by heating the mixture to the point where the powder coating melts and binds the powder coating with the filler and the surface needing repair. It may be cured before or after it is applied to the surface needing repair. After the mixture cures, the result is a high quality patched surface.

Abstract: A coating composition comprising a polyether polyol having a hydroxyl functionality of 3 to 8 and the reaction product of: (i) a phosphorus acid, and (ii) a polyepoxide and/or a polyester. The compositions are useful for coating containers of all sorts, such as food and beverage containers. The compositions can be formulated to be substantially free of bisphenol A (BPA), bisphenol A diglycidyl ether (BADGE) and other derivatives of BPA.

Abstract: A coating system for application to a substrate having a sol-gel film layer applied thereon includes a decorative color coat applied directly on top of the sol-gel film without an intervening adhesion layer. The decorative color coat may be a solvent borne composition including a resin which is the reaction product of a crosslinked polyepoxy resin and a polyamine crosslinker, and one or more opacifying pigments. Decorative designs may be formed by selectively applying more than one layer of decorative color coats having different colors. A transparent clearcoat may be applied to the decorative film.

Abstract: An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.

Abstract: Formulations containing a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin, the mixture having nano-materials dispersed or dissolved therein. These formulations can be used for the preparation of nanocomposites. Methods of preparing nanocomposites by curing a dispersion of nano-materials in a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin. Nanocomposites comprising a cured product formed by curing an epoxy resin with an ionic liquid or an adduct of an epoxy resin and an ionic liquid having nano-materials dispersed or dissolved therein. Embodiments of the invention permit manufacture of nanocomposites having relatively high fracture toughness, relatively high loadings of nano-materials and the ability to tailor the properties of the nano-composites.

Abstract: A phenolic compound which can be obtained by reacting the compound of the formula (1): wherein R1 groups are each independently present and represent a hydrogen atom etc. with the formula (6): wherein R4 groups are each independently present and represent a hydrogen atom etc.; and k represents the number of R4 groups and is an integer of 0 to 4 and an epoxy resin which can be obtained by reacting the phenolic compound with an epihalohydrin are excellent in solvent solubility and also of which cured product has an excellent thermal conductance.

Abstract: An encapsulating sheet is obtained by subjecting a kneaded material to plastic working, the kneaded material including an epoxy resin represented by General Formula (1) below, a curing agent, and an inorganic filler, (where R1 to R4 are the same or different, and each represents a methyl group or a hydrogen atom; and X represents —CH2—, —O—, or —S—).

Abstract: The present invention provides an ink jet printable phosphor ink composition for LED packaging that enables precision control of the amount and position of phosphor layers on the LED device or the LED device packaging. The ink includes both a UV-curable resin component and a thermally curable resin component. A phase-separation component prevents phase separation of the UV-curable resin component and the thermally curable resin component. Phosphor particles on the order of less than approximately 2 microns are uniformly dispersed throughout the ink composition. The phosphor ink composition is deposited through either thermal or piezoelectric ink jet printing; a thin layer is deposited in a desired pattern. UV curing (and, optionally, thermal curing) is used to fix each layer followed by subsequent deposition and curing. In this manner, undesirable phosphor settling does not occur and layers are selectively built up to form precise phosphor distributions.

Abstract: A coating for a substrate is a cured coating composition which includes binder and particles, wherein the particles are inorganic, organic or organo-metallic; have diameters between about 1 and 500 nm; may be treated with a surface modifer; and wherein the cured coating composition is in direct or indirect contact with the substrate.

Abstract: A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %.

Abstract: A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: Provided is an electro-conductive member for electrophotography that stably shows high electro-conductivity even under a low-temperature, low-humidity environment. The electro-conductive member for electrophotography has an electro-conductive mandrel and an electro-conductive layer. The electro-conductive layer contains an ionic electro-conductive resin and an ion carrier. The ionic electro-conductive resin has at least one structure selected from the group consisting of structures represented by the following formulae (1), (2), (3), and (4), and a structure represented by the following formula (5) (in the formula (1) to the formula (5), R1, R2, R3, and R4 each represent a divalent organic group, X1, X2, X3, and X4 each independently represent a sulfonic group or a quaternary ammonium base, and 1 represents an integer of 1 or more and 23 or less).

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.

Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Abstract: Coating systems for a surface (such as a floor) including a peelabie layer composition including a peelabie layer film former, and a maintenance layer composition including a maintenance layer film former having a first Tg from about ?100° C. to about 20° C. Methods of coating a surface are also provided. One method may include applying a peelabie layer composition including a peelabie layer film former to form a peelabie layer having a tensile strength that is greater than an adhesive strength, and applying a maintenance layer composition including a maintenance layer film former including a self- crosslinking polyurethane, a polyurethane copolymer, or a combination thereof.

Abstract: A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent.

Abstract: A two-component epoxy resin composition, including: a resin component which includes at least one epoxy resin and at least one aldehyde, and a hardener component which includes at least one polyamine having at least one primary amino group.

Abstract: A prepreg comprising a fibrous material contacting a polymerisable resin, at least 50 wt % of the polymerisable resin comprising at least one polymerisable monomer having at least two carbon-carbon unsaturated functional groups, the monomer being polymerisable by reaction of the unsaturated functional groups to form a cured resin, wherein the resin has a heat of polymerization of less than 230 KJ/kg to provide a maximum increase in temperature of the prepreg of 60° C. during polymerisation under adiabatic conditions.

Abstract: Enhanced media transport systems and structures are provided for printing environments. Enhanced vacuum table structures and associated methods may also be implemented for a variety of printer systems. Enhanced rail systems and associated carriage structures may preferably be used within a variety of printing environments, such as for but not limited to grand scale printers. Water-based binary epoxy ink compositions and associated processes provide adhesion and material compatibility that exceeds that of currently available UV curable products, while providing ultra-low volatile organic carbon (VOCs), and no hazardous air pollutants (HAPs). An integrated system and method for identification of consumables through a central database may also be implemented within different printing systems.

Abstract: A resin composition for a pre-coated steel sheet having excellent welding properties, corrosion resistance and workability, a method of producing a pre-coated steel sheet using the same, and a pre-coated steel sheet are provided. More particularly, a metal resin composition for coating a film is provided. The composition includes a subject resin, a curing agent, and at least one kind of metal powder selected from the group consisting of Ni, Co, Mn, Fe, Ti, Cu, Al, Zn, Sn and Fe2P powder, and has an average short-axis diameter (?) satisfying the condition t/3???3t (where t is a thickness of a dried coating film formed by coating a resin metal composition for coating the coating film). Therefore, the steel sheet to which the metal resin composition is coated has excellent welding properties, corrosion resistance and workability.

Abstract: An epoxy resin composition for semiconductor encapsulation of the present invention contains an epoxy resin (A) and a curing agent (B) and is used to encapsulate a copper wire (4) and a semiconductor element (1) connected to this copper wire (4). This epoxy resin composition is such that when a cured product of the epoxy resin composition is heated for 10 hours at 200° C., the amount of generation of a first corrosive gas that is a sulfur compound having corrosiveness to the copper wire (4) is less than or equal to 70 ppm.

Abstract: Disclosed is an improved coating composition for food containers that is resistant to high pH processing environments. The improved coating composition is based upon an epoxy-amino resin coating composition that has been modified with other components to improve its performance in high pH environments balanced with flexibility, formability and abrasion resistance. Typically, the coating composition includes an epoxy resin, an amino resin cross-linking agent, a blocked polyisocyanate and a saturated polyester.

Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, can be formed from a coating composition comprising a primer having an epoxy resin with the proviso that the epoxy resin does not have an EEW of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a HEW of about 200 to about 500, and a platy filler. The primer contains less than 20 wt % zinc. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 450 to about 1400, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a foaming agent and a reinforcing fiber.

Abstract: Embodiments include curable compositions including a resin component and a hardener component. The resin component can include an epoxy compound that is selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof, and a reactive diluent that includes a polymeric glycidyl ether. The hardener component can include an adduct and a Mannich base.

Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

Abstract: Disclosed are coatings comprising a matrix material and nanoscale bodies disposed within the matrix material. Also provided are methods of forming such coatings.

Abstract: The present invention has an object to provide a conjugated diene-based polymer, subjected to a vulcanization treatment to make a vulcanized rubber, the vulcanized rubber useful as a material for tire treads excellent in the balance among wet skid characteristics, low hysteresis loss, abrasion resistance, breaking strength and rigidity, and to provide its manufacturing process.

Abstract: The invention relates to biaxially oriented polyester films which contain 0.1-5.0% by weight (based on the weight of the film) of a hydrolysis stabilizer based on epoxidized fatty acid esters and 0.2-10% by weight (based on the weight of the film) of epoxidized fatty acid glycerides, the epoxidized fatty acid esters having a mean molecular weight of at least 425 g/mol. Such films find use in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.

Abstract: Embodiments include oxazolidone ring containing adducts obtainable by combining an aliphatic epoxy compound, an aromatic epoxy compound, and a diisocyanate. Embodiments further include a curable powder coating composition including a resin component and a hardener component, where the resin component includes the oxazolidone ring containing adduct.

Abstract: A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain.

Abstract: The present invention provides a chipping-resistant coating composition including a hydroxyl group-containing urethane resin (A) obtained by reacting a polyol component (a) composed of a cyclic polyol compound (a1) having a nurate structure and another polyol compound (a2) with a polyisocyanate compound (b), and a curing agent (B). This chipping-resistant coating composition is capable of forming a coated film excellent in chipping resistance and water resistance. Furthermore, the present invention also provides an article coated with the chipping-resistant coating composition.

Abstract: A non-skid coating described herein attempts to overcome the deficiencies of the conventional coatings with improved external durability and color retention, a reduced level of VOCs, and direct-to-metal (DTM) adhesion using organo-siloxane chemistry. The non-skid coating has a first component having an amino-functional siloxane resin; a second component having a non-aromatic epoxy resin; a spherical filler for lowering viscosity; a pigment; a coarse aggregate; and a thixotropic agent. The amino-functional siloxane resin can be an amino-functional methyl phenyl polysiloxane, diphenyl polysiloxane or silsesquioxane-based resin. The non-aromatic epoxy resin can be cycloaliphatic or aliphatic. The first component is about 5% to 20% weight of the coating, and the second component is about 80% to 95% weight of the coating.