Abstract: A highly reliable semiconductor device with the improved humidity resistance reliability is disclosed. A disclosed epoxy resin composition for semiconductor encapsulation encapsulates, in the manufacture of the semiconductor device, a semiconductor element that is mounted on a lead frame having a die pad unit or a circuit substrate and a wire that connects an electrical junction disposed on the lead frame or circuit substrate and an electrode pad disposed on the semiconductor element. The epoxy resin composition includes an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin (A) has a main peak area of 90% or more with respect to the total area of all peaks as measured by the gel permeation chromatography area method.

Abstract: A battery electrode or separator surface protective agent composition having fluidity and being capable of being solidified by hot melt, and comprising at least two types of organic particles comprising organic materials, wherein the organic particles of types different from each other are substantially incompatible with each other, wherein when the composition is solidified by hot melt, the organic particles of the same type thermally fuse with one another to form a continuous phase.

Abstract: Curable and cured epoxy-based coating compositions are described. The curable coating compositions are typically two-part epoxy-based formulations. The cured coating composition can be used in various applications such as those in which the curable coating composition is applied to either a clean surface or to a surface contaminated with a hydrocarbon-containing material. The cured coating composition typically bonds effectively to the substrate even in the presence of a hydrocarbon-containing material.

Abstract: The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group.

Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

Abstract: Thermosetting epoxy-terminated oxazolidinone ring containing polymers which are obtainable by reacting at least one polyisocyanate compound with at least one hydroxy group containing epoxy resin and/or a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups. The polymers have an onset glass transition temperature of at least about 45° C. and are capable of showing an onset glass transition temperature in the cured state at least about 160° C. Powder coating compositions comprising these polymers are also disclosed.

Abstract: The present invention relates to a process for the preparation of a radiation curable composition comprising at least (meth)acrylic copolymer A and at least one radiation curable epoxy based compound B, said process comprising a first copolymerization step, and a subsequent esterification step.

Abstract: A undercoat agent used for performing phase separation of a layer formed on a substrate and containing a block copolymer having a plurality of blocks bonded, wherein the undercoat agent contains a resin component, the resin component is formed from a structural unit having an aromatic ring and a structural unit not having an aromatic ring, and the resin component has a group that can interact with the substrate, and also has a 3 to 7-membered, ether-containing cyclic group.

Abstract: Described herein are quartz crystal microbalance (QCM) and quartz crystal microbalance with dissipation (QCMD) techniques that can be used for measuring characteristics of a creping adhesive film similar to the creping adhesive film that is formed on a Yankee dryer during the tissue and towel manufacturing process. In addition, exemplary embodiments described herein may use these techniques to predict performance of creping aids utilized to form a creping adhesive film.

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.

Abstract: A method for applying stones to metallic elements, particularly for the adhesive bonding of glass crystals to surfaces of tubular elements, which includes the steps of preparing an application surface (2) of a metallic element, spreading an adhesive medium (3) on the application surface (2) and making a single lateral face (4) of a first stone (5) to be applied adhere to the application surface (2). The axis of symmetry (10) of the first stone defines a first angle of intersection (8) with the application surface (2).

Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.

Abstract: The instant invention relates to epoxy resin compositions comprising an epoxy resin, a block copolymer having at least one block predominantly composed of methyl methacrylate units or a core shell component and a hardener of the polyoxyalkyleneamine type. The epoxy materials cured from these compositions have high impact resistance.

Abstract: An electronic display (100) is provided that includes a display panel (106) having an image—forming region, a substantially clear photocured bonding layer (104) which is the reaction product of a first photocurable resin system disposed upon the image—forming region, an obscuring layer (108) in proximity to at least a portion of the substantially clear photocurable bonding layer, and a substantially transparent outer panel (106) in contact with at least a portion of the obscuring layer. The bonding layer (104) is disposed partially beneath the obscuring layer (108). The obscuring layer has an average light transmission of less than about 5% in the wavelength range of 420 nm to 700 nm and a light transmission of greater than about 5% in the wavelength range of 300 to 400 nm. Also provided is a method for making the electronic display.

Abstract: A thermosettable (curable) epoxy resin composition including (A) a residual oligomeric product; wherein the residual oligomeric product comprises a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of (i) an aliphatic or cycloaliphatic hydroxyl-containing material with (ii) an epihalohydrin, (iii) a basic-acting substance, (iv) a non-Lewis acid catalyst, and (V) optionally one or more solvents; (B) an epoxy curing material comprising (i) an epoxy resin curing agent, (ii) an epoxy resin catalyst, or both an epoxy resin curing agent (i) and an epoxy resin catalyst (ii); and (C) optionally, an epoxy resin compound other than the aliphatic or cycloaliphatic polyfunctional epoxy resin (A). A thermoset may also be made from the above thermosettable composition.

Abstract: Low temperature, moisture curable coating compositions, related coated substrates, and methods for coating a substrate are described. The coating compositions include an ungelled, secondary amine-containing Michael addition reaction product of reactants including a compound comprising more than one site of ethylenic unsaturation, and an aminofunctional silane.

Abstract: A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

Abstract: An object of the present invention is to provide an adhesive for electronic components that allows suppression of occurrence of voids and is prevented from wicking up to an upper surface of a semiconductor chip. Another object of the present invention is to provide a production method for a semiconductor chip mount using the adhesive for electronic components. The present invention is an adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in FIG. 1 wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C.

Abstract: A process for preparing a dispersion of encapsulated solid particles in a predominantly organic liquid vehicle, comprising the following steps: i) providing a dispersion comprising a particulate solid, a liquid medium and a polymeric dispersant having at least 3.0 mmoles of reactive groups per g of dispersant; ii) cross-linking the polymeric dispersant via at least some, but not all, of the reactive groups, said cross-linking being performed in the presence of the particulate solid and the liquid medium and resulting in the encapsulation of each solid particle with a cross-linked polymeric dispersant shell; iii) covalently bonding an end-capping agent to the polymeric dispersant via the reactive groups; said process being such that the final organic liquid vehicle comprises one or more organic liquids and optionally water, provided that water is present at no more than 30% by weight based on the dispersion.

Abstract: A radiation curable composition comprising 15 to 85 wt % of at least one solvent comprising ?20 wt % of water; 5 to 50 wt % of at least one radiation curable material having a Mn in the range of from 50 to 10,000 g/mol; and 10 to 70 wt % of at least one polyurethane having a Mw in the range of from 4,000 to 70,000 g/mol, the polyurethane having 0 to 5 wt % of isocyanate-reactive component(s) bearing ionic or potentially ionic water-dispersing groups and a free isocyanate group content ?0.5 wt %.

Abstract: A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.

Abstract: The invention relates to an emulsifiable catalyst composition which comprises at least one of metal salts, metal complexes, and acids, and at least one amphiphilic compound which is a graft copolymer based on oils or diene homo-and copolymers that bear graft branches derived from olefinically unsaturated monomers, and an average, per molecule, of at least one cationic group or cationogenic group that forms cations when contacted with an acid, to a process for its preparation, and a method of use thereof as catalyst in aqueous coating compositions.

Abstract: The invention relates to a fixed and/or stabilized fiber structure from a fibrous material as well as from an agent for its fixing and stabilizing. The agent for fixing and stabilizing is a statistical copolyester which is formed from the diacid components terepththalic acid and, optionally, isophthalic acid as well as the diol components butanediol, diethylene glycol and triethylene glycol. A method of manufacturing this fiber structure is also provided. The fiber structure is used as a reinforcement material for polymer matrices, in particular epoxy resins. A fiber composite material containing at least one thermosetting resin as well as the fiber structure in accordance with the invention is furthermore provided.

Abstract: An aqueous amino resin dispersion excelling in storage stability and mechanical stability which is formed by dispersing hydrophobic amino resin in aqueous medium, using a polyester resin having specific hydroxyl value, acid value and number-average molecular weight as a dispersion stabilizer, said polyester resin being prepared by reacting polyhydric alcohol, polycarboxylic acid and/or polycarboxylic anhydride and monoepoxide compound having a long chain hydrocarbon group; thermosetting, water-based paint compositions comprising the aqueous amino resin dispersion; and multi-layered coating film-forming methods using the water-based paint compositions are provided.

Abstract: A polymeric composition for making aqueous polymeric dispersions, comprises hydrophilic macromonomer (I), hydrophobic polymer (II) and bridging monomer (III), wherein the hydrophilic macromonomer (I) and hydrophobic polymer (II) are grafted together in the presence of bridging monomer (III) and the hydrophilic macromonomer (I) has a structure according to formula (1): R—C(X)?CH2, wherein R is a polymeric group and X is a radical stabilizing group. The aqueous polymeric composition is used for making a coating composition, a printing ink, an adhesive, a sealant or caulking material.

Abstract: Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.

Abstract: The present invention relates to a method for producing an aramid core wire, containing a step of covering or impregnating an original yarn of an aramid core with a first treating agent containing a condensate of resorcin and formaldehyde, a latex and a water-soluble epoxy compound; an aramid core wire produced by the method; a transmission belt containing the aramid core wire; a method for producing the transmission belt; and a treating agent.

Abstract: The subject matter of the present invention relates to a blend comprising an epoxy resin, a cyclic carbonate, and a hardener comprising a polyalkoxypolyamine, another amine, and a catalyst, to a process for producing said blend, to the use of the blend of the invention for producing cured epoxy resin, and also to an epoxy resin cured with the blend of the invention, and in particular to fiber-reinforced cured epoxy resins for use in rotor blades for wind turbines.

Abstract: Provided is a curable composition for inkjet applied by an inkjet method, that has a long pot life even in the environment in an inkjet device warmed to 50° C. or higher and excellent insulation reliability by the cured product after curing despite containing a compound having a cyclic ether group. The composition for inkjet according to the present invention is applied by an inkjet method, and cures by heat addition, the composition for inkjet according to the present invention contains a compound having a cyclic ether group and a curing agent, and the curing agent is a reaction viscous product obtained by reacting dicyandiamide with a functional group-containing compound having a functional group reactive with the dicyandiamide.

Abstract: A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents.

Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.

Abstract: The present invention relates to aqueous polyurethane urea dispersions having integral functional groups and coating agents produced therefrom, to a method for the production thereof, and to the use thereof for producing coating agents.

Abstract: This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Abstract: An epoxy resin composition formed, at least in part, as the reaction product of a mixture comprising 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines, wherein each aromatic amine contains no more than two amine hydrogen atoms is provided. Also provided is a method of using the epoxy resin composition including incorporating the epoxy resin composition into a coating, an adhesive, a sealant, a casting, a laminate, or a composite.

Abstract: An inkjet ink composition includes: (a) particles of a polymer compound having at least one reactive functional group selected from the group consisting of an epoxy group, an acetoacetoxy group, a halomethyl group, a carboxylic acid anhydride, an amino group, a hydroxyl group, a phenolic hydroxyl group, and a carboxy group; (b) a reactive compound having a functional group that reacts with the reactive functional group of the (a) particles of the polymer compound by energy application; (c) a coloring agent; and (d) a water-soluble organic solvent.

Abstract: Embodiments of the present invention disclose a method for limiting peak exotherm temperatures in epoxy systems comprising the step of: combining an amine hardener, an epoxy and a diluent to form an epoxy system, wherein the diluent is selected from the group consisting of: ethylene carbonate, propylene carbonate, butylene carbonate, delta-valerolactam, delta-valerolactone, gamma valerolactone, butyrolactam, beta butyrolactone, gamma butyrolactone, and combinations thereof.

Abstract: A polyester film containing (A) a polyester, (B) a monofunctional glycidyl ether compound represented by the following general formula, and (C) a reaction promoter can prevent gelation and can reduce vaporization in forming a film, and is excellent in adhesiveness and weather resistance. In the formula, R1 represents an aliphatic hydrocarbon group, R2 and R3 represent an alkylene group, n indicates an integer of 1 or more, and m indicates an integer of 0 or more.

Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

Abstract: The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same, methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that posses a combination of excellent cure latency as well as low cure temperature onset.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): (B) a phenolic curing agent, (C) an accelerator in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of component (A), and (D) an inorganic filler in an amount of 20 to 900 parts by weight based on 100 parts by weight of component (A).

Abstract: A melamine epoxy resin monomer including: a glycidyl group; and a structural unit having a melamine residue and being represented by the following Formula (I) is disclosed. In Formula (I), each of R1 to R4 independently represents a hydrogen atom, a group represented by R5OCH2—, or a group derived from a melamine derivative and represented by the following Formula (II). R5 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a glycidyl group. In Formula (II), each of R21 to R25 independently represents a hydrogen atom, a group represented by R26OCH2—, or a group derived from a melamine derivative and represented by Formula (II). R26 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a glycidyl group.

Abstract: A barrier layer is provided for impeding the flow of inflation gas through an inflatable article, the barrier layer constructed of a material that is based upon a cross-linkable rubber composition, the cross-linkable rubber composition comprising, per 100 parts by weight of rubber (phr), between 50 phr and 90 phr of a butyl rubber and between 10 phr and 50 phr of a total amount of a GCO copolymer comprising epichlorohydrin derived units and allyl glycidyl ether derived units and a GECO terpolymer comprising epichlorohydrin derived units, allyl glycidyl ether derived units and ethylene oxide derived units, wherein the GECO terpolymer is between 1 percent by weight and 50 percent by weight of the total and also including a sulfur cure system.

Abstract: Disclosed herein is a block copolymer (M) suitable for toughening a thermoset resin (R). The block copolymer (M) has at least one block derived from a thermoplastic aromatic polymer (A) which exhibits a glass transition temperature (Tg) of at least about 150° C. and at least one block derived from a low Tg polymer (B) wherein: (i) the low Tg polymer (B) exhibits a Tg in the range of from about ?130° C. to about +40 ° C.; (ii) the aromatic polymer (A) is soluble in the uncured thermoset resin precursor(s) (P) of said thermoset resin (R), and (ii) the low Tg polymer (B) is insoluble in the uncured thermoset resin precursor (P).

Abstract: The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.

Abstract: Disclosed is a coating composition for a plastic label, which contains an oxetane compound, an epoxy compound, and a cyclic acetal and/or a poly(vinyl butyral). The coating composition excels in suitability for printing such as gravure printing or flexographic printing, cures rapidly to give excellent productivity, and after curing, gives a coating layer that excels in adhesion to a plastic base film and in toughness. A plastic label formed using the coating composition excels in surface scratch resistance and crumpling resistance, and therefore is particularly useful as a label for use in plastic containers, and metal containers such as bottle cans.

Abstract: The present disclosure provides a composition which includes a thermoplastic polyurethane, a flame retardant, and an epoxidized novolac resin. The flame retardant may be selected from one or more of the following: a melamine-containing compound, a nitrogen/phosphorus-based flame retardant, a phosphorus-based flame retardant, a metal-5 containing flame retardant, and combinations thereof. The composition may be a component of an article such as a coated wire or cable, with the composition present in the coating.