Abstract: A latent curing agent obtained by the reaction of a coumarin compound with an amine.

Abstract: The present disclosure provides polyamides and amidoamine curing agents including the reaction product of (1) a modified amine component comprising at least one multifunctional amine of structure 1: wherein R1 is selected from C1-C16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; R2 and R4 are hydrogen, R3 is R1 or hydrogen, X, Y, and Z are independently selected from C2-C10 alkylene, hexylene and cycloalkylene groups, n=0, 1, 2, 3, 4, 5, 6, or 7; and (2) a fatty acid component. Exemplary fatty acid components include at least one of monomer fatty acids, dimer fatty acids, trimer fatty acids, polymer fatty acids, esters of monomer, dimer, trimer, and polymer fatty acids and combinations thereof. The method for making the curing agents and articles formed therefrom are also disclosed.

Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Abstract: A polymer adhesive includes a polymeric binder, optional reinforcing fibers dispersed through the polymer binder and solids dispersed in the polymeric binder. The solids are effective to cause decomposition of the polymer adhesive at a temperature between 200° F. and 500° F. with a generation of gaseous products at a predetermined temperature. One suitable composition includes siloxirane, graphite, glass beads, potassium nitrate, silver nitrate and lactose and decomposes at a temperature of about 318° F. The polymer adhesive may be used in the assembly of a housing for rocket motor or a warhead. Decomposition of the polymer adhesive when the housing is exposed to sufficient external heat to cause a rocket propellant or warhead explosive to decompose, referred to as cook-off, enables venting of the rocket propellant or warhead without uncontrolled destructive rupture of the housing.

Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a hybrid hardener, whereby said hardener is a blend of b1) an aminic compound selected from aliphatic, cycloaliphatic, araliphatic amines, imidazoline group-containing amidoamines based on mono- or polybasic acids, adducts of said amines or amidoamines made from glycidyl compounds, adducts of said amines or amidoamines with cyclic carbonates, whereby said aminic compound contains, on average per molecule, at least two reactive hydrogen atoms bound to nitrogen atoms, and b2) a polyphenol novolac, and wherein the polyphenol novolac is used in an amount of from 30% to 45% by weight, based on the total weight of hardener blend comprising b1) and b2), useful for rapid setting and protective coatings and adhesives in application fields like civil engineering, marine, architectural and maintenance.

Abstract: Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the colour of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the coloured composition until the composition changes its colour and use of polymeric colourants as curing degree indicator, wherein the curing indicator is a polymeric colourant consisting of chromophores which are chemically bound to polymers having reactive groups.

Abstract: The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

Abstract: Disclosed is a curable formulation comprising a resin; all, or a substantial part, of which comprises one or more fatty acid esters, or their derivatives, obtained from plant oils. Due to the high viscosity of known curable resin materials, and in particular cationically photocurable and thermally curable resins epoxy resins, reactive diluents are conventionally added in order to reduce viscosity and render them suitable for certain methods of application, such as flexography and inkjet printing. However, if an excessive amount of reactive diluent is added to a formulation, the concentration of resin may be so low as to prevent a formulation from curing to form a cured, cross-linked material with acceptable properties. Thus the minimum viscosity of known formulations is limited by the amount of low viscosity reactive diluent which may be added to comparatively high viscosity resins.

Abstract: The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.26 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.

Abstract: A process for making a solid component out of recycled powder coat is provided. The process can include providing a powder coat material and providing a second material. Thereafter, the powder coat and the second material are mixed to produce a powder coat-second material mixture. The powder coal-second material mixture is processed in order to produce a polymer containing precursor. The processing can include granulating or densifying the powder coat-second material mixture. After the precursor has been produced, it can be placed within a molding machine and a solid component is molded. The molding machine can be an injection molding machine, an extrusion molding machine or a blow molding machine.

Abstract: A composition suitable for forming a paint marking on a roadway comprises a polyfunctional acrylate having at least four acrylate groups, an epoxy component and a polyfunctional amine. The polyfunctional acrylate reacts with the polyfunctional amine to form an adduct with secondary amine groups. The secondary amine reacts with the epoxy component to yield a chemically high crosslinked material having a no track time of less than about five minutes.

Abstract: The present disclosure provides an epoxy resin composition that has storage stability and allows the formation of cured products having flexibility. The epoxy resin composition is a one-pack type liquid epoxy resin composition comprising a polyfunctional linear epoxy resin having an epoxy equivalent of 400 or more, a tetrabasic acid anhydride having a melting point of 10° C. or higher, and an organic metal compound.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at ?40° C.

Abstract: Thermochromic coatings are improved by mixing thermochromic capsules with polymer resins in a manner that imparts shelf stability to flowable precursors that may be cured to form relatively hard coatings that are capable of withstanding machine operations, such as the operations needed to make beverage can lids, bottle caps, pull tabs and the like.

Abstract: Disclosed are a resin composition for encapsulating a semiconductor containing a phenol resin (A), an epoxy resin (B) and an inorganic filler (C), wherein the phenol resin (A) contains a polymer (a1) having a structure represented by the general formula (1), and the epoxy resin (B) contains at least one kind of epoxy resin selected from the group consisting of a triphenol methane type epoxy resin, a naphthol type epoxy resin and a dihydroanthracene type epoxy resin, and a semiconductor device, obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: A production method of an antireflection film comprises, in order, a step of applying a coating composition obtained by mixing the following components (A) to (D) on a base material to form a coating film, a step of drying the coating film to volatilize the solvent therefrom, and a step of curing the coating film to form a cured layer, wherein a multilayer structure having different refractive indexes is formed from the coating composition: (A) a compound having at least one structure selected from a fluorine-containing hydrocarbon structure and a polysiloxane structure and at least one basic functional group, (B) an inorganic fine particle, (C) a curable binder containing no fluorine atom in the molecule, and (D) a solvent, provided that the mass ratio of [component (A)+component (B)]/[component (C)] is from 1/199 to 60/40.

Abstract: An exemplary curable epoxy resin composition is disclosed which includes at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride; (b) an optional glycol or polyglycol; (c) or a compound containing two carboxylic groups is included; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10% of reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition.

Abstract: The present invention describes guanidine derivatives of the general formula (I) having the stated meanings for the residues R1, R2 and R3 as accelerators for cold-curing epoxy resin compositions. The curing of cold-curing epoxy resin systems may advantageously be accelerated with the assistance of these compounds.

Abstract: Disclosed are solvent borne thermosetting coating compositions that contain a curable polyester resin blended with an acrylic copolymer, a crosslinker, and a solvent. The polyester resin contains 2,2,4,4-tetramethyl-1,3-cyclobutanediol and exhibits good dry time, compatibility with acrylic resins, sag resistance and hardness development in a coating composition. The coating compositions can be used to prepare clear coat or pigmented coatings for automotive OEM, auto refinish, and other applications.

Abstract: Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an ?-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.

Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Abstract: A pigment dispersing resin is disclosed along with pigment dispersion, electrodepositable coating compositions using the pigment dispersing resin, and methods for applying the electrodepositable coating composition. The pigment dispersing resin consists essentially of the carboxylic acid salt of an aminated bisphenol epoxy resin and an alkoxylated styrenated phenol. Pigment dispersions made from the dispersing resin are especially useful for forming low or no volatile organic content electrocoating baths.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Abstract: An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.

Abstract: Provided are a semiconductor device producing method with simple production steps while preventing contamination of a bonding pad and preventing warp generation in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element 13 to an adherend 11 through an adhesive sheet 12, and a wire bonding step of wire bonding the element 13 in the bonding temperatures range of 80 to 250° C. without performing any heating step, wherein, as the adhesive sheet 12, a sheet having a storage elastic modulus of 1 MPa or more in the temperature range of 80 to 250° C. or a storage elastic modulus of 11 MPa or more at any temperature in the temperature range before curing the sheet 12 is used.

Abstract: The invention relates to a method for reducing the negative effects of adhesive contaminants in the processing of waste paper, wherein an aqueous polymer dispersion comprising one component A and one component B for coagulation and detackification of stickies is added during the processing of waste paper, wherein component A is a homo- and/or copolymer of methyl methacrylate, acrylate and/or styrene and component B is a styrene copolymer having acrylic acid, maleimide and/or maleic acid hydride. The polymer dispersion can optionally comprise another component C, a cationic fixing agent that supports the coagulation of the stickies.

Abstract: The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.

Abstract: A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.

Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation thereof. The present invention can provide a transfer material or a surface protection sheet having a high refractive index and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.

Abstract: The invention relates to biaxially oriented polyester films that include a chain extender in addition to the polyester. Such films find use in all applications typical of biaxially oriented polyester films, especially in outdoor films, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.

Abstract: Method of preparing a particle dispersion within a polymer is disclosed. The dispersion may include core shell rubber particles and the polymer may include epoxies. The particles are capable of being substantially dispersed within the polymer so as to substantially inhibit agglomeration of the particles. Mechanical properties, such as toughness are improved while glass transition temperature and viscosity are not substantially impaired by the presence of the particles.

Abstract: This invention provides a process for producing an epoxy resin composition having core/shell rubber particles (rubber-like polymer particles) dispersed in an epoxy resin, wherein an epoxy resin composition excellent in the dispersed state of rubber-like polymer particles in an epoxy resin with a reduced amount of contaminants is produced easily and efficiently. The epoxy resin composition having rubber-like polymer particles dispersed well in an epoxy resin with less contaminant is obtained by bringing an aqueous latex of rubber-like polymer particles (B) into contact with an organic medium (C) showing partial solubility in water, then bringing an organic medium (D) having lower partial solubility in water than that of the organic medium (C) into contact therewith to separate water substantially, to remove the rubber-like polymer particles as a dispersion (F) having the polymer particles dispersed in the organic medium, and mixing it with an epoxy resin (A), followed by distilling volatile components away.

Abstract: A resin with high heat transfer and potential is specially designed to transfer heat between two layers of different nature. One of the layers acts as an energy receiver via the outer face thereof and an energy emitter via the inner face thereof, and the other layer acts as a receiver of the accumulated energy in the resin, acting as connecting bridge between the two layers. The resin with high heat transfer of the invention includes granular particles of slate and preferably granular particles of a metallic nature, in a polymeric matrix.

Abstract: The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R1 represents an unsubstituted or fluorine-substituted monovalent hydrocarbon group.

Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.

Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device, the composition including an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an additive, wherein the epoxy resin includes an epoxy resin represented by Formula 1:

Abstract: Underfill materials include inorganic fill materials (e.g., functionalized CNT's, organo clay, ZnO) that are functionalized reactive with other organic constituents (e.g., organics with epoxy groups, amine groups, or PMDA). The underfill materials also beneficially include polyhedral oligomeric silsesquioxane and/or dendritic siloxane groups that are functionalized with a reactive group (e.g., glycidyl) that reacts with other components of an epoxy system of the underfill.

Abstract: In general, the invention features a pressure sensitive adhesive that comprises the reaction product of: (a) from about 25 to about 95 parts by weight of at least one acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0° C., (b) from 0 to about 75 parts by weight of at least one non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a Tg greater than 15° C.; and (c) from about 5 to about 35 parts by weight of at least one polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a Tg greater than 15° C. The pressure sensitive adhesives adhere to substrates having a low surface energy and/or high surface energy.

Abstract: A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition.

Abstract: An adhesive composition for flip-chip-mounting a chip component on a circuit board contains an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The amount of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass based on 100 parts by mass of the alicyclic epoxy compound, and the amount of the acrylic resin is 5 to 50 parts by mass based on 100 parts by mass of the total amount of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin is a resin obtained by copolymerization of 100 parts by mass of alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate and having a water absorption rate of 1.2% or less.

Abstract: Tackfied PSAs and tapes comprising a copolymer based on an acrylic backbone, with a glycidyl monomer, unsaturated carboxylic acid monomer and a tackifier, said adhesives being dual curable and having combination of outstanding peel adhesion on the LSE substrates, high temperature shear performance, excellent stress relieving properties and excellent converting properties.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent thermal resistance, low water absorption, and good elastic modulus, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent thermal resistance, mechanical property and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.

Abstract: A non-aqueous dispersion comprising the dispersion polymerization reaction product of an ethylenically unsaturated monomer and a nonlinear, random acrylic polymer stabilizer wherein the polymerization reaction product comprises epoxy functionality is disclosed. Related coatings, methods, and substrates are also disclosed.

Abstract: The present application relates to a method for preparing epoxy resins from a mixture of epoxidized phenolic compounds, wherein said epoxidized phenolic compounds are obtained by the epoxidation of natural phenolic compounds selected from the group comprising simple phenol, acid-phenol, coumarin, naphthoquinone, stillbenoid, flavonoid, isoflavanoid, anthocyanin, condensed tannin and hydrolyzable tannin.

Abstract: Resin compositions comprise an epoxy thermosetting resin; and at least two types of interlaminar toughening particles; wherein a first type of interlaminar toughening particles are insoluble in said epoxy thermosetting resin; wherein a second type of interlaminar toughening particles are partially soluble or swellable in said epoxy thermosetting resin. Prepregs and structural compounds contain these resin compositions, which are useful in the aerospace industry.

Abstract: The present invention relates to water soluble open time extenders, which are mixed with an architectural coating, such as aqueous latex paints, to increase the coating's open time and crosslink to the architectural coating upon drying. The open time extender comprises neutralized water soluble polymers with hydrophobic, hydrophilic and cross-linkable monomers, and at least one crosslinking agent. The open time extender also comprises water and the total solid content of the open time extender is less than about 25% by weight.

Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent processability, thermal resistance and humidity resistance, and low water absorption, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent processability, thermal resistance and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.

Abstract: The present invention generally relates to self healing polymer materials comprising thermoset and thermoplastic polymers. The present invention also relates to a method of manufacturing self healing polymer materials, methods of post-curing and healing the self healing polymer materials, composite materials comprising self healing polymer materials and methods of preparing the composite materials. In an attempt to develop improved structural materials, polymers and polymer materials have been identified that can be used in materials to act as self healing agents to repair structural damage occurring in the materials. The self healing polymer materials that have been identified are capable of being healed under post-curing or healing conditions.

Abstract: A polyglycidyl ether compound having a plurality of epoxy groups and a hydroxy group in the molecule is reacted with a silane coupling agent having an isocyanate group, and specifically the hydroxyl group on the polyglycidyl ether compound is reacted with the isocyanate group on the silane coupling agent. Then an organosilicon compound having a plurality of epoxy groups per alkoxysilyl group is synthesized wherein the ratio of epoxy groups to alkoxysilyl groups may be adjusted as desired. The resulting organosilicon compound is useful as a primer and resin modifier.