Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.

Abstract: A system and method for evaluating equipment in a data center, the equipment including a plurality of equipment racks, and at least one cooling provider. In one aspect, a method includes receiving data regarding each of the plurality of equipment racks and the at least one cooling provider, the data including a layout of the equipment racks and the at least one cooling provider, a power draw value for each of the equipment racks, and a maximum cooler capacity value for the at least one cooling provider; storing the received data; determining cooling performance of at least one of the plurality of equipment racks based on the layout; determining a cooling load for the at least one cooler and a difference between the cooling load and the maximum cooler capacity value; for each equipment rack, determining a maximum rack capacity based on the layout and the difference between the cooling load and the maximum cooler capacity value; and displaying an indication of the maximum rack capacity for each equipment rack.

Abstract: An exemplary computer case includes an external shell, a circuit board received in the external shell, and a dehumidification device. The circuit board includes a PCI socket providing an auxiliary power supply when the computer shuts down but the computer case retains electrical connection with an external AC power source. The dehumidification device includes a dehumidification card received in the PCI socket for obtaining the auxiliary power supply therefrom and a remote device. The dehumidification card includes a fan for generating airflow to remove moisture from the computer case and a sensor detecting a humidity inside the computer case. The remote device includes a display unit for displaying the result. When the humidity exceeds a predetermined value, the computer is not powered up until the fan evacuates the excess moisture from the computer case and the humidity falls below the predetermined value.

Abstract: A container data center includes a mobile container and a number of server systems. The mobile container includes a bottom wall, an inner container portion and an outer container portion. The inner container portion includes a first top wall opposite to the bottom wall, and a number of first sidewalls connected between the first top wall and the bottom wall. The outer container portion includes a second top wall facing the bottom wall, and a number of second sidewalls connected between the second top wall and the bottom wall. The second sidewalls surround the inner container portion. A passage is formed between the first and second top walls and between the first and second sidewalls. The second top wall and the second sidewalls define a number of through holes. The server systems are installed in the inner container portion.

Abstract: A radiographic image capture device is equipped with a radiographic detector and a retention portion. The radiographic detector acquires a radiographic image in accordance with incident radiation, and has a heat-generating body inside. The retention portion is provided so as to be in contact with the heat-generating body of the radiographic detector, detachably retains a power supply portion, and is thermally conductive.

Abstract: A method of calculating sensible cooling capacity of a cooling unit includes obtaining compressor capacity, subtracting compressor heat loss from the compressor capacity, subtracting latent cooling capacity from compressor capacity, and subtracting fan power loss from the compressor capacity. Methods of controlling a cooling unit and embodiments of a cooling unit are further disclosed.

Abstract: A climate management system for a power supply system including a plurality of cabinets is disclosed. The climate management system comprises a plurality of climate control units connected and in communication with each other, wherein each climate control unit is disposed in a corresponding cabinet to monitor, manage and control the corresponding cabinet, wherein one of the climate control units is defined as a master climate control unit and the other of the climate control units are defined as slave climate control units; and a control system unit connected and in communication with the master climate control unit. The master climate control unit is configured to collect, process and integrate the information transmitted from the slave climate control units and report the collected, processed and integrated information to the control system unit.

Abstract: It is an object to provide a transmission system that is more suitable for transmission of a large volume of data than a cable or an optical fiber is and capable of coupling a transmission path and an electronic device easily without using a connector. A tape-form communication sheet is configured by a sheet body, plural coupling nodes regularly arranged in line and fitted in the sheet body, and a signal transmission wiring, wherein an interface of a computer having the interface similar to this coupling node is connected to the coupling node of the tape-form communication sheet for transmitting a signal. The coupling nodes are configured by an arrayed antenna and a communication circuit unit including a signal In/Out unit, a memory, a signal reception/output unit, and a CPU connected to the signal In/Out unit, the memory, and the signal reception/output unit, wherein the signal transmission wiring is connected to the signal In/Out unit of the respective coupling nodes.

Abstract: In an image formation state, to cool a recording sheet on a route from a fixer to a paper ejection roller, a blast fan assumes a first position restrained by a first fixture. Also, in another state, to cool a recording sheet on the catch tray, the blast fan assumes a second position restrained by a second fixture. To transition from the image formation state to another state, the blast fan sends a strong blast in a reverse direction from the normal blast direction. A bias is generated on the blast fan due to the resulting reactive force, the blast fan becomes free from the restraint of the first fixture, and shifts from the first position to the second position. Conversely, to transition from another state to the image formation state, a strong blast is sent in the same direction as the normal blast direction, and the blast fan shifts from the second position to the first position.

Abstract: The invention concerns a unit with electronic components, which, when in operation, generate heat. The unit comprises a carrier plate, upon the first section of which a first group of electronic components is placed. Upon a second section thereof is installed a plurality of cooling ribs for the removal of heat produced by the electronic components. The cooling ribs are designed to be curved to a predetermined extent along their longitudinal axis and to lie in a plane parallel to the said carrier plate.

Abstract: A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

Abstract: A method and apparatus for cooling modules in a radio system is disclosed. The apparatus comprises an adaptor module with side walls and integrated heat exchanging elements. The adaptor module adapts the air flow from a chassis in the radio system such that the exiting ducting on the chassis efficiently mate with the air conduits in the modules. The adaptor allows the use of new high power density modules in the existing chassis without changing the module design. The use of adaptor module in chassis provides efficient cooling and use less volume in the chassis.

Abstract: A container data center includes a container, at least one power supplying assembly, at least one cooling assembly, and at least one server assembly. The power supplying assembly, the cooling assembly, and the server assembly are received in the container. The cooling assembly is positioned between the power supplying assembly and the server assembly. The power supplying assembly includes a first frame and a plurality of power boxes supported in the first frame, and is for supplying power to the cooling assembly and the server assembly. The cooling assembly includes a second frame and a plurality of cooling devices supported in the second frame, and is for cooling the power supplying assembly and the server assembly. The server assembly includes a third frame and a plurality of servers supported in the third frame.

Abstract: A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A heat exchanger apparatus is provided and includes a motor controller housing, supportively disposed with a turbofan within an aircraft engine nacelle, in which motor controller components are mounted, a fuel cooled cold plate, forming a surface of the housing, which forms a heat transfer path by which motor controller component generated heat is dissipated during first conditions and an air cooled cold plate, disposed in thermal communication with the fuel cooled cold plate, which extends into a flow path of nacelle air generated by the turbofan to form an extended heat transfer path by which the motor controller component generated heat is dissipated during second conditions.

Abstract: A heat dissipation apparatus includes an air conditioning unit, a plurality of temperature sensors, a plurality of adjustable air outlet boards, a plurality of actuators, and a control unit. The temperature sensors determine the temperature of server racks. The adjustable air outlet boards guide airflow from the air conditioning device to the corresponding server racks. The actuator adjusts the corresponding adjustable air outlet board to alter the airflow to the corresponding server rack. The control unit receives the temperature detected by the temperature sensors to submit corresponding control signals, altering power supplied to the air conditioning unit and adjust the adjustable air outlet boards through the actuators. The present disclosure further provides a heat dissipation method and a container data center including the heat dissipation apparatus as disclosed.

Abstract: A flat panel display apparatus includes a display panel, a chassis configured to support a backside of the display panel, and a flexible circuit board on which a driving circuit for driving the display panel is mounted. The chassis includes a first flat plate bonded to the display panel on a surface side, and a second flat plate bonded to a front cover arranged on the surface side of the display panel. The flexible circuit board has one end connected to the display panel, and another end arranged between the first and second flat plates. The second flat plate includes a plurality of flange portions formed to be bonded to the front cover.

Abstract: A power converter arrangement has two static switching element bridges that are alternatively operable and comprise static switching elements. The power converter arrangement has one housing that houses the two static switching element bridges; the housing has one cooling system for the static switching element bridges housed therein.

Abstract: Disclosed herein are electric vehicle control device which can distribute the heat generated by the semiconductor devices in the DC/AC converter efficiently. Also disclosed herein are methods of converting DC to AC while keeping the heat value of the semiconductor devices stable.

Abstract: A display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a ventilation part defined outside the accommodation room and leading to outside of the housing, a display panel arranged inside the accommodation room and including a display screen viewable from a front surface side of the housing, and one or a plurality of heat pipes arranged on a rear surface side of the display panel. The heat pipe passes through a side surface wall forming the accommodation room and extends from inside of the accommodation room to inside of the ventilation part.

Abstract: Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

Abstract: Parallel plate bus structures are commonly used for high-current applications where low inductance is a requirement. Such bus structures are very well suited for inverter topologies used to convert from DC to AC power and a capacitor is needed to minimize ripple on the DC bus. However, such arrangements are not able to provide sufficiently low inductance to easily eliminate bypass capacitors which typically requires a system inductance below 10 nH nor do they provide any natural EMI suppression. The present invention utilizes that natural circular symmetry of a circular film capacitor winding by implementing a coaxial shaped bus connection from the capacitor to the switching semiconductors in the DC bus application of DC to AC inverter. The result is an achievement of lower ESL and geometry based EMI suppression without the use of external-lumped filtering components.

Abstract: The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

Abstract: The present invention provides a display apparatus including a display panel, and a plurality of adjustment mechanisms respectively arranged for a plurality of areas on a rear surface of the display panel and configured to adjust a temperature of the display panel for each of the areas, each of the plurality of adjustment mechanisms including a heat radiating unit mounted on a rear surface of the display panel and configured to form a gas flow passage on the rear surface of the display panel, and a changing unit configured to change a flow rate of a gas flowing into the gas flow passage in accordance with a temperature of an area on the rear surface of the display panel which corresponds to the heat radiating unit.

Abstract: A LCD device includes color LEDs, a light-mixing optical guide plate and a main optical guide plate for guiding lights from the color LEDs, a LCD panel for receiving lights from the main optical guide plate, a housing for supporting the LCD panel, light-mixing optical guide plate and main optical guide plate in block, and a heat sink for dissipating the heat transferred from the LEDs. On the rear surface side of the light-mixing optical guide plate, a heat receiving member is provided having a higher heat receiving capability than the rest of the housing.

Abstract: A keyboard adjusting heat dissipation efficiency of a heat dissipation unit disposed in a host device and including a switching unit, a control unit, and a communication port is disclosed. The switching unit is switched to different states. The control unit generates a control signal according to the state of the switching unit. The communication port transmits the control signal to the host device. The host device adjusts the heat dissipation efficiency of the heat dissipation unit according to the control signal.

Abstract: An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.

Abstract: A system and method for evaluating equipment in an improper cluster in a data center, the equipment including a plurality of equipment racks, and at least one cooling provider. In one aspect, the method includes receiving data regarding each of the plurality of equipment racks and the at least one cooling provider, the data including a layout of the improper cluster of equipment racks and the at least one cooling provider, storing the received data, identifying at least one gap in the layout, determining cooling performance of at least one of the plurality of equipment racks based, at least in part, on characteristics of the at least one gap, and displaying the layout of the data center, wherein the layout includes an indication of the cooling performance of the at least one of the plurality of equipment racks.

Abstract: Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor. According to the present invention, cooling efficiency of the capacitor is maximized and fixing force of the capacitor in the cooling case is superior so that product reliability of the capacitor module can be improved.

Abstract: System and method for controlling a fan. A value may be received for controlling the fan. The value may include a first number of bits and may correspond to a linear function of temperature. A first value may be determined using a first number of bits of the value. A modification to the first value may be determined based on a second number of bits of the value. A new output value may be generated based on the first value and the modification to the first value. The new output value may correspond to a first nonlinear function of temperature. The new output value may be provided for controlling the fan.

Abstract: Microprocessor, miniprocessor and heat sink surfaces having increased surface areas and increased heat dissipation are femtosecond pulsed laser machined. Nano structures formed and created on surfaces by the femtosecond pulsed laser machining provide increased surface areas which radiate heat by intensified IR radiation.

Abstract: A fan control system includes a controller that is coupled to a plurality of fan couplers. A computer-readable medium is coupled to the controller and includes a first fan identification corresponding to a first fan, a second fan identification corresponding to a second fan, and at least one fan property associated with each of the first fan identification and the second fan identification. The controller is operable to monitor at least one operating parameter of each of the first fan and the second fan when the first fan and the second fan are coupled to a respective fan coupler. The controller is further operable to use the at least one fan property associated with each of the first fan identification and the second fan identification and the at least one operating parameter of each of the first fan and the second fan in order to adjust a speed of the second fan relative to a speed of the first fan.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: An electronic device is provided, including a processing unit and a G-sensor electrically connected thereto. The G-sensor detects the posture of the electronic device and outputs a measurement signal to the processing unit accordingly. The processing unit produces a thermal control signal according to the measurement signal, so as to reduce heat generated from the electronic device or increase cooling efficiency of the electronic device.

Abstract: An electronic device includes a case having a vent defining a plurality of holes. The electronic device further includes an adjusting plate movably mounted on the case and aligning with the vent, and the adjusting plate defines a plurality of holes. A plurality of vent regions are defined on the vent, at least one hollow region and at least one tangible region are defined on the adjusting plate. The adjusting plate is movable relative to the vent such that the plurality of the holes of the adjusting plate aligns with, or the adjusting plate partially blocks or totally blocks, the plurality of holes of the vent.

Abstract: The present invention relates to a battery management system for a battery module comprising a plurality of cells connected to one another which each have a positive and a negative terminal. The invention is in particular concerned with a battery management system which is used with accumulators especially lithium ion cells for forming a traction battery or a traction battery module for vehicles with an electrical drive drain. Such battery modules can for example be used in electrical vehicles, hybrid vehicles with combustion engines or hybrid vehicles with fuel cells, can however also be used for other purposes, for example for stationary applications or for small traction applications, such as for example in a wheelchair.

Abstract: In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block.

Abstract: An electronic device includes a circuit board comprising a first metal layer and a second metal layer. The first metal layer is affixed to one side of the circuit board, and the second metal layer is affixed to the first metal layer. A channel is defined between the first metal layer and the second metal layer. A coolant container is used to accommodate coolant. A driving unit is used to drive the coolant to circuit in the channel.

Abstract: A synthetic jet device includes a housing, a connector within the housing configured to communicate with an exterior power source, driver electronics within the housing, a first membrane within the housing, and a second membrane within the housing.

Abstract: A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.

Abstract: According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Abstract: A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: Scalable Electronics, Computer, Router, Process Control and other Module/Enclosures Employing Approximated Tessellation/Tiling or Electronics and Other Modules from Two Modules to Columns, Rows and Arrays with Optional Deployment utilizing Palletization for Build out of Existing Industrial Space And/or New Construction with nestable wiring applicable from module and assembly and chip level to molecular and atomic levels.

Abstract: An electronic device includes: a first housing that includes an inlet and an outlet on one end; a second housing; and a linkage section that links the second housing to the first housing such that the second housing can be opened and closed. The device is configured such that the second housing divides at least a part of a space between the inlet and the outlet while the second housing is in the open position relative to the first housing. While the second housing is opened relative to the first housing, the second housing divides the space between the inlet and the outlet, thereby preventing the exhausted warm air from being drawn into the electronic device.

Abstract: A backlight assembly and a display device having the same, the backlight assembly including a light guide panel that guides fight, a light source to generate light, being mounted to at least one end of the light guide panel, and a bottom chassis made of a reflective resin capable of reflecting light and mounted to cover a rear side of the light guide panel.

Abstract: A power module for an inverter which includes a base which has a plurality of slots are formed thereto, a plurality of building blocks inserted into the slots and power cables interconnecting the building blocks. Further, each of these building blocks is provided with a power element which corresponds to one phase. Thus, each building block in the power module may be replaced individually without having to replace the entire power module in case of a failure in a single power element of the power module.

Abstract: A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar.