Abstract: A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.

Abstract: An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.

Abstract: The present invention relates to a heat spreading element with an AlN film including: a substrate which may be composed of a single bulk material, a multi-layered sample, or a composite material; and an AlN film deposited on the surface of the substrate, wherein the thickness of the AlN film is in a range of 1 nm to 10 ?m, and the AlN film is used to conduct the heat from a heat-generating device to the substrate, and method for manufacturing the same.

Abstract: Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.

Abstract: A modular power supply (1) includes a primary input portion (2) operating with predetermined input parameters, and an output portion (3) comprising at least two modules (4) to be selected for modifying the power supply's output parameters. It is further provided a container (5) in which the primary input portion and the output portion are housed. The container comprises an inaccessible portion (6) adapted to house the primary input portion separated from the output portion, and a cover (7) hinged on a base structure (8) of the container for access to the output portion. The inaccessible portion of the container comprises a partition (9) disposed between the primary input portion and the output portion and provided with openings (10) for cooling the primary input and secondary portions. The openings are such disposed that access to the primary input portion is not allowed.

Abstract: An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets. This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.

Abstract: A method for providing control signals to a fan in a computer system is described. During the method, an electronic device receives temperature measurements and a fan-speed measurement performed in the computer system. Using a pattern-recognition model, the electronic device validates the measurements, and excludes any inaccurate measurements, such as those associated with drifting or failed sensors. Next, the electronic device determines control signals for a fan in the computer system using a model of coolant flow in the computer system and/or a slope of a phase-frequency curve of a cross power spectral density function corresponding to a pair of temperature profiles measured, as a function of time, by a pair of thermal sensors. Then, the determined control signals are provided to the fan.

Abstract: The present invention relates to a self-cooled thyistor device for ultra-high voltage fault current limiter. a self-cooled thyristor valve, it adopts horizontal structure consisted by frames, frames is divided into upper and below two spaces by crossbeams, the bottom of frames is supported by insulators. There is a cross plate between two vertical said frames, the cross plate mounts resistors connect with a high potential plate and capacitor through two wires. There is a thyistor string in said frame upper space, which is constituted of thyistors and cooler series. The thyistor string is compressed tightly by press-fit mechanism, thyistor string crosses current transformers. There are high potential plates on both sides of the thyistor, the number of the potential plates is equal to that of thyistor. One side of the high potential plates links frames, said current transformers connects with high potential plates.

Abstract: The disclosure refers to an electronic device and methods for cooling an object within the electronic device. In one example, an electronic device includes a cooling fan for cooling an object. An air-quantity measuring device measures a quantity of cooling air sent by the cooling fan. An ambient-temperature measuring device measures an ambient temperature around the electronic device. A control unit is configured to control the electronic device. The control unit includes an object-temperature calculating section configured to calculate a temperature of the object from the measured air quantity and the measured ambient temperature. An operation control section is configured to control the cooling fan according to the calculated temperature of the object.

Abstract: An assembled structure includes an electronic component, a heat-dissipating device and a stepped isolation member. The electronic component has a first perforation. The heat-dissipating device has a second perforation corresponding to the first perforation of the electronic component. The stepped isolation member includes a first segment, a second segment and a third segment. The outer diameter of the first segment is smaller than the outer diameter of the second segment, and the outer diameter of the second segment is smaller than the outer diameter of the third segment. The first segment is partially accommodated within the first perforation of the electronic component, the second segment is arranged between the first segment and the third segment and engaged with the second perforation of the heat-dissipating device, and the third segment is contacted with the heat-dissipating device.

Abstract: A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.

Abstract: Disclosed is an image projecting apparatus having a cooling device, which cools heat generated from a plurality of light sources respectively emitting light of different colors and heat generated from a display device simultaneously, while effectively dispersing the heat. The image projecting apparatus includes a projecting system which projects light; a display device disposed in series with the projecting system; an optical system disposed in parallel with the projecting system, and including a plurality of light sources which transmit the light to the display device and generate heat when the light is transmitted to the display device; a heat dissipation device disposed at an outer edge of the optical system which dissipates the heat generated from the plurality of light sources; and a cooling fan disposed opposite to the display device, which inhales air and discharges the air to the heat dissipation device.

Abstract: A display assembly includes at least a protective cover layer, a display stack that includes a plurality of display components arranged in a plurality of interconnected layers, the display stack providing an imaging service, and a flat support chassis arranged to provide support for the display stack. In the described embodiment, the display stack is positioned between the protective cover layer and the flat support chassis. The display assembly can be disposed within a housing with sides sloping inwards where a portion the display assembly is proximate to the inward sloping sides. To allow the display assembly to fit closer to the edges of the housing, material can be removed from the flat support chassis. For example, edges of the flat support chassis can be chamfered.

Abstract: A socket and heat sink unit includes a socket portion configured to releasably couple to a removable LED light module. The unit also includes a heat sink portion attached to the socket portion and extending about a central axis. The heat sink portion comprises a plurality of fins, as well as one or more apertures configured to receive fasteners therein to fix the unit to a light fixture housing. The socket and heat sink portions are monolithic.

Abstract: Electronic components of an energy meter are mounted in an encapsulated compartment within a sealed outer enclosure of the meter. The encapsulated compartment is advantageously positioned to form air channels between the encapsulated compartment and the sealed outer enclosure to deliver thermal air circulation there-between to promote sufficient heat transfer through an outer skin of the sealed outer enclosure for maintaining acceptable thermal conditions for the encapsulated electronic components.

Abstract: A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank.

Abstract: An apparatus, system, and method are disclosed for fault tolerant cooling in a redundant power system. The apparatus receives power from a common power bus to power one or more power supply fans. The apparatus detects a non-functioning redundant power supply. The apparatus receives a fan control signal within a non-functioning redundant power supply. In addition, the apparatus uses the received fan control signal to synchronize a fan speed of a power supply fan within the non-functioning redundant power supply. The fan speed is synchronized with at least one fan control signal of a power supply fan within a functioning redundant power supply. Thus, the power supply fans of a non-functioning power supply continue to operate and are synchronized with power supply fans in functioning power supplies.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: A thermoelectric semiconductor component, comprising an electrically insulating substrate surface and a plurality of spaced-apart, alternating p-type (4) and n-type semiconductor structural elements (5) which are disposed on said surface and which are connected to each other in series in an electrically conductive manner alternatingly at two opposite ends of the respective semiconductor structural elements by conductive structures, in such a way that a temperature difference (2?T) between the opposite ends produces an electrical voltage between the conductive structures or that a voltage difference between the conductive structures (7, 9; 13, 15) produces a temperature difference (2?T) between the opposite ends, characterized in that the semiconductor structural elements have a first boundary surface between a first and a second silicon layer, the lattice structures of which are considered ideal and are rotated by an angle of rotation relative to each other about a first axis perpendicular to the substrate su

Abstract: A stand for a portable device includes two supporting members with two supporting surfaces for loading the portable device, and a heat dissipation device detachably attached between the two supporting members. The heat dissipation device comprises at least one fan and defines a plurality of holes.

Abstract: A fluid-cooled electronic housing assembly (“FCEHA”) configured for mounting within a vehicle is described. The FCEHA may be part of a fluid-cooled electronic system (“FCES”) that includes the FCEHA and a plurality of electronic components. The FCEHA is capable of providing effective cooling for the FCES while maintaining a small space requirement by utilizing a fluid cooling system that cools the housing of FCEHA. In general, the FCEHA includes a cooling-fluid channel through a heat sink that, in operation, allows a cooling fluid/liquid to flow throw the cooling-fluid channel and cool off the FCEHA more efficiently that air convection because the cooling fluid is more efficient in heat transport.

Abstract: A flat display apparatus includes a display unit; a housing configured to accommodate the display unit; a support member configured to support the housing; and a cooling device configured to radiate heat of a heating element which is mounted in the housing, wherein the cooling device includes a first far infrared ray transfer member which is thermally connected to the heating element in the housing and a second far infrared ray transfer member which is thermally connected to an external portion of the housing at a rear surface side, wherein a radiating surface of the first far infrared ray transfer member and an absorbing surface of the second far infrared ray transfer member are disposed to oppose each other with the housing interposed therebetween, and wherein heat radiated from the first far infrared ray transfer member is radiated at both plane surface of the second far infrared ray transfer member.

Abstract: An image displaying apparatus, which is excellent in heat radiation efficiency and has an excellent back design, comprises: a display panel for displaying an image; a heat generating member provided on a back side of the display panel; a cabinet for covering the display panel and the heat generating member at least from the back side of the display panel, wherein, on the cabinet, an aperture is provided at a position facing the heat generating member; and an opening/closing unit for enabling to switch between closing and opening of the aperture. In a state that the aperture is opened by the opening/closing unit and one part of a heat-transfer member is positioned on a side of the cabinet opposite to the display panel, the other part of the heat-transfer member extends through the aperture so that the heat-transfer member can thermally be connected to the heat generating member.

Abstract: A secure control unit is provided with a completely sealed casing (22) of which at least one wall (24) forms a heat sink. The circuit board provided in the casing (22) is designed such that all of the heat generating components (16-20) which require cooling are located on the lower side of the circuit board (10) and in thermal connection with the heat sink wall (24). Components which do not generate excessive heat are located on the upper side of the circuit board (10). Raised conductive blocks (32-36) couple thermally the components (16-20) to the wall (24). With this arrangement it is not necessary to provide cooling internally of the casing (22) and it is possible nevertheless to use high powered components of the type which are found in modern computers. The casing remains secure and thus suitable for high security applications.

Abstract: An internal device arrangement for a passenger cabin, for example of an aircraft, comprises an internal device element (15) which is selected from a group consisting of wall panelling, window panel, side panel, ceiling panelling and luggage compartment; an electrical apparatus (1) such as a lighting element, for example, which is fitted in or on the internal device element (15); and at least one line (2) for supplying power to the electrical apparatus (1). Furthermore, a heat dissipation device (6a . . . f) in the form of an integral component part of the internal device element (15), the electrical apparatus (1) and/or the at least one line (2) is provided. Such a heat dissipation device (6a . . . f) makes it possible to dispense with an additional heat sink for temperature management and thus for savings to be made in terms of installation space and weight.

Abstract: An enclosure for electronics includes a body with a metal component and a polymeric component overmolded onto the metal component so as to be connected to the metal component without fasteners. The body defines a recess. A heat sink is defined in the metal component. A printed circuit board is located in the recess and includes a plurality of electronic components mounted thereon.

Abstract: A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank body 26 having an expanded portion 27, which expands upward and opens downward, and a bottom plate 28 joined to the lower end of the tank body 26 to thereby close a bottom opening of the expanded portion 27. A through-hole 29 is formed in the top wall of the expanded portion 27 of the tank body 26 and serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel 5. A hydrogen-permeable member 31 is fixedly fitted into the through-hole 29 so as to stop the through-hole 29. The hydrogen-permeable member 31 satisfies the relation B?50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member 31.

Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.

Abstract: An electrical or electronic composite component is described as having a first joining partner and at least one second joining partner. According to the present system, it is provided that a sintered compact having open porosity is accommodated between the first and the second joining partner, the sintered compact is connected fixedly to the first and to the second joining partner.

Abstract: A power conversion apparatus is provided which includes a semiconductor module which include a switching element, a cooler which cools the semiconductor module, and has a pair of cylindrical pipes which introduce a cooling medium to a channel therein or discharge the cooling medium, a frame which holds the cooler, and a pair of clamps which fix the cylindrical pipes to the frame. Each of the clamps has a fastener portion which is fastened to the frame, and a pressing portion which presses the cylindrical pipe toward the frame. Each of the cylindrical pipes is held between a concave support portion, which is formed in the frame, and the clamp. Each of the cylindrical pipes is supported by two support surfaces of the concave support portion and the pressing portion of the clamp at three support points when viewing from the direction in which the cylindrical pipe extends.

Abstract: Disclosed is a data center comprising a first row of equipment racks, a second row of equipment racks, a hot aisle defined by a space between the first row of equipment racks and the second row of equipment racks, and a track system above the hot aisle of the data center upon which cooling units may be mounted. Cooling units may be moved along the track system. The track system may include portions of track secured to the top sides of one or more cooling units. Also disclosed is a method for installing a cooling unit above a hot aisle of a data center including a plurality of equipment racks.

Abstract: A high power amplifier that has a high heat dissipation effect and is produced at low cost, a wireless transmitter and a wireless transceiver with the high power amplifier and a method for mounting a high power amplifier are provided. The high power amplifier comprises a transistor with lead wires extending from both side surfaces of a mold provided on a heat dissipation member to the outside, a double-sided wiring board of which the heat dissipation member is inserted in an opening of the double-sided wiring board and a wiring pattern on one surface of the double-sided wiring board is electrically connected to the lead wires, and a case for accommodating the double-sided wiring board. Further, the high power amplifier comprises a plate of which one main surface is in contact with an inner wall of the case and the other main surface is connected to the heat dissipation member and a wiring pattern on the other main surface of the double-sided wiring board.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a piezoelectric pump cooling air by a piezoelectric element; a drive circuit driving the piezoelectric element; and a control circuit monitoring and controlling operation of the audio input section, the audio recording section, and the drive circuit, wherein when an operation mode being monitored is an audio recording mode, in which the input sound is used for recording by the audio recording section, the control circuit controls the drive circuit to decrease the amount of air flow exhausted outside from the piezoelectric pump, and when the operation mode being monitored is another mode without audio recording, the control circuit maintains the amount of the air flow.

Abstract: A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.

Abstract: A method of forming a structure. An interposer is provided. The interposer is adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: A method for operating a sealed for life compact secondary substation including a transformer, a high voltage side and a ring main unit arranged at the high voltage side and connected to a primary side of a the transformer, a secondary side of the transformer is connected a low voltage switch gear. An enclosure includes watertight material capable of withstanding corrosion at least for a life time of the compact secondary substation. The compact secondary substation is cooled with a cooling system that includes a heat exchanger. The compact secondary substation is protected with an extended arc eliminator. The compact secondary sub-station is connected to a remote control for surveillance and operation, which remote control is communicating with a fault protection equipment.

Abstract: An electric device includes: a circuit board arranged in cooling medium in a housing and having an electric element and an external coupling electrode, wherein the electric element is sealed in and mounted in a substrate, and the electric element is electrically coupled with the external coupling electrode; an external coupling terminal electrically coupled with the external coupling electrode; and a separation member for separating the external coupling terminal and a connection portion between the external coupling electrode and the external coupling terminal away from the cooling medium.

Abstract: A cooling device controller for controlling a cooling device is provided. The cooling device controller includes: a capacitor for supplying an output voltage through a first terminal; a first switch between a first input terminal and the first terminal of the capacitor; a predetermined reference voltage applied to the first input terminal; a second switch between a second input terminal and the first terminal of the capacitor, wherein a temperature-sensing voltage is applied to the second input terminal, the temperature-sensing voltage varying according to a first sensed temperature; and a switch controller to receive a first voltage waveform having a duty ratio, the duty ratio dependent on a second sensed temperature, wherein the switch controller is operable to turn on and off the first switch and the second switch according to the duty ratio.

Abstract: The invention relates to a portable electronic device, e.g. a mobile phone, comprising a shell, a display, a battery, a processor and a receiver. In the portable electronic device is at least one of the components configured to heat exchange with a phase changing material which is arranged within the portable electronic device.

Abstract: For dynamically cooling an input/output (I/O) controller, the presence of the I/O controller is automatically detected. The I/O controller includes an electronic component capable of generating heat that is greater than a predefined amount when the electronic component is operating in a predefined state. The I/O controller provides a control output in response to a demand indicative of operating the electronic component in the predefined state. The control output is provided to a baseboard management controller (BMC) that is capable of providing additional cooling to the I/O controller in response to the control signal.

Abstract: A cooling system for cooling computer component with a liquid provided at atmospheric pressure, or low pressure, that flows through channel defined in the computer component. The liquid is pumped from a reservoir to a discharge port, or weir, that is located above the computer component. The liquid flows through an in-feed manifold to diverters that direct the liquid into in-feed tanks located above a row of the computer component. The liquid flows through the channels and flow control orifices to a drain that returns the liquid to the reservoir.

Abstract: A method and system are provided for thermal management of a portable computing apparatus. Accelerometers are provided to detect changes in attitude, and temperature sensors are provided to detect changes in temperature. A fan is used to cool the internal temperature of the electronic components of the computer. In response to lift of the computer from a stationary surface, the computer may transition to an alternative state of operation. The transition may include the change of the speed of the fan and/or adjustment of the processor clock.

Abstract: According to one embodiment, a sensor-securing apparatus has a frame having a sensor-mount region to hold an image sensor that generates heat while operating. The frame has a first adhesive-applying hole and a plurality of second adhesive-applying holes. The first adhesive-applying hole opens in the sensor-mount region and faces the center part of the image sensor. The second adhesive-applying holes are smaller than the first adhesive-applying hole, open in the sensor-mount region and are arranged around the first adhesive-applying hole. Adhesive is filled in the first adhesive-applying hole and the second adhesive-applying holes. The adhesive secures the image sensor to the frame.

Abstract: An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.

Abstract: The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.

Abstract: Portability of an electronic device with a semiconductor card is improved. The semiconductor card is insertable to a card slot in an electronic device, can engage a card socket formed inside the card slot, and has a base part and an expansion part. The base part has a terminal part and a first connection unit, and engages the card socket with the terminal part. The expansion part has a second connection unit, and can be moved between two positions when the second connection unit is connected to the first connection unit, a closed position where the expansion part is overlapping and substantially parallel to the base part, and an open position where the expansion part is extended at an angle greater than a perpendicular with respect to the base part. When the expansion part is in the closed position and the terminal part is engaged in the card socket, the expansion part and the base part are inserted to the card slot.