Process Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product Thereof Patents (Class 523/400)
  • Patent number: 9631099
    Abstract: This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: April 25, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Xiaomei Song, Hongyu Chen
  • Patent number: 9624606
    Abstract: The present invention provides a method for producing cellulose nanofibers, the method including fibrillating cellulose in a modified epoxy resin (A) having a hydroxyl value of 100 mgKOH/g or more. Also, the present invention provides cellulose nanofibers produced by the production method and a master batch containing the cellulose nanofibers and the modified epoxy resin (A). Further, present invention provides a resin composition containing the master batch and a curing agent (D), and provides a molded product produced by molding the resin composition.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: April 18, 2017
    Assignee: DIC Corporation
    Inventors: Takeshi Yamazaki, Takahito Ikuma, Tetsuya Harada, Tetsuya Yamazaki, Mari Minowa, Masakazu Yoshizawa
  • Patent number: 9550914
    Abstract: The present invention relates to a coating composition in the form of a loose powder including the following by weight: 50% to 99.99% of polyamide powder, and 0.01% to 0.5% of polypropylene glycol, out of the total weight of the composition. The present invention relates in particular to a coating composition in the form of a powder including the following by weight: 50% to 99.9% of polyamide powder, 0.01% to 10% of at least one pigment and 0.01% to 0.5% of polypropylene glycol, out of the total weight of the composition. The present invention relates in particular to the use of said composition in methods for coating objects, in particular metal, by means of stuccoing.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: January 24, 2017
    Assignee: Arkema France
    Inventors: Karine Huraux, Jean-Charles Durand
  • Patent number: 9549697
    Abstract: An electrochemical sensor system comprises an electrochemical sensor and a hydrogel composition. The electrochemical sensor has at least a counter electrode and a working electrode. The hydrogel composition contacts the working electrode. The hydrogel composition comprises a first monomer, a second monomer, a cross-linking agent, and a solvent. The first monomer has hydrophilic characteristics. The second monomer has hydrophobic characteristics. The ratio of the first monomer to the second monomer is from about 0.1:99.9 to about 99.9:0.1.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: January 24, 2017
    Assignee: Ascensia Diabetes Care Holdings AG
    Inventors: Paul Valint, Jr., Doug H. Williamson, Boru Zhu
  • Patent number: 9523916
    Abstract: Disclosed is a photoresist comprising 1 to 90 parts of hydroxyl-containing or carboxyl-containing film-forming resin, 1 to 99 parts of silicon-containing vinyl ether monomer, and an organic solvent capable of dissolving the aforesaid substances. Disclosed is also methods of preparing and using the photoresist.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: December 20, 2016
    Assignee: BOE Technology Group Co., Ltd.
    Inventor: Jianguo Wang
  • Patent number: 9464203
    Abstract: A curable composition comprising a polyene, a polythiol and an anhydride is disclosed.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: October 11, 2016
    Assignee: PPG industries Ohio, Inc.
    Inventors: Adam B. Powell, Davina Schwartzmiller, Steven Bowles, Scott Moravek
  • Patent number: 9458352
    Abstract: The invention is directed at new process and systems for preparing composite materials that include a polymer phase and a fiber phase.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: October 4, 2016
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Manesh N. Sekharan, Daniel L. Dermody, Michael E. Hus, David H. Bank, Peter Cate, Liang Hong, Scott T. Burr, David L. Malotky, Timothy J. Young, Matthew J. Kalinowski
  • Patent number: 9435077
    Abstract: The invention is related to a method for processing biomass derived from plants or animals, comprising the steps of: a. pre treating said material with an aqueous solution of acid or base; b. subsequently passaging saturated or super heated steam through said material, wherein the water activity of the process is controlled by means of temperature and pressure of the super heated steam to be less than 1, preferably less than 0.8, more preferably in the range of 0.4-0.8. With such a process it is possible to disintegrate or make more accessible for subsequent treatments the lignocellulose from lignocellulose containing materials, like wood or other plant material, chitin from exoskeletons from Crustacea like crabs and shrimps, and proteins such as keratin from pig hair or chicken feather, for further derivation, like acylation, oxidation, etherification, carboxymethylation or esterification, or further enzymatic hydrolysis, and/or for production of chemicals, e.g.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: September 6, 2016
    Assignee: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    Inventors: Johannes Wouterus Van Groenestijn, Jan Matthijs Jetten, Hendricus Cornelis Van Deventer, Ronald Slomp, Theodoor Maximiliaan Slaghek
  • Patent number: 9437881
    Abstract: There is provided a reinforcing material equipped with a cohesive/adhesive layer, having a proper initial adhesion force to an adherend, such as an electrolyte membrane, a catalyst layer and a gas diffusion layer, and which can be temporarily fixed readily. A reinforcing material produced by forming a cohesive/adhesive layer on a substrate. The cohesive/adhesive layer includes an aliphatic polyamide, an epoxy resin and a polythiol. When the reinforcing material is used, it becomes possible to correct the position of an adherend after the adhesion of the reinforcing material to the adherend. In addition, it can prevent the formation of wrinkles on the adherend or the like upon the adhesion of the reinforcing material. Therefore, a catalyst layer laminated membrane or the like which has a reinforcing material attached thereto can be produced readily without requiring the employment of any highly skilled technique.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: September 6, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hirotoshi Sakamoto, Takahisa Taniguchi, Koujun Utaka, Hidenori Asai, Kazufumi Kodani, Kuniaki Yoshikata
  • Patent number: 9409219
    Abstract: This invention provides a polymer, which is preferably a polyether polymer. The polymer may be used in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: August 9, 2016
    Assignee: Valspar Sourcing, Inc.
    Inventors: Jeffrey Niederst, Richard H. Evans, Robert M. O'Brien, Kevin Romagnoli, Mark S. Von Maier
  • Patent number: 9394468
    Abstract: A thermohardenable structural adhesive material that upon curing has an elongation at break of at least 10% and has a glass transition temperature (Tg) of 80° C. or higher and is useful as a structural adhesive in automobiles to reduce the deformation of bonds particularly during accidents, the adhesive is dry to the touch at ambient temperature and can be melt processed at temperature below that at which thermohardening occurs. The adhesives are useful in applications requiring a combination of high strain to failure, glass transition temperature more than 80° C., high stiffness and high strength. This combination is of particular interest in the aerospace and automotive industries.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: July 19, 2016
    Assignee: ZEPHYROS, INC.
    Inventors: Michael Czaplicki, Ira Miller, Vincent Duclos
  • Patent number: 9383489
    Abstract: The present invention relates to an inkjet composition for forming transparent films, which is highly economical and environmentally friendly and has excellent physical properties, including excellent transmittance, chemical resistance, heat resistance, adhesion, jetting stability and storage stability.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: July 5, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Mun-Ho Kim, Seung-Hee Lee, Han-Soo Kim, Mi-Kyoung Kim
  • Patent number: 9376560
    Abstract: The present invention relates to a matrix material for a carbon fiber-reinforced composite. The matrix material for the carbon fiber composite contains a matrix resin as a resin component. The matrix resin contains at least a first epoxy resin containing a polyfunctional glycidylamine-type epoxy resin having four epoxy groups in one molecule. The matrix resin may further contain at least one of a p-aminophenol-type epoxy resin having three epoxy groups in one molecule, and a tetramethylbiphenol-type solid epoxy resin having two epoxy groups in one molecule. The matrix resin has an average epoxy equivalency of 99 to 163.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: June 28, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Shuichiro Yoshida
  • Patent number: 9372281
    Abstract: The present invention relates to a thioepoxy compound for an optical material, a polymerizable composition including the thioepoxy compound, and a method for producing a thioepoxy optical material by polymerization of the polymerizable composition. The polymerizable composition further includes 4.1 to 15% by weight of 2,3-epoxypropyl(2,3-epithiopropyl)sulfide and/or 2,3-epoxypropyl(2,3-epithiopropyl)disulfide. The thioepoxy optical material is free from color instability, demolding, and polymerization imbalance, which are problems encountered in general thioepoxy optical materials.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: June 21, 2016
    Assignee: KOC SOLUTION CO., LTD.
    Inventors: Dong Gyu Jang, Soo Gyun Roh, Jong Hyo Kim
  • Patent number: 9354358
    Abstract: A light guiding liquid glue and a touch sensitive display using the same are provided. The light guiding liquid glue includes a liquid glue and a plurality of light guiding particles dispersed in the liquid glue, wherein volume percent of the light guiding particles in the light guiding liquid glue ranges between 10% and 50%. The light guiding particles have a light scattering property, which can transfer a linear light into a flat light, and therefore the light guiding liquid glue of the present disclosure has a light guiding property. The touch sensitive display includes a display panel and a touch panel. The light guiding liquid glue is disposed between the display panel and the touch panel, which can transmit evenly lights emitted from the display panel to outside of the touch sensitive display.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: May 31, 2016
    Inventors: Yuh-Wen Lee, Qiong Yuan, Xianbin Xu
  • Patent number: 9353256
    Abstract: The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1?-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: May 31, 2016
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Mitsuhiro Iwata, Tomohiro Ito
  • Patent number: 9309434
    Abstract: Scratch resistance and/or reflow of a refinish topcoat is improved by preparing the topcoat from a refinish topcoat coating composition comprising an unsaturated fatty acid ester polyol that does not undergo oxidative cure when the applied refinish topcoat coating composition is cured.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: April 12, 2016
    Assignee: BASF Coatings GmbH
    Inventors: Ali Rihan, Anthony J. Tye
  • Patent number: 9290683
    Abstract: Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: March 22, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Christopher J. Campbell, Kevin M. Lewandowski, Kwame Owusu-Adom
  • Patent number: 9260606
    Abstract: Provided are a silicone rubber sponge that forms an elastic layer of a pressure roller of an image-forming apparatus, and that has a high mechanical strength so as to be used in a high-speed image-forming apparatus or a color image-forming apparatus, and a rubber-covered roller including the silicone rubber sponge. The silicone rubber sponge is produced by mixing expanded resin microballoons with a low-molecular-weight silicone rubber to prepare a compound A, mixing a high-molecular-weight silicone rubber with the compound A to prepare a silicone rubber compound, and heating the silicone rubber compound at a temperature lower than a softening point of the resin microballoons to cure the silicone rubbers.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: February 16, 2016
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.
    Inventors: Shingo Nakajima, Jun Sugawara, Yasuhiro Fukumoto, Naoki Onmori
  • Patent number: 9246104
    Abstract: A fullerene derivative represented by the following formula (1): wherein “FLN” represents a fullerene core, R1 represents an optionally substituted C1-C24 alkyl group or an optionally substituted C7-C24 aralkyl group, R2 and R3 independently represent a hydrogen atom or an optionally substituted C1-C24 hydrocarbon group but excluding a case where both of R2 and R3 are hydrogen atoms, and R2 and R3 may combine together to form a ring.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: January 26, 2016
    Assignees: SHOWA DENKO K.K., Tohoku University
    Inventors: Tienan Jin, Weili Si, Yoshinori Yamamoto, Takeshi Igarashi
  • Patent number: 9200133
    Abstract: Disclosed is a liquid curable epoxy resin composition which includes a cycloaliphatic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a silica (B); and a phosphite ester (C). The liquid curable epoxy resin composition preferably includes, for example, 5 to 80 parts by weight of the cycloaliphatic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; 20 to 95 parts by weight of the silica (B); and 0.001 to 5.0 parts by weight of the phosphite ester (C), per 100 parts by weight of the total amount of the components (A) and (B).
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: December 1, 2015
    Assignee: DAICEL CORPORATION
    Inventor: Masanori Sakane
  • Patent number: 9175193
    Abstract: The present invention relates to an adhesive sheet, a manufacturing method thereof, an optical filter and a plasma display panel. The present invention provides an adhesive sheet having an excellent base adhesion property through a hydroxyl group applied to a base film and an isocyanate-based compound contained in an adhesive layer through a corona processing. Accordingly, the present invention provides an adhesive sheet having an excellent base adhesion property and improved high temperature stability by using a carboxyl group-containing acryl-based copolymer having a high glass transition temperature. Further, the adhesive sheet of the present invention contains a siloxane-based compound if needed, thus preventing an initial peeling force from being increased.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: November 3, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Woo Ha Kim, Hyo Jin Jeong, In Cheon Han, Se Ra Kim
  • Patent number: 9139694
    Abstract: A cured polycyanurate, thermoset resins, and methods of producing the same that will have both high thermal resistance as well as high hydrophobicity. Naturally occurring 5-alkylresorcinols and synthetic analogs can be made into cyanate ester. Composites made from these products will have greater durability against atmospheric water exposure. Applications include use in fiber-reinforced composite materials for lightweight, strong, and water-resistant aerospace components.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: September 22, 2015
    Assignee: The United States of America as Represented by the Secretary of the Navy
    Inventor: Matthew C. Davis
  • Patent number: 9080046
    Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: July 14, 2015
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventor: Edward Norman Peters
  • Patent number: 9068039
    Abstract: A thermosettable (curable) epoxy resin composition including (A) a residual oligomeric product; wherein the residual oligomeric product comprises a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of (i) an aliphatic or cycloaliphatic hydroxyl-containing material with (ii) an epihalohydrin, (iii) a basic-acting substance, (iv) a non-Lewis acid catalyst, and (V) optionally one or more solvents; (B) an epoxy curing material comprising (i) an epoxy resin curing agent, (ii) an epoxy resin catalyst, or both an epoxy resin curing agent (i) and an epoxy resin catalyst (ii); and (C) optionally, an epoxy resin compound other than the aliphatic or cycloaliphatic polyfunctional epoxy resin (A). A thermoset may also be made from the above thermosettable composition.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: June 30, 2015
    Assignee: Dow Global Technologies LLC
    Inventor: Robert E. Hefner, Jr.
  • Publication number: 20150147508
    Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
    Type: Application
    Filed: January 27, 2015
    Publication date: May 28, 2015
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20150148449
    Abstract: The present invention relates to waterproofing compositions based on polyurethanes, which are particularly useful for the waterproofing of concrete structures. The compositions are characterized in that they comprise at least one branched isocyanate component comprising on average at least 2.3 isocyanate groups per molecule and at least one hydroxycarboxylic acid component. Preferably the composition further comprises at least one polyol component and at least one latent amine component.
    Type: Application
    Filed: June 6, 2012
    Publication date: May 28, 2015
    Inventors: Wojciech Domanowski, Monika Janaszczyk
  • Publication number: 20150148452
    Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
    Type: Application
    Filed: February 15, 2013
    Publication date: May 28, 2015
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Su-Jin Park, Sook-Yeon Park, Yun-Ju Kim, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang
  • Patent number: 9040606
    Abstract: Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an ?-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: May 26, 2015
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Junichi Tabei
  • Publication number: 20150141550
    Abstract: The present invention relates to a polyarylene sulfide resin composition having excellent impact resistance in which a polyarylene sulfide resin having a specific end group, an epoxy-containing olefin-based elastomer, and/or an organic or inorganic filler are included, and a preparation method thereof.
    Type: Application
    Filed: June 5, 2013
    Publication date: May 21, 2015
    Applicant: SK CHEMICALS CO.,LTD.
    Inventors: Byoung Gook Kang, Il-Hoon Cha, Sung-Gi Kim, Se-Ho Lee
  • Publication number: 20150141548
    Abstract: The present invention provides methods of making a low viscosity C15 alkenyl group containing diglycidyl ether composition comprising at least partially distilling a mixture of one or more C15 alkenyl group containing monoglycidyl ether and one or more C15 alkenyl group containing diglycidyl ether in the presence of a free radical inhibitor to remove at least some of the C15 alkenyl group containing monoglycidyl ether. The methods enable high solids, low viscosity epoxy resins from a renewable source. The present invention also provides compositions of C15 alkenyl group containing diglycidyl ether adducts of a polyamine.
    Type: Application
    Filed: November 17, 2014
    Publication date: May 21, 2015
    Inventors: Ray E. Drumright, Robert E. Hefner, JR.
  • Publication number: 20150132239
    Abstract: The present invention relates to a material comprising dendritic molecules each constituted of fragments that are at least bifunctional and of fragments that are of least trifunctional joined together by ester or thioester bridges, alone or in combination with amide or urea bridges, said bridges being formed from two functions carried by different fragments, said molecules containing, on the fragments located at the ends of the dendritic branches, associative end groups capable of forming associations with one another by hydrogen bonds and joined covalently to the functions that are not involved in said bridges. It also relates to the method of production thereof, as well as to its uses and to compositions, notably cosmetic, containing this material.
    Type: Application
    Filed: January 8, 2015
    Publication date: May 14, 2015
    Applicants: CENTRE NATIONAL DE LA RECHERCHE SCIENTIGIQUE CNRS, ARKEMA FRANCE
    Inventors: François-Genes TOURNILHAC, Manuel HIDALGO, Ludwik LEIBLER
  • Publication number: 20150132566
    Abstract: Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.
    Type: Application
    Filed: May 15, 2013
    Publication date: May 14, 2015
    Inventors: Thorsten Ganglberger, Birgit Wenidoppler, Herwig Englisch, Mark Whiter
  • Publication number: 20150132584
    Abstract: The invention relates to a flame retardant composition comprising at least one radiation curable oligomer and at least one reactive aliphatic halogenated flame retardant additive and its use to make fire-resistant glass laminates with impact resistance.
    Type: Application
    Filed: June 13, 2013
    Publication date: May 14, 2015
    Inventor: Hugues Van Den Bergen
  • Publication number: 20150126644
    Abstract: The present invention relates to a polyester-based fiber for artificial hair obtained by melt spinning a polyester resin composition. The polyester resin composition includes 100 parts by weight of a polyester resin, 5 to 40 parts by weight of a brominated epoxy flame retardant, and 1.5 parts by weight or more and less than 7 parts by weight of an antimony oxide. The polyester resin is at least one kind of resin selected from the group consisting of polyalkylene terephthalate and a copolymerized polyester containing polyalkylene terephthalate as a main component. The polyester-based fiber for artificial hair has aggregates of the brominated epoxy flame retardant that are dispersed in the polyester resin in the form of islands, as viewed in the cross section of the fiber parallel to the fiber axis direction. The present invention also relates to hair ornament products including the polyester-based fiber for artificial hair and a method for producing the polyester-based fiber for artificial hair.
    Type: Application
    Filed: May 15, 2013
    Publication date: May 7, 2015
    Applicant: Kaneka Corporation
    Inventors: Tomokazu Higami, Tomomichi Hashimoto, Kohei Kawamura, Mika Yorizane
  • Patent number: 9024347
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: May 5, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Bae Moon, Jae Hun Jeong, Sang In Yoon
  • Publication number: 20150119497
    Abstract: The present invention aims to provide a vinyl resin which, with a polyurethane resin, is capable of providing a film excellent in mechanical strength, weather resistance, solvent resistance, and water resistance.
    Type: Application
    Filed: March 15, 2013
    Publication date: April 30, 2015
    Inventors: Yosuke Matsui, Masumi Maehara, Takashi Fujimura
  • Publication number: 20150119498
    Abstract: A system and method for producing a composite component, especially for continuous production of such composite components, includes a feeding device for feeding one or more layers of reinforcing material from a material supply along a process path, a resin application device for applying a resin matrix to the reinforcing material fed along the process path, and a forming device configured to shape or mould a profile of the reinforcing material and the resin matrix applied thereto to form a composite component as the reinforcing material is fed or conveyed along the process path.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 30, 2015
    Inventors: Hauke SEEGEL, Tassilo WITTE
  • Patent number: 9018335
    Abstract: Bis-Phenol A (BPA) can now be replaced in industrial processes by BPA substitutes. The BPA substitutes can have structures that are derivatives of BPA. The BPA substitutes can be used in preparing epoxy composition, polycarbonate compositions, and polysulfonate compositions or for other uses in place of BPA.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: April 28, 2015
    Assignee: Empire Technology Development LLC
    Inventor: Masahiro Ueda
  • Patent number: 9018282
    Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventor: Yoke Ai Gan
  • Patent number: 9018281
    Abstract: Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, ?100° C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by ?20° C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg?30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg?30)° C. is ?42 ppm/° C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: April 28, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Kaoru Katoh, Taro Shimoda
  • Patent number: 9018301
    Abstract: A process for preparing an aqueous pigment dispersion suitable for use in an ink jet printing ink comprising the following steps in the order I) followed by II): I) providing a dispersion having a sodium chloride critical coagulation concentration of no more than 2.0M, said dispersion comprising a pigment, an aqueous liquid medium and a dispersant having one or more ionic group(s); and II) reducing the hydrophilicity of the dispersant by reacting at least some, but not all of the ionic group(s) in the dispersant with the one or more hydrophobic compound(s).
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: April 28, 2015
    Assignee: Fujifilm Imaging Colorants Limited
    Inventors: Tom Annable, John Patrick O'Donnell
  • Publication number: 20150111044
    Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takaaki OGASHIWA, Hiroshi TAKAHASHI, Tetsuro MIYAHIRA, Yoshihiro KATO
  • Publication number: 20150111991
    Abstract: There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.
    Type: Application
    Filed: May 17, 2013
    Publication date: April 23, 2015
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Mitsuharu Kitamura, Yutaka Matsuura, Hisayuki Kuwahara, Tomotaka Wada, Yuiga Asai
  • Publication number: 20150111990
    Abstract: A process for providing a coating with improved adhesion to a substrate is provided. The coating composition comprises an epoxy function polymer, a fully alkylated melamine resin and an amidoamine. The process involves forming a mixture of the film forming components and allowing the mixture to mature before adding an acid catalyst. The result is a layer of the coating composition with a high degree of adhesion to the substrate.
    Type: Application
    Filed: January 29, 2013
    Publication date: April 23, 2015
    Applicant: AXALTA COATING SYSTEMS IP CO., LLC
    Inventors: Ayumu Yokoyama, Violeta Ilieva Petkovska, Eric C. Houze, Rajesh Gopalan Saliya
  • Publication number: 20150111035
    Abstract: A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide.
    Type: Application
    Filed: May 28, 2013
    Publication date: April 23, 2015
    Applicant: Dexerials Corporation
    Inventor: Daisuke Motomura
  • Patent number: 9012009
    Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hae Kwang Co., Ltd.
    Inventor: Myun Soo Kim
  • Patent number: 9012575
    Abstract: The present invention relates to epoxy group-terminated polymers of the formula (I). Said epoxy group-terminated polymers are suited extremely well as impact resistance modifiers, particularly in epoxy resin compositions. They are particularly suited for use in heat-curing epoxy resin adhesives. It has been found that such epoxy resin compositions not only have excellent mechanical properties and high glass transition temperatures, but also above all improved impact resistance properties, both at room temperature and at low temperatures.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: April 21, 2015
    Assignee: Sika Technology AG
    Inventors: Jürgen Finter, Andreas Kramer
  • Patent number: 9006312
    Abstract: A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: April 14, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Guillaume Metral, Bernd Hoevel, Joseph Gan, Michael J. Mullins
  • Patent number: 9006316
    Abstract: The present invention is directed to novel organometallic complexes as catalysts for the reaction of compounds with isocyanate and hydroxyl functional groups to form urethane and/or polyurethane and the process employing such catalysts. More particularly, the present invention is directed to novel complexes of zinc(II) with substituted amidines. These novel catalysts are useful for the production of urethanes and polyurethanes which are important in many industrial applications.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: April 14, 2015
    Assignee: King Industries, Inc.
    Inventors: Bing Hsieh, Ramanathan Ravichandran, Farouk Abi-Karam