Abstract: Coating compositions suitable for machined cementitious substrates are provided. The coating compositions provide adhesion to the machined cementitious substrate while maintaining high mechanical film strength. The coating compositions are also compatible with industrial implementation, and exhibit good pot life.

Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

Abstract: An electrocoating composition is provided herein. The electrocoating composition includes an aqueous carrier. The electrocoating composition further includes a film forming binder. The film forming binder includes an epoxy-amine adduct and a blocked polyisocyanate crosslinking agent. The electrocoating composition further includes an anti-crater agent selected from the group of a polyester resin dispersion, a polyacrylate resin dispersion, and a combination thereof. The electrocoating composition further includes a supplemental anti-crater agent including a polyether modified polysiloxane.

Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.

Abstract: A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.

Abstract: The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.

Abstract: A process for forming a thermosetting resin in a nitrogen atmosphere is provided. The process includes the steps of a) reacting a polycarboxylic acid and/or anhydride and a polyhydric alcohol to provide a hydroxyl-containing intermediate; b) reacting the hydroxyl-containing intermediate with a vinyl-containing organic acid or vinyl containing alkyl ester in the presence of an esterification catalyst, a polymerization inhibitor and an azeotropic agent; and c) reacting any residual vinyl-containing organic acid and residual esterification catalyst with an epoxide.

Abstract: A curable coating composition and the use, especially in heat exchangers, for heating and/or cooling water, in particular tap water, is described. The curable coating comprises, based on solids after curing, 35-80% by weight of an epoxysilane according to the general structure 1 and/or its hydrolysation and/or condensation products, 1: R1R2aSiR3b with R1 being 3-glycidyloxypropyl, R2 being methyl, R3 being alkyloxy or acyloxy, a being 0, 1 or 2 and b being 3?a and 20-65% by weight of a blocked polyisocyanate and optionally further components. The coating provides improved corrosion protection on aluminium surfaces, reduces limescale formation on heat exchanger surfaces and is able to withstand lateral and/or temporal temperature gradients when coated on heat exchanging surfaces.

Abstract: Photo-protected microcapsules containing a photopolymer composition are dispersed in an epoxy coating to form an autonomic self-healing material. The capsule shell wall is formulated to protect the photopolymer composition from electromagnetic radiation exposure prior to rupture of the capsule shell, so that the photopolymer composition (e.g., a UV curable epoxy resin) remains active until triggered by damage to the capsule shell. Carbon black pigment is a suitable UV protector for the capsules. Upon sufficient damage to a region of the coating, the capsules will rupture and the photopolymer composition will fill and cure in and/or around the damaged region in the presence of electromagnetic radiation, achieving autonomic healing of the damaged coating.

Abstract: Disclosed herein is a foamable resin composition for a foam sheet including polylactic acid resin particles, each of the particles having a particle size of about 1 ?m to about 100 ?m. A process for preparing a particulate polylactic acid resin includes: introducing a polylactic acid resin and then forming a molten polylactic acid spray solution; and injecting the molten polylactic acid spray solution by a melt spray method and simultaneously cooling the molten polylactic acid spray solution to obtain a particulate polylactic acid. In addition, disclosed herein is a process for preparing a foam sheet using the foamable resin composition for a foam sheet including a polylactic acid resin.

Abstract: A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.

Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.

Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition contains a multifunctional vinyl ether compound in an amount of 10 to 80 weight percent, a bifunctional oxetane compound represented by Formula (b) in an amount of 0.5 to 20 weight percent, and a monofunctional oxetane compound represented by Formula (b?) in an amount of 5 to 80 weight percent. In the formulae, Ring Z is selected from an aromatic hydrocarbon ring and a structure including two or more aromatic hydrocarbon rings bonded to each other through a single bond or a linkage group; R represents a monovalent aliphatic hydrocarbon group; R? is selected from hydrogen and ethyl; and m represents an integer of 0 or more.

Abstract: The present disclosure provides a composition for preparing a lightweight transparent composite, a method of preparing a composite using the same, and a composite prepared by the method. The lightweight transparent composite having excellent impact resistance, scratch resistance, weather resistance, and high hardness can be prepared by thermally curing a mixture of a glass fiber reinforcement having a refractive index of 1.4 to 1.6 and a curable resin having a deviation in refractive index of ?0.005 to +0.005 from the glass fiber reinforcement. When the lightweight transparent composite is applied to transparent windows for automobiles, the lightweight transparent composite can be useful in enhancing fuel efficiency, achieving easier handling characteristics due to reduction in vehicle center of gravity, and improving juddering and dimensional stability even during car driving due to excellent hardness.

Abstract: Polymeric clay stabilizers including at least one ionic repeating unit for treatment of subterranean formations. A method of treating a subterranean formation that can include obtaining or providing a composition comprising including a polymeric clay stabilizer including at least one ionic repeating unit, wherein the clay stabilizer has a melting point or glass transition temperature that is equal to or less than 100° C. The method can also include placing the composition in a subterranean formation.

Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

Abstract: Coating compositions that include a thermoplastic dispersion and an epoxy-functional stabilizer having polyhydric phenols that exhibit estrogenic activity less than bisphenol S.

Abstract: A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.

Abstract: The invention relates to a polymer composition, and to a semifinished plastics product, the surface of which has been formed at least to some extent from the polymer composition. The invention further relates to a production process associated therewith for the semifinished plastics product. A feature of the polymer composition is that it comprises from 50 to 99.7% by weight of a polymer and from 0.3 to 20% by weight of one or more adhesion-promoting additives. The invention further relates to plastics-metal hybrid components and production of these.

Abstract: The present invention recites a method of fabricating a stator for a downhole motor, the method comprising the steps of providing a stator tube having an interior surface and applying a bonding agent to the interior surface of the stator tube. Additionally, a mandrel is positioned within the stator tube, the mandrel having an outer geometry that is complimentary to a desired inner geometry for the stator. Furthermore, a reinforcing material is introduced into the stator tube to fill space between the mandrel and the interior surface of the stator tube and subsequently solidified to bond the reinforcing material to the interior surface of the stator tube. The mandrel is then removed from the bonded stator tube and reinforcing material such that a stator is fabricated.

Abstract: An epoxy group-terminated impact modifier is described, comprising the reaction product of a) two or more polyols, b) one or more polyisocyanates, and c) at least one epoxy resin comprising a primary or secondary hydroxy group-containing epoxy compound, wherein the polyols comprise a1) at least one polyether polyol and a2) at least one OH-terminated rubber, wherein the weight ratio of polyether polyol to OH-terminated rubber is in the range from 7:3 to 2:8; an isocyanate-terminated prepolymer as possible intermediate product is described; furthermore a method for producing same is described. The products obtained are suitable for improving the impact resistance of epoxy resin compositions, in particular of 1K or 2K epoxy resin adhesives.

Abstract: A method for synthesizing a modified polymer comprising epoxide groups along the polymer chain, by a hydrosilylation reaction of the unsaturations with a hydrosilane bearing an epoxide function in the presence of a suitable catalyst is provided. The method is simple, reproducible and able to be used on an industrial scale, and makes it possible to obtain high grafting yields, since they may reach 100%.

Abstract: The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

Abstract: The present invention relates to a composition containing, besides a thermosetting resin of epoxy type and a hardener of anhydride type, at least one catalyst comprising an organometallic titanium complex. This composition enables the manufacture of vitrimer resins, that is to say resins that can be deformed in the thermoset state. It also relates to a kit for manufacturing this composition, an object obtained from this composition and a kit for manufacturing this object. Another subject of the invention relates to an organometallic titanium complex corresponding to the structure titanium bis(3-phenoxy-1,2-propane dioxide) (Ti(PPD)2), and the use thereof as vitrimer effect catalyst in systems based on epoxy resin and on hardener of anhydride type.

Abstract: A polycarbonate resin composition includes: a polycarbonate resin; a polyalkylene glycol compound; and an organic-inorganic hybrid pigment, and has a yellow index (YI) of about ?2 to about 4 after irradiation with gamma rays, as measured in accordance with ASTM D1925 after irradiating an about 3 mm thick specimen with gamma rays at about 25 kGy and leaving the specimen for 7 days. The polycarbonate resin composition can exhibit excellent properties in terms of color and impact resistance after being irradiated with ionizing radiation.

Abstract: Curable formulations, cured formulations, and mixtures and composites thereof are described herein, as well as methods of making and using the formulations, mixtures, and composites.

Abstract: Compositions, methods, and coating composition using a curing agent are provided herein. In one embodiment, a curing agent for epoxy resins may be prepared using a formulation including: (a) an adduct of: (i) a diglycidyl ether of a bisphenol, and (ii) a first polyamine; (b) a second polyamine; and (c) water; wherein the composition has an amine hydrogen equivalent weight, based on solids, of less than or equal to 105.

Abstract: A liquid crystal alignment agent contains a polymer composition, a polysiloxane, and a solvent. The polymer composition is obtained by subjecting a mixture including a tetracarboxylic dianhydride component and a diamine component to a reaction. The diamine component includes first and second diamine compounds. The polysiloxane contains an epoxy-based group. A liquid crystal display element made from the aforesaid liquid crystal alignment agent has reduced ion density.

Abstract: A liquid crystal alignment agent contains a polymer composition, a polysiloxane, and a solvent. The polymer composition is obtained by subjecting a mixture including a tetracarboxylic dianhydride component and a diamine component to a reaction. The diamine component includes first and second diamine compounds defined herein. The polysiloxane contains an epoxy-based group and a polymerizable unsaturated group defined herein. A liquid crystal display element made from the aforesaid liquid crystal alignment agent has reduced ion density.

Abstract: The present invention relates to a polyester resin with excellent solubility in generic solvents, especially with excellent solubility at a temperature of 0° C. or lower. According to the present invention, by using the polyester resin with excellent solubility in generic solvents, solubility at a lower temperature, especially the solubility at a temperature of 0° C. or lower, is enhanced, making it easier to prepare paints, coatings and the like. The polyester resin related to the present invention contains 0.05 to 0.5 mol of an isosorbide-derived structural unit and 0.015 to 0.4 mol of a trihydric or higher alcohol-derived structural unit relative to 1 mol of a polycarboxylic acid-derived structural unit.

Abstract: A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: (R1: C1-C12 chain alkyl group or the like; H is bonded to at least one of the carbon atoms of the aromatic ring at ortho- or para-position with respect to C to which the oxygen atom is bonded).

Abstract: The present invention provides an inkjet ink comprising: an aqueous polyurethane (meth)acrylate dispersion, which is redispersible in water after thermal drying and before curing; a water-dispersible or water-soluble photoinitiator; a surfactant; and a coloring agent. The ink of the present invention is particularly suitable for printing onto a food packaging.

Abstract: A dielectric material for a transducer is manufactured from a composition that includes metal oxide particles having hydroxy groups, a rubber polymer having a functional group capable of reacting with an epoxy group, a bisphenol type epoxy resin, both ends of which have an epoxy group, and a cross-linking agent. In the dielectric material for a transducer, the metal oxide particles are bound to the rubber polymer via the bisphenol type epoxy resin. A transducer includes a dielectric layer made of the dielectric material for a transducer and a plurality of electrodes arranged with the dielectric layer interposed therebetween.

Abstract: Polycyclocarbonate compounds and upgraded molecular weight polymers made from such compounds are provided. The polymers have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.

Abstract: Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

Abstract: Provided is an aqueous liquid composition including a water-based medium containing water, a polymer having at least one type of groups selected from hydroxyl groups and amino groups, and phosphonobutanetricarboxylic acid. The polymer is at least one polymer selected from the group consisting of a polysaccharide, polyamino acid, polyvinyl alcohol, polyallylamine, polyvinylamine, a polyamidine, a polyethylenimine, and their derivatives.

Abstract: A method of fabricating ultrasound bone phantom material compatible with magnetic resonance imaging (MRI) is provided. The bone phantom material has ultrasound and physical parameters that are characteristic of human cortical and trabecular bones, and is well suited for the fabrication of bone phantoms intended for the development and testing of ultrasound medical diagnostic imaging techniques as well as high-intensity focused ultrasound (HIFU) therapy methods and other MRI imaging applications.

Abstract: Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Abstract: A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.

Abstract: The present invention provides a two-part mechano-responsive composition, comprising: Part I: a tetra-glycidyl amine multifunctional epoxy resin represented by the general formula (I); and Part II: a polythiol and an amine. The cured composition has a mechano-responsive property without adding any dyes or luminescence agents, and by subjected to mechanical stimuli, the cured composition changes its color, and the color is in the visible spectrum range, which can be easily checked with naked eyes; and the color change is reversible.

Abstract: The present invention relates to a water-soluble cationic acrylamide-based polymer having one or more acetoacetate groups. The invention also relates to a method for producing the water-soluble polymer which comprises polymerizing ethylenically unsaturated monomers in an aqueous phase, wherein the monomers comprise (a) (meth)acrylamide, (b) ethylenically unsaturated cationic monomer, (c) ethylenically unsaturated monomer having one or more acetoacetate groups, and (d) optionally other ethylenically unsaturated monomer. The invention further relates to the use of the water-soluble polymer as a strength agent in the production of paper and board. The invention further relates to a process for producing paper and board which comprises providing an aqueous cellulosic suspension, adding to the suspension water-soluble polymer having one or more ketone groups, and dewatering the obtained suspension.

Abstract: The invention describes the use of a water-based UV curable inkjet printing ink wherein the ink is basic due to the presence of a tertiary amine, allowing the complete dissolution of an acid functional photoinitiator of Formula I or Formula IA (wherein R1, R2, R3, n, q, and y are as defined herein). This combination of photoinitiator and tertiary amine allows the rapid low dosage UV curing of a water-based UV formulation using a UV LED light source.

Abstract: An epoxy functional acrylic resin having a Tg of greater than 85° C. and a calculated solubility parameter from about 9.20 to about 9.30 (cal/cm3)1/2, powder coating compositions including the same and coated substrates coated with the powder coating composition is described. The resin includes, as copolymerized monomers, from about 10 wt. % to about 40 wt. % of one or more epoxy functional unsaturated monomers; from about 10 wt. % to about 20 wt. % of one or more hydrophobic acrylic monomers, and from greater than 50 wt. % to about 75 wt. % of at least one nonionic copolymer that is different from the hydrophobic acrylic monomers ii), each monomer wt. % based on the total weight of copolymerized monomers in the resin.

Abstract: A solvent type curable ink for ink-jet printing obtained by dissolving or dispersing, in a volatile organic solvent, polyesterpolyol having a molecular weight of not more than 8000, a hydroxyl value (KOH mg/g) of 17 to 50 and a glass transition point (Tg) of not higher than 70° C., and blocked polyisocyanate. The ink is capable of forming ink-jet-printed image on the surfaces of various kinds of formed articles without burring and maintaining close adhesion upon being heated at a low temperature for a short period of time.

Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.

Abstract: The present invention relates to a butadiene/acrylonitrile copolymer CTBN, modified by epoxy solid resin and terminated by carboxyl groups, the terminal epoxy groups thereof also having optionally been reacted. A polymer of this type is used in particular as an impact strength improving agent in epoxy resin compositions and has proven to be particularly advantageous for gluing on or of metal surfaces. It results in a significant reduction of the infiltration with corrosion, which in turn ensures a long-lived adhesive bond.

Abstract: Provided are a toughness modifier for a curable resin which has good dispersibility in a curable resin containing a thermoplastic resin as well as in a cured product formed from a curable resin composition, and also has an excellent toughness-improving effect; and a curable resin composition containing the toughness modifier. The toughness modifier for a curable resin (D) is obtained by emulsion-polymerizing 5 to 50% by mass of a vinyl monomer (B) in the presence of 50 to 95% by mass of a rubber polymer (A) latex (calculated as the rubber polymer component) using 0.5 to 15 parts by mass of a nonionic reactive surfactant (C) (relative to 100 parts by mass of a total of (A) and (B)).

Abstract: Compositions and method of manufacturing carboxypolysaccharides (CPS) including carboxymethyl cellulose (CMC) and polyethylene glycols (PEGs) are provided where the PEG is a PEG-epoxide covalently linked to the CPS. In certain embodiments, the PEG attaches to only one CPS, forming a decorated CPS. In other embodiments, the functional groups of a bi-functional PEG molecule (PEG diglycidyl ether) are attached to different CPSs, thereby forming a covalently cross-linked composition. Such compositions can be used as space-filling materials, load-bearing materials, anti-adhesion compositions, drug delivery vehicles, and lubricants of tissues and medical instruments.

Abstract: The invention relates to compositions of hydroxyl functional acrylic resins (acrylic polyols) comprising a mixture of ?,?-branched alkane carboxylic glycidyl esters derived from butene oligomers characterized in that the sum of the concentration of the blocked and of the highly branched isomers is maximum 55%, preferably below 40%, and most preferably below 30% weight on total composition.

Abstract: A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r?1 is satisfied.