Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.

Abstract: The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.

Abstract: The present invention addresses the issue of providing a surface sealing agent which can be cured at low temperatures and which exhibits excellent storage stability. In order to resolve this issue, provided is a surface sealing agent for an organic EL element, the surface sealing agent including an epoxy resin (A) having at least two epoxy groups in a molecule, and a curing accelerator (B) which is a salt of a specific quaternary ammonium ion, wherein 0.1-10 parts by weight of the curing accelerator (B) is contained relative to 100 parts by weight of the surface sealing agent.

Abstract: Coating compositions are disclosed. In some embodiments, the coating compositions are used to coat substrates such as packaging materials and the like for the storage of food and beverages. The coating compositions can be prepared by reacting an epoxidized vegetable oil and a hydroxyl functional material in the presence of an acid catalyst to form a hydroxyl functional oil polyol, mixing the hydroxyl functional oil polyol (with or without epoxidized polybutadiene) with a functional polyolefin copolymer to form a mixture,reacting the mixture with an ethylenically unsaturated monomer component in the presence of an initiator to form a graft copolymer, and crosslinking the graft copolymer with a crosslinker to form the coating composition.

Abstract: A block copolymer (M) suitable for toughening a thermoset resin (R). The block copolymer (M) has at least one block derived from a thermoplastic aromatic polymer (A) which exhibits a glass transition temperature (Tg) of at least about 150° C., and at least one block derived from a low Tg polymer (B) wherein: (i) the low Tg polymer (B) exhibits a Tg in the range of from about ?130° C. to about +40° C.; (ii) the aromatic polymer (A) is soluble in the uncured thermoset resin precursor(s) (P) of the thermoset resin (R), and (i) the low Tg polymer (B) is insoluble in the uncured thermoset resin precursor (P).

Abstract: Disclosed is a surface treatment agent for galvanized steel sheets, which comprises epoxy-containing silane derivates, alkyl-containing silane derivates, alkoxy silane derivates and one or more selected from the group consisting of a cationic polymer aqueous dispersion, a non-ionic polymer aqueous dispersion and a water-soluble polymer. Also disclosed is a method for producing it, which comprises mixing each component uniformly for 0.5 to 8 hours at 5 to 70° C. Further provided are galvanized steel sheets coated with the surface treatment agent on the surface and a production method thereof. The surface treatment agent for galvanized steel sheets has excellent corrosion resistance, alkali resistance, solvent resistance, recoating property, high temperature resistance and electrical conductivity.

Abstract: The invention relates to the use of bis- or multifunctional N,N?-(dimethyl) urons as curing agents for curing epoxy resin compositions in a controlled manner.

Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.

Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1.

Abstract: The present invention relates to epoxy coating formulations that comprise an epoxy functional component comprising at least one epoxy functional ingredient comprising an average of at least 1.

Abstract: Improved coating formulations for cementitious composite building materials are disclosed herein. The coating formulations provide both sealer and primer functions, particularly for substrates in a high alkaline environment, such as fiber cement composite materials.

Abstract: The purpose of the present invention is to inhibit a decrease in strength attribute to the interface between a simple-shape portion and a complicated-shape portion. This fiber-reinforced resin composite material comprises: a simple-shape portion formed from at least one sheet-shaped prepreg material obtained by impregnating reinforcing fibers with a resin; and a complicated-shape portion obtained by impregnating reinforcing fibers with a resin, the complicated-shape portion having been integrated with the simple-shape portion. The resin used for the preprg material comprised the same components as the resin used for the complicated-shape portion.

Abstract: One embodiment is a pressure sensitive adhesive construct comprising: (a) a backing substrate; and (b) a pressure sensitive adhesive composition disposed on the backing substrate, wherein the pressure sensitive adhesive composition includes a product made from (i) at least one epoxidized vegetable oil and; (ii) a dimer acid or anhydride thereof, a trimer acid or anhydride thereof, a polymerized fatty acid or anhydride thereof, or a mixture thereof.

Abstract: Provided is an oxygen barrier coating composition includes a resin including a compound of the following formula: where R1 is an alkyl, cycloalkyl, aryl, alkyl aryl, glycol or polyol group, where the alkyl, cycloalkyl, aryl, alkyl aryl, glycol or polyol group is substituted with one or more glycidyl groups, the alkyl group of R1 is further substituted with one or more OH, cycloalkyl, aryl, heteroaryl or glycidyl ethers or combinations thereof, and the cycloalkyl, aryl, alkyl aryl, glycol or polyol group of R1 optionally is substituted with one or more alkyl, OH, cycloalkyl, aryl, heteroaryl or glycidyl ethers or combinations thereof, and R2 is an alkyl, cycloalkyl, aryl or heteroaryl group, where the alkyl, cycloalkyl, aryl or heteroaryl group is substituted with one or more mercapto groups, and the aryl, alkyl aryl, alkyl, cycloalkyl or heteroaryl group optionally is substituted with one or more alkyl, OH, cycloalkyl, aryl, heteroaryl or glycidyl ethers or combinations thereof.

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract: The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: A solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. The fixing resin composition is used to form a fixing member constituting a rotor which includes a rotor core (110) which has a laminate formed by lamination of a plurality of plate members, is fixed and installed on a rotating shaft, and has a plurality of hole portions (150) arranged along the peripheral portion of the rotating shaft, provided in the laminate; a magnet (120) inserted in the hole portion (150); and a fixing member (130) formed by curing a fixing resin composition, filled in the separation portion between the hole portion (150) and the magnet (120), the resin composition including a thermosetting resin (A) containing an epoxy resin; a curing agent (B); and an inorganic filler (C), in which the ICI viscosity at 150° C. of the epoxy resin is equal to or less than 3 poises.

Abstract: To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.

Abstract: The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphinates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates.

Abstract: A process for curing epoxy resins which comprises curing epoxy resin compositions comprising a) epoxy resins and b) a compound of the general formula I in which R1 and R2 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; by adding amino hardeners, and the curing takes place in the presence of a compound of the following formula II in which at least one of the radicals R11, R12 and R13 is a hydrocarbon group having 1 to 10 C atoms, which is substituted with a hydroxyl group and optionally remaining radicals R11 to R13 are an unsubstituted hydrocarbon group having 1 to 10 C atoms.

Abstract: Multi-pack curable composition comprising: a first pack comprising a blend of (i) an epoxy resin, (ii) an unsaturated polyester or vinyl ester resin, and optionally (iii) a peroxyester, a second pack comprising an amine curing agent for the epoxy resin and at least one transition metal compound selected from iron, copper, and manganese compounds, and at least when the first pack does not contain a peroxyester, a third pack comprising a peroxide.

Abstract: A coating composition comprising a polyglycidyl ether of a 2,2?-biphenol that is substantially free of bisphenol A, bisphenol F and their derivatives and residues is disclosed. Food packages coated at least in part with such coatings are also disclosed.

Abstract: Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a poly(amino acid)-polyol compound provided by reacting: b1) one or more amino acids selected from the group consisting of primary amino acids and secondary amino acids and combinations of these; the amino acid having no more than one hydroxyl group; and b2) one or more polyepoxy compound comprising at least two or more epoxy groups; the poly(amino acid)-polyol compound having a range of at least 10 percent conversion of epoxy equivalents of component (b1) up to, but excluding, the gel point of the components b1) and b2) and c) reinforcing agent; and, optionally, d) polymeric toughener; and f) further additives. Processes for making the composition are also disclosed.

Abstract: The invention relates to a manufacturing process for the preparation of ?,?-branched alkane carboxylic acids providing glycidyl esters with an improved softness or hardness of the coatings derived thereof. In which the mixture of neononanoic acid providing a high hardness is a mixture where the sum of the concentration of the blocked and of the highly branched isomers is at least 50%, preferably above 60% and most preferably above 75%. In which a mixture of neononanoic acids providing soft polymers is a mixture where the concentration of blocked and highly branched isomers is maximum 55%, preferably below 40% and most preferably below 30%.

Abstract: The present invention relates to a method for the establishment of a crack resistant epoxy paint coat and paint compositions suitable for said method. The method is developed for use in ballast tanks e.g. a ballast tank of a vessel. The method involves the steps: (i) applying a paint composition comprising an epoxy-based binder system onto the surface thereby forming a curable paint film on the surface, and (ii) allowing the curable paint film to cure thereby forming the epoxy paint coat. The paint composition has a viscosity of at the most 140 KU, when ready to be applied. The paint composition comprises 35-80% by solids volume of the paint of an epoxy-based binder system having a ratio between the hydrogen equivalents and the epoxy equivalents in the range of 20:100 to 120:100. The paint composition furthermore comprises 0.5-30% by solids volume of the paint of one or more fibres. The fibres have an average length, of at the most 250 ?m.

Abstract: The present invention relates to epoxy resin coating composition which comprises, at least, epoxy resin, a thiol-type curing agent and a curing assistant, being composed of two liquids of liquid (A) containing epoxy resin and a thiol-type curing agent and liquid (B) containing a curing assistant, which liquids are mixed just before using, wherein the thiol-type curing agent contains a branched compound containing a thiol group (P), which compound is an ester of polyhydric alcohol with thiol group-containing carboxylic acid represented by formula (1) HOCO(CH2)nCR1R2SH??(1) (in the formula, R1 represents a hydrogen atom or a linear or branched alkyl group having 1 to 10 carbon atoms, R2 represents a linear or branched alkyl group having 1 to 10 carbon atoms, and n represents an integer of 1 to 4), which exhibits a suitable pot life, excellent curability particularly at low and ordinary temperature and low toxicity.

Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.

Abstract: An epoxy curative is provided comprising: a) a Lewis base, b) calcium nitrate, and c) a polyamine amide salt. The present disclosure additionally provides a composition which is a mixture obtained by mixing the epoxy curative and a curable epoxy resin. The present disclosure additionally provides cured compositions which result from cure of such a mixture.

Abstract: The present invention relates to curing agents for epoxy resins including an alkylated polyethyleneimine. These curing agents have high functionality and a high content of secondary amino groups. Together with epoxy resins, they cure surprisingly quickly and without blushing effects even under humid and cold conditions to form films having very high cross-linking density. They are suited for coatings with high resistance requirements.

Abstract: The invention relates to the use of alkyl or dialkyl-semicarbazone as a hardener for hardening epoxy resin and to a method for controlling the hardening of epoxy resin and epoxy resin compounds.

Abstract: The present disclosure, pertains to resins, fibres, and/or resin/fibre composites. Certain aspects are directed to: the construction, composition and methods for producing resins, resin systems and/or resin blends that are suitable for use in very short fibre polymerisable liquid composites and other composites. Certain aspects are to the treatment of fibres and other types of reinforcement fillers so that they are suitable for use in very short fibre polymerisable liquid composites and other composites. Certain aspects are to methods of use and/or methods for producing very short fibre polymerisable liquid composites that can be produced by combining the aforesaid resins, resin systems and/or resin blends and treated fibres and other types of reinforcement fillers to produce suitable very short fibre polymerisable liquid composites.

Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.

Abstract: An amine-terminated, substantially linear siloxane compound comprises siloxane repeating units conforming to specified structures, one of which contains pendant aromatic groups. The amine-terminated, substantially linear siloxane compound further comprises amine-substituted terminal siloxy groups. An epoxy product is made by reacting an epoxy resin and the amine-terminated, substantially linear siloxane compound.

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

Abstract: A composite material having reinforcing fibres and a matrix of matrix material surrounding the reinforcing fibres. The matrix material contains a resin and the reinforcing fibres contain polyphenylene sulfide.

Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 ?m or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.

Abstract: A salicylic acid salt-containing liquid composition useful as an accelerator for a hardener includes a reaction product of (a) salicylic acid; and (b) at least one amine compound compatible with said salicylic acid such that the composition is in liquid form, the composition has a concentration of salicylic acid at from about 35 weight percent to about 55 weight percent, and the composition has a viscosity in the range of from about 500 mPas to about 20,000 mPa-s at 25° C.; a curable epoxy resin composition containing the salicylic acid salt-containing liquid composition accelerator; and a cured product made from the curable composition.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.

Abstract: A fibre reinforced plastic composite is provided having a matrix material, a plurality of fibres for reinforcement of the matrix material, and at least one thermoplastic additive material for enhancing a fracture toughness of the fibre reinforced plastic composite, wherein the thermoplastic additive material is dissolved in the matrix material. The thermoplastic additive material may initially, i.e., before dissolution in a base material, be in a powdery or granulate form. Additionally, a plastic composite starting material, suitable for a fibre reinforced plastic composite, and a method of manufacturing a fibre reinforced plastic composite are provided. Finally, a component of a wind turbine having a fibre reinforced plastic composite is provided.

Abstract: Methods are generally disclosed for forming and using a release sheet. To form the release sheet, a release coating is applied over a first surface of a base sheet. Generally, the release coating includes a fatty alcohol ester of acrylic acid and a curable monomer, and can also include a curable polymeric resin. Then, the release coating can be cured. In one particular embodiment, the release coating can be substantially free from siloxanes. The release sheet formed according to this method is also generally provided, along with methods of forming a casting sheet using the release sheet are also generally provided.

Abstract: The present invention provides a dual-cure composition containing multifunctional polyols, uretidiones, peroxide curable monomers containing unsaturation and crosslinking agents. The dual-cure composition may be used to form a high modulus material useful as the matrix in a prepreg material and in composites. The present invention also relates to methods for the production of the dual-cure composition, prepreg materials comprising the dual-cure composition and a fibrous support, and composites made from the prepreg material.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: This invention relates to hydrophilic polymer compositions and a preferred application therefore, viz., hydrophilic medical device coatings. The hyaluronic acid hyaluronon by itself or modified as described herein advantageously reacts with compositions disclosed in U.S. Pat. No. 7,776,956 to produce hydrophilic compositions and coatings particularly useable with medical devices.

Abstract: The present invention relates to hydrophilic, i.e., water loving coatings (hereafter referred to as “WLC”). Polyurethane epoxy alkylene oxide coatings usable as coatings on for example, medical devices are a preferred WLC.

Abstract: Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die.

Abstract: A binder composition for a rechargeable battery, including a binder polymer having a glass transition temperature (Tg) of 20° C. or less, and having a storage modulus (60° C.) of 50-150 MPa. The binder composition according to an embodiment can improve life characteristics of the rechargeable battery by efficiently controlling expansion of a negative electrode plate.

Abstract: Adhesives compositions and methods of preparing adhesive compositions are described. The methods generally comprise a) providing a syrup composition comprising i) a free-radically polymerizable solvent monomer; and ii) a solute (meth)acrylic copolymer; and b) radiation curing the syrup composition in the absence of an ionic photoacid generator. In one embodiment, the solute (meth)acrylic copolymer as provided or during curing comprises repeat units derived from at least one alkyl(meth)acrylate monomer, at least one ethylenically unsaturated monomer comprising an acid-functional group; and at least one (meth)acryloyl monomer comprising an epoxy-functional group; and the acid-functional groups crosslink with the epoxy-functional groups.

Abstract: A water pervious concrete surface is described that is formed of a water pervious layer of concrete having interconnected voids, and a water permeable grout within the voids in the pervious layer. The permeable grout is formed of sand particles bonded in an open matrix with a two-part epoxy resin.