Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).

Abstract: A superhydrophobic coating including a plurality of particles and a resin. The particles covalently bond to the resin and the resin does not fill the pores of the superhydrophobic particles such that the three dimensional surface topology of the superhydrophobic particles is preserved.

Abstract: Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof.

Abstract: The present invention relates to the use of cyclic carbonates of the formula I or a mixture thereof in epoxy resin compositions and also to epoxy resin compositions which comprise such cyclic carbonates. in which R1 and R2 independently of each other are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of each other are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; or mixtures thereof, as additives in epoxy resin compositions.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: A structural adhesive exhibiting good humidity resistance in the uncured state, good failure mode after curing, good crash stability, and good corrosion resistance, is provided, as well as methods of use thereof. The structural adhesive and methods of use thereof are applicable, e.g., in complete knock down (CKD) assembly systems, e.g., in the assembly of automobile body structures.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: A curable epoxy resin composition including a defined aromatic epoxy resin component and a defined latent catalyst system, and optionally further additives, the curable composition being a single epoxy resin composition having a prolonged pot life at a processing temperature within the range of 40° C. to 70° C., wherein: (a) the epoxy resin component is a compound of formula (I) in monomeric form or in a low polymeric form thereof, or is a mixture of such compounds: the epoxy resin component having an inherent viscosity within the range of 80 mPas to 300 mPas, measured at a temperature of 50° C.; (b) the latent catalyst system includes at least one metal acetylacetonate and at least one phenolic compound.

Abstract: The invention provides a bituminous composition comprising 20 to 80 wt % bitumen, 0.1 to 7 wt % of a copolymer formed from monomers including ethylene and glycidyl methacrylate or glycidyl acrylate, and 20 to 60 wt % sulphur, all weight percentages based on the weight of the bituminous composition. It further provides a process for making this composition and asphalt compositions comprising such bituminous composition.

Abstract: There is provided a resin composition including a copolymer having structural units of Formula (1), Formula (2), and Formula (3), and a solvent; or a resin composition including a copolymer having structural units of Formula (1), Formula (4), and Formula (5), and a solvent.

Abstract: A method and apparatus for coating reactive polymer pre-impregnated reinforcement material (prepregs). The method comprising continuously applying particles of a reactive thermoplastic resin to a first surface of a porous substrate, followed by continuously coating the reactive polymer prepreg. An apparatus for coating reactive polymer pre-impregnated reinforcement material (prepregs), comprising: feeder roll(s) of reinforcement material, receiver roll(s) of drapable polymer pre-impregnated reinforcement material, a conveyor belt having the reinforcement material from the feeder roll thereon, and deposition units for depositing the coating.

Abstract: The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

Abstract: There is provided a reinforcing material equipped with a cohesive/adhesive layer, having a proper initial adhesion force to an adherend, such as an electrolyte membrane, a catalyst layer and a gas diffusion layer, and which can be temporarily fixed readily. A reinforcing material produced by forming a cohesive/adhesive layer on a substrate. The cohesive/adhesive layer includes an aliphatic polyamide, an epoxy resin and a polythiol. When the reinforcing material is used, it becomes possible to correct the position of an adherend after the adhesion of the reinforcing material to the adherend. In addition, it can prevent the formation of wrinkles on the adherend or the like upon the adhesion of the reinforcing material. Therefore, a catalyst layer laminated membrane or the like which has a reinforcing material attached thereto can be produced readily without requiring the employment of any highly skilled technique.

Abstract: Polymer compositions are described containing a thermoplastic polymer in combination with one or more components, such as a white pigment and optionally one or more reinforcing fillers. In one embodiment, the polymer composition can be formulated to have high reflective properties. In other embodiments, the polymer composition can be formulated so as to have desired melt flow characteristics. In still another embodiment, the polymer composition can be formulated so as to have desired mechanical properties, such as impact resistance.

Abstract: Cured epoxy resins are widespread on account of their outstanding mechanical and chemical properties. It is common to use epoxy resins based on bisphenol A diglycidyl ether or bisphenol F diglycidyl ether, but for many sectors these are problematic because of their endocrine effect. The present invention relates to 2-phenyl-1,3-propanediol diglycidyl ether derivates and to curable epoxy resin compositions based thereon, as alternatives to the bisphenol A or bisphenol F diglycidyl ethers and to the epoxy resin compositions based thereon.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The adhesive composition used in a medical instrument containing: a main agent which is an epoxy resin selected from the group consisting of bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and phenol novolac type epoxy resins; a curing agent comprising one or both of meta xylylene diamine and a derivative thereof; acrylic rubber, a filler which contains alumina.

Abstract: The present invention concerns low-odor, low-viscosity hardeners for epoxy resins, including an amine with at least one amino group of formula (I) and an amine with at least one amino group of formula (II), wherein the amino groups of formulas (I) and (II) are present in a particular ratio. These hardeners harden quickly with epoxy resins and without blushing to form films of high hardness and good resistance. They are especially suitable for low-emission coatings.

Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Abstract: The present invention provides coating powders that enable improved filiform corrosion resistance in clear or tinted clear coating comprising an epoxy functional acrylic copolymer component having a Tg of from 40° C. to 90° C. and chosen from a copolymer or copolymer mixture that comprises, based on the total weight of copolymerized monomers in the epoxy functional acrylic copolymer component, i) from 10 to 40 wt. % of one or more epoxy functional unsaturated monomer, e.g. glycidyl (meth)acrylate; ii) from 2.0 wt. % to 13 wt. %, preferably 12 wt. % or less, or, more preferably, 6 wt. % or less, of one or more hydrophobic acrylic monomer that has a mass solubility in water of 3.5 g/L or less and which would itself form a homopolymer having a glass transition temperature (Tg) of 50° C. to 175° C., e.g. a bicycloalkyl(meth)acrylate, and iii) the remainder of one or more nonionic comonomer that is not a hydrophobic acrylic monomer ii), e.g.

Abstract: A composite material includes a polymer matrix material and filler material that includes vitreous china. The composite material has a water absorption of less than about one percent. Such a composite material may be used in the production of articles such as sinks, bathtubs, shower receptors, and other articles that may benefit from low water absorption properties.

Abstract: The present invention relates to a cyanate ester resin composition and a prepreg, a laminated material and a metal clad laminated material made therefrom. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: wherein, R and R1 represent hydrogen, alkyl, aryl or aralkyl, and n represents an integer between 1 and 50. The cyanate ester resin composition of the present invention has good mechanical properties, heat resistance and flame retardance. The laminated material and the metal clad laminated material made from the prepreg that is made from the cyanate ester resin composition, still have good flame retardance, low coefficients of thermal expansion in X, Y directions, and good mechanical properties, without using halogen-containing compounds or phosphorus-containing compounds as the flame retardant.

Abstract: A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition.

Abstract: The present disclosure relates to a curing agent for a curable resin which is a reaction product obtained from the reaction of a liquid epoxy and a polyamine component. The curing agent may be used as part of a two component curable system for the curing of unmodified epoxy resins.

Abstract: A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

Abstract: A two-component epoxy resin composition, including: a resin component which includes at least one epoxy resin and at least one aldehyde, and a hardener component which includes at least one polyamine having at least one primary amino group.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1?-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition.

Abstract: An energy curable coating composition is provided for use as an overprint varnish on cellulosic, polymeric and metal substrates. The coating composition includes an epoxy acrylate, a triacrylate, and optionally, a diacrylate. The coating composition is applied to a substrate and cured by radiation to form a thermoformable protective coating. The coated substrate may then be thermoformed into a shaped food package or article.

Abstract: The present invention relates to a floor (10) comprising at least one floor element (12) and an adhesive composition (16), wherein the at least one floor element is adhesively connected to a surface (15) below the floor element via the adhesive composition, wherein the adhesive composition comprises a mixture of: an adhesive (18), and multiple resilient particles (20) which support the floor elements, wherein the multiple resilient particles (20) are configured to support the floor elements at a distance (22) from the surface (15), wherein the particles have different shapes and varying sizes, wherein a part of the space (24) between the surface below the floor elements and the floor elements is filled with the adhesive composition (16) and a part of the space is filled with air (26).

Abstract: The present disclosure relates to a water-based amine curing agent which is a reaction product obtained from the reaction of an aqueous epoxy resin dispersion and a polyamine component. The water-based amine curing agent may be used as part of a two component coating system in the curing of modified or unmodified liquid or pre-dispersed curable resin.

Abstract: Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.

Abstract: Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound comprising, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes.

Abstract: An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 ?m. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.

Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.

Abstract: A method for preparing a superhydrophobic random copolymer using a carbon dioxide solvent, and more particularly, to a method for preparing a surface coating copolymer having a superhydrophobic performance by radical copolymerization of a hydrocarbon monomer, and a silicone monomer or a fluorinated monomer using a supercritical carbon dioxide solvent as a copolymerization solvent.

Abstract: Described are film-forming compositions comprising a polyepoxide and a curing agent comprising an acid functional acrylic polymer, as well as coating systems comprising a coating deposited from such compositions and related processes and coated substrates.

Abstract: Disclosed are a thermosetting light-reflective resin composition, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom, and an optical semiconductor device including the same. More specifically, disclosed are a thermosetting light-reflective resin composition which includes a polyhydric polyol having two or more hydroxyl groups and thus exhibits superior discoloration resistance and entails little deterioration in reflectance, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom and an optical semiconductor device including the same.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high compression strength under hot and wet conditions, as well as, high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes polyamide particles which are composed of the polymeric condensation product of a methyl derivative of bis(4-aminocyclohexyl)methane and an aliphatic dicarboxylic acid.

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract: A composition comprising a polyepoxide, a hardener, trimethyl borate, and a flame retardant is disclosed. Methods for preparing the composition and its end uses are also disclosed.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: Disclosed is a process for the manufacture of a polyalkylene terephthalate such as polybutylene terephthalate. In particular, the process comprises employing a titanium-containing catalyst formed by the reaction product of tetraalkyl titanate and a complexing agent comprising a phosphorous, nitrogen or boron atom. The process is used to prepare polyalkylene terephthalates characterized by improved hydrostability, as well as compositions derived therefrom.

Abstract: Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract: The present invention relates to novel high-latency liquid hardeners for hardening of curable polymer resins, especially epoxy resins, and to epoxy resin compositions comprising liquid hardeners for the production of fibre composite materials.

Abstract: Provided are a composition for anti-scratch and wear-resistance properties, a method of preparing the same, and its application. The composition has inorganic particles, a dispersant and an organic binding agent. The inorganic particles are spherical and have an average particle size ranging from 10 nanometers to 999 nanometers. The dispersant has an inorganic dispersant and a polymer dispersant. The specific gravity of the inorganic particles and inorganic dispersant are respectively represented by s1 and s2, 0.05<s2/s1<1. The total amount of inorganic particles and inorganic dispersant ranges from 0.5 to 70 parts by weight, the amount of polymer dispersant ranges from 0.1 to 20 parts by weight, and the amount of organic binding agent ranges from 10 to 98 parts by weight. Since the inorganic particles are stably dispersed in the composition, the composition can be applied to coating, paint or composite materials and has improved wear-resistant and anti-scratch properties.

Abstract: This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up type multilayer printed circuit board, and to an insulating film manufactured using the epoxy resin composition, and to a multilayer printed circuit board in which inner circuits formed of copper (Cu) are insulated by virtue of the insulating film to thus form multiple layers.

Abstract: It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.

Abstract: The present invention relates to a thermally curable binder resin including an epoxy group-containing ethylenic unsaturated monomer and an aqueous monomer including an ethylene oxide group; or an epoxy group-containing ethylenic unsaturated monomer, a compound including an acidic component, and an aqueous monomer including an ethylene oxide group, a thermally curable resin composition including the same, a cured film prepared therefrom, a color filter, and a liquid crystal display device. The thermally curable binder resin of the present invention may significantly enhance the coatability of a cured film forming composition and increase the surface energy of a coated protective film to significantly enhance the recoating properties in subsequent processes after formation of the protective film.