Direct Application Of Electrical, Magnetic, Wave, Or Particulate Energy Patents (Class 427/457)
- Fluidized bed utilized (Class 427/459)
- Flock or fiber applied (Class 427/462)
- Nonuniform or patterned coating (e.g., ink jet printing, etc.) (Class 427/466)
- Superposed diverse or multilayer similar coatings applied (Class 427/470)
- Applying coatings to opposite sides of a substrate (excluding processes where all coating is by immersion) (Class 427/471)
- Positioning, orientation, or application of nonsprayed, nonatomized coating material solely by electrostatic charge, field, or force (Class 427/472)
- Solid particles or atomized liquid applied (Class 427/475)
- Plasma initiated polymerization (Class 427/488)
- Multiple applications of identical radiation energy source to polymerize (e.g., pulse, flash, lamp, etc.) (Class 427/492)
- Application of plural diverse energy sources to polymerize (e.g., electromagnetic wave plus resistance heat, ultraviolet wave plus infrared wave, etc.) (Class 427/493)
- Gloss control (e.g., light scattering, etc.) (Class 427/494)
- Polymerization involving the control of oxygen containing gas as an inhibitor (e.g., air, etc.) (Class 427/495)
- High energy electromagnetic radiation or high energy particles utilized (e.g., gamma rays, X-rays, atomic particles, i.e., alpha rays, beta rays, electrons, etc.) (Class 427/496)
- Low energy electromagnetic radiation utilized (e.g., UV, visible, IR, microwave, radio wave, actinic, laser, etc.) (Class 427/508)
- Resistance or induction heat-initiated polymerization (Class 427/522)
- With simultaneous sputter etching of substrate (Class 427/524)
- Organic material present in substrate, plating, or implanted layer (Class 427/525)
- Nonuniform or patterned ion plating or ion implanting (e.g., mask, etc.) (Class 427/526)
- Silicon present in substrate, plating, or implanted layer (Class 427/527)
- Inorganic oxide containing plating or implanted material (Class 427/529)
- Inorganic metal compound present in plating or implanted material (e.g., nitrides, carbides, borides, etc.) (Class 427/530)
- Metal or metal alloy substrate (Class 427/528)
- Metal or metal alloy plating or implanted material (Class 427/531)
- Ionized gas utilized (e.g., electrically powered source, corona discharge, plasma, glow discharge, etc.) (Class 427/533)
- Arc or electrical discharge (Class 427/540)
- Drying (Class 427/541)
- Induction or dielectric heating (Class 427/543)
- Resistance heating (Class 427/545)
- Magnetic field or force utilized (Class 427/547)
- High energy electromagnetic radiation or high energy particles utilized (e.g., gamma ray, X-ray, atomic particle, i.e., alpha ray, beta ray, high energy electron, etc.) (Class 427/551)
- Low energy electromagnetic radiation (e.g., microwave, radio wave, IR, UV, visible, actinic, laser, etc.) (Class 427/553)
- Sonic or ultrasonic (e.g., cleaning or removing material from substrate, etc.) (Class 427/560)
- Utilizing plasma with other nonionizing energy sources (Class 427/570)
- Generated by microwave (i.e., 1mm to 1m) (Class 427/575)
- Metal, metal alloy, or metal oxide coating (Class 427/576)
- Inorganic carbon containing coating material, not as steel (e.g., carbide, etc.) (Class 427/577)
- Silicon containing coating material (Class 427/578)
