Abstract: An apparatus includes a flip-chip semiconductor substrate, a light detection element configured to be formed over the flip-chip semiconductor substrate and to have a laminate structure including a first semiconductor layer of a first-conductive-type, a light-absorption layer formed over the first semiconductor layer, and a second semiconductor layer of a second-conductive-type formed over the light-absorption layer, an inductor configured to be connected to the light detection element over the flip-chip semiconductor substrate, an output electrode for bump connection configured to output a current generated by the light detection element through the inductor, a bias electrode for bump connection configured to apply a bias voltage to the light detection element through a bias electrode, and a line configured to cause a metal line of the inductor and the light detection element to be connected to the output electrode or the bias electrode.

Abstract: This substrate (11) for a device (50) that collects or emits radiation comprises a transparent polymer layer (1) and a barrier layer (2) on at least one face (1A) of the polymer layer. The barrier layer (2) consists of an antireflection multilayer of at least two thin transparent layers (21, 22, 23, 24) having both alternately lower and higher refractive indices and alternately lower and higher densities, wherein each thin layer (21, 22, 23, 24) of the constituent multilayer of the barrier layer (2) is an oxide, nitride or oxynitride layer.

Abstract: This disclosure provides systems, methods and apparatus related to light absorbing structures. In one aspect, a light absorbing structure has a metal layer and a semiconductor layer in contact with the metal layer. Each layer has a thickness up to about 50 nm. The metal layer can include at least one of titanium (Ti), molybdenum (Mo), and aluminum (Al). The semiconductor layer can include a layer of amorphous silicon (a-Si). The light absorbing structure can be included in a display apparatus having a substrate supporting an array of display elements. The light absorbing structure can include a dielectric layer in contact with the metal layer and a thick metal layer in contact with the semiconductor layer. In another aspect, a light absorbing structure has a metal layer and an ITO layer in contact with the metal layer. The thickness of the ITO layer can be less than about 100 nm.

Abstract: Provided is a germanium photodetector having a germanium epitaxial layer formed without using a buffer layer and a method of fabricating the same. In the method, an amorphous germanium layer is formed on a substrate. The amorphous germanium layer is heated up to a high temperature to form a crystallized germanium layer. A germanium epitaxial layer is formed on the crystallized germanium layer.

Abstract: A method for manufacturing a light-receiving device includes the steps of forming a stacked semiconductor layer including a non-doped light-receiving layer, the light-receiving layer having an n-type conductivity; forming a selective growth mask made of an insulating film on the stacked semiconductor layer, the selective growth mask having a pattern including a plurality of openings; selectively growing a selective growth layer doped with a p-type impurity on a portion of the stacked semiconductor layer using the selective growth mask; and forming a p-n junction in a region of the light-receiving layer by diffusing the p-type impurity doped in the selective growth layer into the light-receiving layer during growing the selective growth layer. Each of the regions including the p-n junctions corresponds to one of the selective growth layers. The p-n junction in one of the regions is formed separately from the p-n junctions in the other regions.

Abstract: A semiconductor device includes a substrate having an electrode structure. An absorber structure is suspended over the electrode structure and spaced a first distance apart from the first electrode structure. The absorber structure includes i) suspension structures extending upwardly from the substrate and being electrically connected to readout conductors, and ii) a pillar structure extending downwardly from the absorber structure toward the first electrode structure. The pillar structure has a contact portion located a second distance apart from the first electrode structure, the second distance being less than the first distance. The absorber structure is configured to flex toward the substrate under a test condition. The second distance is selected such that the contact portion of the pillar structure is positioned in contact with the first electrode structure when the absorber structure is flexed in response to the test condition.

Abstract: According to one embodiment, a solid-state imaging device includes a pixel outputting a photoelectrically converted signal, an ADC circuit disposed in an edge portion of a pixel area to convert an analog signal of the pixel into a digital signal on the basis of a result of comparison between a signal level output from the pixel and a ramp wave which is a reference, and a multi-ramp-wave generating circuit generating a plurality of ramp waves with different amplitudes and combining the plurality of ramp waves to obtain the ramp wave.

Abstract: A system and method for reducing cross-talk in complementary metal oxide semiconductor back side illuminated image sensors is provided. An embodiment comprises forming a grid around the pixel regions on an opposite side of the substrate than metallization layers. The grid may be formed of a material such as tungsten with a (110)-rich crystalline orientation. This orientation helps prevents defects that can occur during patterning of the grid.

Abstract: Integrated circuit devices include thermal image sensors that utilize quantum dots therein to provide negative resistance characteristics to at least portions of the sensors. The thermal image sensor may include a sensing unit configured to absorb radiation incident on a first surface thereof and first and second electrodes electrically coupled to the sensing unit. The sensing unit includes a plurality of quantum dots therein, which may extend between the first and second electrodes. These quantum dots may be configured to impart a negative resistance characteristic to the sensing unit. In particular, the sensing unit may include a sensing layer having first and second opposing ends, which are electrically coupled to the first and second electrodes, respectively, and the plurality of quantum dots may be distributed within the sensing layer.

Abstract: According to one embodiment, a solid-state image sensing device includes a semiconductor substrate on which a plurality of pixels are arranged, a transparent substrate including a first through via provided in an opening formed in advance to extend through, an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels, and an imaging lens unit arranged on the transparent substrate.

Abstract: According to embodiments of the present invention, a semiconductor resistor structure is provided. The semiconductor resistor structure includes a substrate, a first region of a first conductivity type in the substrate, a second region of the first conductivity type in the substrate, the first region and the second region arranged one over the other, and an intermediate region of a second conductivity type in between the first region and the second region, wherein at least one gap is defined through the intermediate region and overlapping with the first region and the second region. According to further embodiments of the present invention, a semiconductor photomultiplier device is also provided.

Abstract: A patterned substrate includes a substrate body and a plurality of solid patterns. The solid patterns are set on the substrate body, and at least partial pitches between the solid patterns are different.

Abstract: The disclosure relates generally to sealed electronic devices. More particularly, the invention relates to electronic devices employing organic devices having a seal. Packages having organic electronic devices are presented, and a number of sealing mechanisms are provided for hermetically sealing the package to protect the organic electronic device from environmental elements.

Abstract: A graphene-nanoparticle structure includes a substrate, a graphene layer disposed on the substrate and a nanoparticle layer disposed on the graphene layer. The graphene-nanoparticle structure may be formed by alternately laminating the graphene layer and the nanoparticle layer and may play the role of a multifunctional film capable of realizing various functions according to the number of laminated layers and the selected material of the nanoparticles.

Abstract: The invention provides a material for forming a passivation film for a semiconductor substrate. The material includes a polymer compound having an anionic group or a cationic group.

Abstract: A solid-state imaging device in which a pixel circuit formed on the first surface side of a semiconductor substrate is shared by a plurality of light reception regions and second surface side of the semiconductor substrate is the light incident side of the light reception regions. The second surface side regions of the light reception regions are arranged at approximately even intervals and the first surface side regions of the light reception regions e are arranged at uneven intervals. Respective second surface side regions and first surface side regions are joined in the semiconductor substrate so that the light reception regions extend from the second surface side to the first surface side of the semiconductor substrate.

Abstract: A solid state image pickup device which can prevent color mixture by using a layout of a capacitor region provided separately from a floating diffusion region and a camera using such a device are provided. A photodiode region is a rectangular region including a photodiode. A capacitor region includes a carrier holding unit and is arranged on one side of the rectangle of the photodiode region as a region having a side longer than the one side. In a MOS unit region, an output unit region including an output unit having a side longer than the other side which crosses the one side of the rectangle of the photodiode region is arranged on the other side. A gate region and the FD region are arranged between the photodiode region and the capacitor region.

Abstract: An improved image sensor, e.g., CCD, CID, CMOS. The image sensor includes a substrate, e.g., silicon wafer. The sensor also includes a plurality of photo diode regions, where each of the photo diode regions is spatially disposed on the substrate. The sensor has an interlayer dielectric layer overlying the plurality of photo diode regions and a shielding layer formed overlying the interlayer dielectric layer. A silicon dioxide bearing material is overlying the shielding layer. A plurality of lens structures are formed on the silicon dioxide bearing material. The sensor also has a color filter layer overlying the lens structures and a plurality of second lens structures overlying the color filter layer according to a preferred embodiment.

Abstract: A semiconductor device includes a semiconductor substrate, a light receiving element region, a peripheral region, a boundary region, a plurality of signal lines, and a conductive layer. In light receiving element region, light receiving elements for performing photoelectric conversion are formed. Peripheral region is formed outside light receiving element region for performing input/output of an electric signal from/to the outside of the semiconductor substrate. Boundary region is formed between light receiving element region and peripheral region. The plurality of signal lines are arranged in boundary region for performing input/output of electric signals between light receiving element region and peripheral region. Conductive layer is arranged in a layer different from each of the plurality of signal lines. A relative position of conductive layer as seen from each of the plurality of signal lines is all identical, and conductive layer is all arranged in an identical layer.

Abstract: A method of making a semiconductor radiation detector wherein the metal layers which serve as the cathode and anode electrodes are recessed from the designated prospective dice lines which define the total upper and lower surface areas for each detector such that the dicing blade will not directly engage the metal during dicing and therefore prevent metal from intruding upon (smearing) the vertical side walls of the detector substrate.

Abstract: The invention is directed to an avalanche photodiode containing a substrate and semiconductor layers with various electro-physical properties having common interfaces both between themselves and with the substrate. The avalanche photodiode may be characterized by the presence in the device of at least one matrix consisting of separate solid-state areas with enhanced conductivity surrounded by semiconductor material with the same type of conductivity. The solid-state areas are located between two additional semiconductor layers, which have higher conductivity in comparison to the semiconductor layers with which they have common interfaces. The solid-state areas are generally made of the same material as the semiconductor layers surrounding them but with conductivity type that is opposite with respect to them. The solid-state areas may be made of a semiconductor with a narrow forbidden zone with respect to the semiconductor layers with which they have common interfaces.

Abstract: An imaging array comprises a photodetector layer, a readout IC (ROIC) layer, and a charge storage capacitor layer which is distinct from the photodetector and ROIC layers; the layers are electrically interconnected to form the array. The capacitors within the charge storage capacitor layer are preferably micromachined; the charge storage capacitor layer can be an interposer layer or an outer layer.

Abstract: In a photosensor and a method of manufacturing the same, the photosensor comprises: an intrinsic silicon layer formed on a substrate; a P-type doped region formed in a same plane with the intrinsic silicon layer; and an oxide semiconductor layer formed on or under the intrinsic silicon layer, and overlapping an entire region of the intrinsic silicon layer.

Abstract: A semiconductor device contains a photodiode which has a plurality of p-n junctions disposed in a stack. Two contact structures on the semiconductor device are connected across at least one of the junctions to allow electrical connection to an external detection circuit, so that signal current from incident light on the photodiode which generates electron-hole pairs across the connected junction may be sensed by the external detection circuit. At least one of the junctions is electrically shorted at the semiconductor device, so that signal current from the shorted junction may not be sensed by the external detection circuit.

Abstract: Embodiments related to controlling of photo-generated charge carriers are described and depicted.

Abstract: An active sensor apparatus includes an array of sensor elements arranged in a plurality of columns and rows of sensor elements. The sensor apparatus includes a plurality of column and row thin film transistor switches for selectively activating the sensor elements, and a plurality of column and row thin film diodes for selectively accessing the sensor elements to obtain information from the sensor elements. The thin film transistor switches and thin film diodes are formed on a common substrate.

Abstract: A transparent conductive film includes a transparent film substrate; and a first and second crystalline transparent conductive laminate, wherein the second crystalline layer is located between the transparent film substrate and the first transparent conductive layer, and a second content of the tetravalent metal element oxide of the second transparent conductive layer is higher than a first content of the tetravalent metal element oxide of the second transparent conductive layer. The transparent conductive film allows a reduction in crystallization time.

Abstract: Embodiments of the invention relate to substrates comprising a base wafer, an insulating layer and a top semiconductor layer, wherein the insulating layer comprises at least a zone wherein a density of charges is in absolute value higher than 1010 charges/cm2. The invention also relates to processes for making such substrates.

Abstract: An improved method for encapsulating LEDs in a polymer coat is described. A substrate houses an LED, and a polymer layer is brought into proximity with the substrate and LED. The polymer layer is melted over the substrate, encapsulating the LED onto the substrate.

Abstract: Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy.

Abstract: Provided is a copper indium gallium selenium (CIGS)- or copper zinc tin sulfur (CZTS)-based solar cell including a back electrode layer and a light-absorbing layer, wherein the light-absorbing layer has a composition of CuxInyGa1-y(SzSe1-z)2 (wherein 0.85?x<1, 0<y<1, 0<z<1, and each of x, y and z represents a real number) or Cu(2-p)Zn(2-q)Snq(SrSe(1-r))4 (wherein 1.4?p<2, 0<q<2, 0<r<2, and each of p, q and r represents a real number). The CIGS- or CZTS-based thin-film solar cell causes no interlayer delamination and has improved durability and photoelectric conversion efficiency. Also provided is a method for fabricating a CIGS- or CZTS-based thin-film solar cell by which conversion of molybdenum back electrode layer to molybdenum diselenide is controlled.

Abstract: The present invention relates to a graphene sheet and a transparent electrode, and an active layer including the same, and a display device, an electronic device, an optoelectronic device, a battery, a solar cell, and a dye-sensitized solar cell including these. The graphene sheet includes a lower sheet including 1 to 20 graphene layers, and a ridge formed on the lower sheet and including more graphene layers. The ridge has a metal grain boundary shape.

Abstract: Imaging device including several pixels, each pixel including at least: a portion of a diamond layer placed between a first and second electrode, and able to achieve transduction of photons and/or high energy particles radiation into an electrical signal. an electronic circuit for amplification and/or reading of the electrical signal, electrically connected to at least the first electrode and made in a portion of a semiconductor material layer having a thickness lower than or equal to around 1 ?m and forming the surface layer of an SOD type substrate, also including the diamond layer and a dielectric layer placed between the diamond layer and the electronic circuit.

Abstract: An optical module includes a stem, an optical element, data signal lead pins, a printed circuit board, and a post portion. The optical element is mounted on one surface of the stem. The data signal lead pins are connected to the optical element, and protrudes through the other surface of the stem. The printed circuit board has one surface on which data signal transmission lines for contact with the data signal lead pins are formed and the other surface on a part of which a stiffener is formed to protrude. The post portion protrudes from the other surface of the stem, supports the printed circuit board while in close contact with the stiffener such that the data signal lead pins can contact the data signal transmission lines while being disposed linearly above the data signal transmission lines, and includes a coupling portion to be coupled with the stiffener.

Abstract: The method includes: steps of forming an n-type diffusion layer having an n-type impurity diffused thereon at a first surface side of a p-type silicon substrate; forming a reflection prevention film on the n-type diffusion layer; forming a back-surface passivation film made of an SiONH film on a second surface of the silicon substrate; forming a paste material containing silver in a front-surface electrode shape on the reflection prevention film; forming a front surface electrode that is contacted to the n-type diffusion layer by sintering the silicon substrate; forming a paste material containing a metal in a back-surface electrode shape on the back-surface passivation film; and forming a back surface electrode by melting a metal in the paste material by irradiating laser light onto a forming position of the back surface electrode and by solidifying the molten metal.

Abstract: An optical article and method of making the same are provided. The optical article has optical multi-aperture operation. The optical article has one or more electrically conductive and selectively passivated patterns.

Abstract: A semiconductor device contains a photodiode which includes a buried collection region formed by a bandgap well to vertically confine photo-generated minority carriers. the bandgap well has the same conductivity as the semiconductor material immediately above and below the bandgap well. A net average doping density in the bandgap well is at least a factor of ten less than net average doping densities immediately above and below the bandgap well. A node of the photodiode, either the anode or the cathode, is connected to the buried collection region to collect the minority carriers, the polarity of the node matches the polarity of the minority carriers. The photodiode node connected to the buried collection region occupies less lateral area than the lateral area of the buried collection region.

Abstract: An analog silicon photomultiplier system includes at least one analog pixel comprising a plurality of analog photodiodes (APDs), and a capacitor, a signal generator, a phase detector, and a compensation network. The signal generator is configured to generate and propagate a sinusoidal signal concurrently along first and second transmission lines. A capacitor is loaded on the first transmission line when an APD corresponding to the capacitor detects a photon. The phase detector is coupled with the first and second transmission lines, determines a phase difference between the first transmission line and the second transmission line and calculates a number of APDs that have fired from the phase difference. The compensation network is coupled with the second transmission line and the phase detector, and comprises a plurality of compensation capacitors, wherein the compensation capacitors are loaded on the second transmission line in proportion to the number of APDs that have fired.

Abstract: An optoelectronic component having a substrate (1), an anode (2) and a cathode (10) and at least one active layer (6) disposed between the anode and the cathode. An amorphous dielectric layer (3) which contains or consists of a metal oxide, a metal nitride or a metal oxynitride is disposed directly on the cathode-side surface of the anode. The metal contained in the metal oxide, metal nitride or metal oxynitride is selected from one or several of the metals of the group consisting of aluminium, gallium, titanium, zirconium, hafnium, tantalum, lanthanum and zinc.

Abstract: An image sensor pixel includes a photodiode region having a first polarity doping type disposed in a semiconductor layer. A pinning surface layer having a second polarity doping type is disposed over the photodiode region in the semiconductor layer. The second polarity is opposite from the first polarity. A first polarity charge layer is disposed proximate to the pinning surface layer over the photodiode region. An contact etch stop layer is disposed over the photodiode region proximate to the first polarity charge layer. The first polarity charge layer is disposed between the pinning surface layer and the contact etch stop layer such that first polarity charge layer cancels out charge having a second polarity that is induced in the contact etch stop layer. A passivation layer is also disposed over the photodiode region between the pinning surface layer and the contact etch stop layer.

Abstract: A pickup device according to the present invention includes a photoelectric conversion portion, a charge holding portion configured to include a first semiconductor region, and a transfer portion configured to include a transfer gate electrode that controls a potential between the charge holding portion and a sense node. A second semiconductor region is disposed on a surface of a semiconductor region between the control electrode and the transfer gate electrode. A third semiconductor region is disposed below the second semiconductor region. An impurity concentration of the third semiconductor region is higher than the impurity concentration of the first semiconductor region.

Abstract: A woven mesh substrate with semiconductor elements and a method and a device for manufacturing such a substrate, and more particularly a technique that makes it possible to exploit a woven mesh substrate with semiconductor elements in which a plurality of spherical semiconductor elements having a light receiving function or a light-emitting function are installed on a woven mesh substrate in net form that is made up from a plurality of vertical strands that are insulating and a plurality of horizontal strands that are conductive.

Abstract: A method of fabricating a solar cell on a conveyer belt is provided. The method includes the following steps. A first surface of an aluminum foil is coated with a layer of phosphorous mixed with a plurality of graphite powders and put on the conveyer belt. A first thermal treatment is performed to activate a portion of the aluminum foil and the phosphorous layer on the first surface to form an aluminum phosphide (AlP) layer. A molten silicon material is spray-coated on a second surface of the remaining aluminum foil, and a second thermal treatment is performed to make the silicon material transferring into a p-type polySi layer on the n-type AlP layer. A solar cell including the n-type AlP layer and the p-type polySi layer is formed, and the solar cell is respectively annealed and cooled down in a first and a second vertical stack.

Abstract: Embodiments of the present invention include an electron counter with a charge-coupled device (CCD) register configured to transfer electrons to a Geiger-mode avalanche diode (GM-AD) array operably coupled to the output of the CCD register. At high charge levels, a nondestructive amplifier senses the charge at the CCD register output to provide an analog indication of the charge. At low charge levels, noiseless charge splitters or meters divide the charge into single-electron packets, each of which is detected by a GM-AD that provides a digital output indicating whether an electron is present. Example electron counters are particularly well suited for counting photoelectrons generated by large-format, high-speed imaging arrays because they operate with high dynamic range and high sensitivity. As a result, they can be used to image scenes over a wide range of light levels.

Abstract: The object is to improve the conversion efficiency of a photoelectric conversion device. This object can be achieved by a photoelectric conversion device including an electrode and a semiconductor layer which is provided on one main surface of the electrode and contains a I-III-VI group compound semiconductor, wherein the semiconductor layer includes a connection layer that is located at a position on the one main surface side of the electrode and has a tendency that, the closer to the one main surface, the greater a quotient obtained by dividing an amount of substance of a I-B group element by an amount of substance of a III-B group element becomes.

Abstract: A method is for the synthesis of an array of metal nanowires (w) capable of supporting localized plasmon resonances. A metal film (M) deposited on a planar substrate (D) is irradiated with a defocused beam of noble gas ions (IB) under high vacuum, so that, with increasing ion doses a corrugation is produced on the metal film surface, formed by a mutually parallel nanoscale self-organized corrugations (r). Subsequently, the height of the self-organized corrugations peaks is increased relative to the valleys (t) interposed therebetween. Then the whole the metal film is eroded so as to expose the substrate at the valleys, and to mutually disconnect the self-organized corrugations, thereby generating the array of metal nanowires. Finally, the transversal cross-section of the nanowires is reduced in a controlled manner so as to adjust the localized plasmon resonances wavelength which can be associated thereto. The nanowires array constitutes an electrode of an improved photonic device.

Abstract: An embodiment of the invention provides a solid-state image pickup element, including: a semiconductor layer having a photodiode, photoelectric conversion being carried out in the photodiode; a silicon oxide film formed on the semiconductor layer in a region having at least the photodiode by using plasma; and a film formed on the silicon oxide film and having negative fixed charges.

Abstract: A light receiving element includes a core configured to propagate a signal light, a first semiconductor layer having a first conductivity type, the first semiconductor layer being configured to receive the signal light from the core along a first direction in which the core extends, an absorbing layer configured to absorb the signal light received by the first semiconductor layer, and a second semiconductor layer having a second conductivity type opposite to the first conductivity type.

Abstract: A thin-film photoelectric conversion device includes a crystalline germanium photoelectric conversion layer having improved open circuit voltage, fill factor, and photoelectric conversion efficiency for light having a longer wavelength. The photoelectric conversion device comprises a first electrode layer, one or more photoelectric conversion units, and a second electrode layer sequentially stacked on a substrate, wherein each of the photoelectric conversion units comprises a photoelectric conversion layer arranged between a p-type semiconductor layer and an n-type semiconductor layer. At least one of the photoelectric conversion units includes a crystalline germanium photoelectric conversion layer comprising a crystalline germanium semiconductor that is substantially intrinsic or weak n-type and is essentially free of silicon.

Abstract: A solid-state imaging device includes a substrate, a photoelectric conversion element provided on the light incidence side of the substrate and including a photoelectric conversion film sandwiched between a first electrode provided separately for each of pixels, and a second electrode provided opposite the first electrode, the photoelectric conversion film being made of an organic material or an inorganic material and generating a signal charge according to the quantity of incident light, an amplifier transistor having an amplifier gate electrode connected to the first electrode, and a voltage control circuit that is connected to the second electrode, and supplies a desired voltage to the second electrode.