Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

Abstract: A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge.

Abstract: An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region.

Abstract: Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial wiring patterns each forming a current path from the power source to the LSIs are provided by forming gaps in the power supply wiring.

Abstract: An electrical assembly is assembled by affixing two conductors to a battery block without the use of solder, inserting a PCB into a PCB opening in the battery block and inserting a battery into a battery block opening in the battery block. Each of the two conductors will have a first lead in mechanical and electrical contact with the battery without the use of any solder and a second lead in mechanical and electrical contact with the PCB without any use of solder. As a result of such assembly, the PCB is held within the PCB opening by a mechanical fit without the use of any solder.

Abstract: An exemplary power conversion circuit is to convert a voltage from one voltage level to another. The circuit includes an input port, an output port, a main body circuit, a first solder bridge, and a second solder bridge. The input port of the power conversion circuit is an output port of one power conversion circuit previous in sequence to the power conversion circuit, the output port of the power conversion circuit is an input port of one power conversion circuit next in sequence to the power conversion circuit. The first solder bridge is arranged between the input port of the power conversion circuit and the main body circuit of the power conversion circuit. The second solder bridge is arranged between the output port of the power conversion circuit and the main body circuit of the power conversion circuit.

Abstract: There is provided an electrically conductive path device which can prevent radiation noise. An electrically conductive path device includes three bus bars electrically connecting a motor unit to an inverter unit, capacitance portions creating stray capacitance and an insulator. In terms of the electrically conductive path device, switching operation of a semiconductor switch located inside an inverter of the inverter unit creates change in voltage which is transmitted to the bus bar corresponding to a path from the inverter to the motor. At that time, the change in voltage is not transmitted further to the motor but is transmitted to the bus bar corresponding to a path from the motor to the inverter via the capacitance portion formed between the facing portions, i.e. via the stray capacitance.

Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

Abstract: The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising the printed circuit board (2) and an insulation barrier (3), wherein the printed circuit board (2) has an opening (7) between the electric potentials, and the insulation barrier (3) is disposed on the printed circuit board (2) so as to be displaceble through the opening (7) and is designed such that the isolating distance between the two electric potentials can be enlarged by displacing the insulation barrier (3) relative to the printed circuit board (2). The arrangement makes it possible obtain a high packing density on the printed circuit board (2).

Abstract: An embodiment of the present invention discloses a PCB board plug mechanism configured to implement hot plug of a PCB board, and including an output end that moves along a second direction when the input end moves. The second direction is at an angle with the first direction. The connector for connecting the to-be-plugged PCB board is disposed at the output end. In a process in which the output end moves along the second direction, the PCB board can be driven to perform a corresponding hot plug action.

Abstract: A circuit board includes a ceramics substrate composed of ceramics and a conductor portion provided on the ceramics substrate. The conductor portion is composed of a stacked body including, in order from the ceramics substrate side, an under layer that contains a Group 6 element and a glass material, and a metal layer that contains a low-melting-point metal. A portion of the low-melting-point metal constituting the metal layer migrates to the under layer.

Abstract: A display device, comprising a base cover with a base plate, a sidewall portion extended from the base plate and a first coupling hole; a display panel with a first display portion configured to display an image and a second display portion outside and along the first display portion, a top cover with a bezel portion sized to be laid over the second display portion, and a sidewall portion extended from the bezel portion, the top cover including a second coupling hole; and a fixing element with a first coupling portion having a third coupling hole, a contact portion extended from the first coupling portion and configured to maintain contact with a portion of the top cover. A coupling element can be inserted through the first through third coupling holes so as to press the contact portion against a portion of the top cover.

Abstract: In order that even the cell connectors (17) of, for instance, a traction rechargeable battery (11) which carry very high currents can be connected to a battery management system (21) in a fault-resistant and functionally reliable manner, firstly a circuit board (24) in the form of a leadframe (25) encapsulated with plastic by injection molding is latched onto the housing (13) mechanically grouping the cells (12), said circuit board in any case not projecting higher than the adjacent end faces (15) of the cell terminal connections (14) projecting at a clear radial distance therefrom.

Abstract: Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to a top of the lower cover, and an upper cover coupled to the lower cover as one body to cover an upper side of the circuit board. The lower cover and the upper cover are formed of a thermo-hardening resin.

Abstract: The present disclosure relates to a stacked package of a voltage regulator and a method for fabricating the same.

Abstract: A low profile power converter structure is provide wherein volume is reduced and power density is increased to approach 1 KW/in3 by at least one of forming an inductor as a body of magnetic material embedded in a substrate formed by a plurality of printed circuit board (PCB) lamina and forming inductor windings of PCB cladding and vias which may be of any desired number of turns and may include inversely coupled windings and which provide a lateral flux path, forming the body of magnetic material from high aspect ratio flakes of magnetic material which are aligned with the inductor magnetic field in an insulating organic binder and hot-pressed and providing a four-layer architecture comprising two layers of PCB lamina including the embedded body of magnetic material, a shield layer and an additional layer of PCB lamina, including cladding for supporting and connecting a switching circuit, a capacitor and the inductor.

Abstract: A lead frame for a premold sensor housing, in which the lead frame includes at least one angled section having essentially no rounding in an area of contact with the premold sensor housing, the area of contact being provided as a positioning area for a sensor element.

Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.

Abstract: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.

Abstract: A rigid multi-layer printed circuit board (PCB) has an embedded elongated conductor between opposing first and second reference planes. The first and second reference planes are formed of conductive material and are electrically isolated from the conductor by intervening insulative material. Each of the first and second reference planes have a plurality of spaced apart windows extending therethrough, the windows aligned with the elongated conductor.

Abstract: A circuitry arrangement includes several electronic parts mounted to a circuit board, at least one conductor section extending between the electronic parts within a first conductor layer, and a closed conductor loop comprising at least one loop section running in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer. The closed conductor loop is configured to reduce a tendency towards oscillations of a current flowing through the conductor section in operation of the circuitry arrangement. The conductor loop is closed via at least one electronic component mounted to an outer surface of the circuit board.

Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

Abstract: A transformer has two magnetic cores, at least one primary winding unit mounted in the magnetic cores, at least one secondary winding unit mounted in the magnetic cores and two rectifying circuit boards externally mounted beside the magnetic cores. An AC voltage output from the secondary winding unit is transmitted to and rectified by the rectifying circuit board. Therefore, the size of the transformer is compact, and heat energy generated by electronic elements mounted on the rectifying circuit board is effectively dissipated to maintain normal operation of the transformer. Further, since the transmission path from the secondary winding unit to the rectifying circuit board is short, energy loss is reasonably reduced when the transformer is operated under a high frequency situation or a larger current mode.

Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.

Abstract: There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor.

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

Abstract: In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.

Abstract: A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.

Abstract: A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.

Abstract: A haptic operating device particularly for motor vehicles, having a touch panel having at least one touch-sensitive area. When the area is touched, a switching signal can be triggered and the touch panel can be activated by a motion drive to be able to move at a certain rhythm in the plane of the touch panel. The touch panel is connected to a fixed support by one or more flexible connecting elements. The support and the touch panel form two housing parts of a closed housing, in which at least the display device or the display plane thereof is arranged, and are connected to each other by a sealing device so as to be able to move relative to each other in the plane of the touch panel or in a plane parallel to the touch panel.

Abstract: The present invention has an objective to provide a circuit board for a peripheral circuit which can transmit outside heat which generates from a high exothermic element, such as a power semiconductor element, while attaining reduction in size and weight, reduction in surge, and reduction in a loss, in high-capacity modules including power modules, such as an inverter. [Solution Means] In a high-capacity module, by laminating a peripheral circuit using a ceramic circuit board with electrode(s) constituted by thick conductor and embedded therein on a highly exothermic element, overheating of the module is prevented by effective heat dissipation via the circuit board while attaining reduction in size and weight, reduction in surge, and reduction in a loss in the module.

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract: A security protection device includes a cover circuit board comprising at least one inner wiring layer and a base circuit board comprising at least one inner wiring layer. The device further includes a security frame between the base circuit board and the cover circuit board, at least one electrically conductive wire being wound and included within the security frame to form at least one winding protection layer around sides of the security frame. The cover circuit board, the security frame, and the base circuit board form an enclosure enclosing a security zone, and the at least one inner wiring layer within the cover circuit board, the at least one inner wiring layer within the base circuit board, and the at least one electrically conductive wire within the security frame are connectable to a security mechanism configured to detect an intrusion into the security zone.

Abstract: A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.

Abstract: A transparent conductor includes a base layer, and a transparent conductive film on one or both sides of the base layer, the transparent conductive film including a metal nanowire, where the base layer includes a retardation film. An optical display apparatus includes the transparent conductor. The transparent conductor may compensate for a viewing angle of the optical display apparatus.

Abstract: A device includes a printed circuit assembly (PCA) including a printed circuit board and at least one electronic component integrated with the printed circuit board, and a support to which the PCA is securable. At least one of the PCA and the support includes engaging structure elements, and some engaging structure elements are configured to secure the PCA to the support while other engaging structure elements are configured to secure the support to a securing structure within a housing of an electronic device.

Abstract: A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other.

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Abstract: A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-m

Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.

Abstract: A touch panel and a method thereof are provided. The touch panel includes a touch sensor, a shielding layer, and a plurality of conducting foils. The shielding layer is disposed on the touch sensor. The plurality of conducting foils is disposed via an Anisotropic Conductive Film (ACF) on a surface of the shielding layer, which is on an opposite side of a surface of the touch sensor. Any two of the plurality of conducting foils, the ACF, and the shielding layer are connected in series as a signal path.

Abstract: A flexible composite comprising a plastic foil, having an upper and a lower surface, and at least one dielectric barrier layer against gases and liquids which is applied directly to at least one of the surfaces by plasma-enhanced thermal vapor deposition and comprises an inorganic vapor-depositable material, is provided. The flexible composite can be used for constructing flexible circuits or displays and has a high barrier effect with regard to oxygen and/or water vapor.

Abstract: Proposed is a C/U that is designed to accomplish the above object. The CU includes a multilayer circuit substrate, a resin cover, and a metal base. Electronic parts are mounted on both surfaces of the multilayer circuit substrate which is covered with the resin cover and the metal base. The multilayer circuit substrate 8 includes a signal pattern, a GND pattern, an important signal pattern, and a multilayer circuit substrate insulating layer. The GND pattern is electrically connected to the metal base through a screw. The GND pattern is disposed on the side of the resin cover in order to shield the important signal pattern against electromagnetic waves penetrating the resin cover to enter a housing and electromagnetic waves incident from the metal base side. The important signal pattern is disposed so that it is covered with the GND pattern and the metal case.

Abstract: An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.

Abstract: A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines.

Abstract: A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

Abstract: Provided is a conductive structure and a device with the conductive structure as an electrode. The conductive structure includes a reduced metal layer and an overlapping structure formed by nano metal wires. The overlapping structure has at least one connecting portion, and the reduced metal layer covers the nano metal wires at the connecting portions.

Abstract: The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer (L1) and the carrier film.

Abstract: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21) for electrically connecting the components (12, 14) are realized by means of a single layered composite (18). In particular, the electric shield (24) and the conducting path (21) are formed by the same electrically conductive layer, wherein a hole (25) ensures complete electrical insulation of the conducting path (21) from the shield (24). The invention further relates to a method for producing such a circuit carrier.

Abstract: The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.