Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a main body. A first surface of the main body is a connecting surface for electrical components. A second surface of the main body is a conductive cooper foil layer operating as ground wires. A plurality of grooves is arranged on the conductive cooper foil layer. The grooves pass through the conductive cooper foil layer to connect to the main body of the PCB. The thermal stress generated in the PCB welding process can be effectively released via the grooves. The inflation of the conductive cooper coil is relieved such that the PCB is prevented from being wrapped or cooper bubbling. In this way, the operation efficiency is enhanced and the manufacturing cost is reduced.

Abstract: A three-Dimensional Integrated Circuit (3DIC) Chip on Wafer on Substrate (CoWoS) packaging structure or system includes a silicon oxide interposer with no metal ingredients, and with electrically conductive TVs and RDLs. The silicon oxide interposer has a first surface and a second surface opposite to the first surface. The electrically conductive TVs penetrate through the silicon oxide interposer. The electrically interconnected RDLs are disposed over the first surface of the silicon oxide interposer, and are electrically coupled or connected to a number of the conductive TVs.

Abstract: An electronic component thickness measurement method includes extracting, from a plurality of second reference lines in first image data and a plurality of second reference lines in second image data, only a second reference line at which a difference in intensity peak between respective second reference lines at a same position in the first image data and the second image data is smallest, and forming third image data including a first reference line and the extracted second reference line, and calculating a thickness of the electronic component from a distance between the first reference line and the second reference line in the third image data.

Abstract: An electronic device includes a self-emitting display panel, a first transparent substrate, a second transparent substrate and two combining elements. The first transparent substrate includes two first edge portions and a first cover portion. The second transparent substrate includes two second edge portions and a second cover portion. The self-emitting display panel is disposed between the first cover portion and the second cover portion. The self-emitting display panel has a first surface facing to and covered entirely by the first cover portion and a second surface facing to and covered entirely by the second cover portion. One of the two combining elements is connected between one of the two first edge portions and one of the two second edge portions, and the other of the two combining elements is connected between the other of the two first edge portions and the other of the two second edge portions.

Abstract: A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.

Abstract: An electronic component module includes a board having an electronic component mounted on a surface of the board and a shield case mounted on the surface of the board and covering the electronic component. The board includes a projecting part projecting from the surface of the board. The projecting part is formed of plating at a position along a sidewall of the shield case and is soldered to the shield case.

Abstract: An electronic device includes a cover glass, two supporting frames, and a display module. The cover glass includes a central portion and two curve portions extending from two opposite edges of the central portion. The central portion includes an outer surface and an inner surface opposite to the outer surface, each curve portion is curved from an edge of the central portion toward the inner surface. Each curve portion includes a first curving surface facing the same direction as the inner surface. Each supporting frame includes a fixing portion and a supporting portion connected to the fixing portion. Each fixing portion includes a second curving surface corresponding and connecting to the first curving surface. The two supporting portions are opposite to each other, and form a receiving room with the central portion. The display module is received in the receiving room.

Abstract: An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL0 from the data transferring element to a first branch point S1 where a branch line is branched at a shortest distance from the data transferring element is configured to become equal to or greater than a wiring length TL1 from the first branch point S1 to a second branch point S2 where a second branch line is branched. A wiring length TL3 from the second branch point S2 to a third branch point S3 where a third branch line is branched is configured to become greater than the wiring lengths TL0 and TL1.

Abstract: An assembly includes an LED with two conductive leads, two conductive wires in which an insulator surrounds a conductor, and a housing. The two conductive wires are inserted into and held by a wire cavity of the housing. Each of the two conductive leads is inserted into a different LED lead hole of the housing. Electrical contact is made by each of the two conductive leads with the conductor of one of the two conductive wires and the LED is held by the housing. The conductive leads can have a sharp point that penetrates the insulator and the conductor when the LED is inserted into the housing. The LED can be seated in a LED cavity of the housing while insertion of the LED into the LED cavity creates an interference fit in which conductive portions of the wires opposite the exposed conductors are compressed against the housing.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract: The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board.

Abstract: Apparatus, systems, and methods for signal referencing for memory are described. In one embodiment, connector for a memory device comprises a housing having a first panel and a second panel opposite the first panel to be positioned adjacent a circuit board, the first panel and second panel defining a slot to receive a portion of the memory device, a first plurality of electrically conductive pins disposed in the slot and proximate the first panel to establish electrical connections with a plurality of electrical connectors on the memory device, wherein at least one of the first plurality of pins is a ground pin and a layer of conductive material disposed proximate the second surface. The ground pin is electrically coupled to the layer of conductive material. Other embodiments are also disclosed and claimed.

Abstract: Methods of forming coreless package structures comprising backside land side capacitors (LSC) and dual sided solder resist are described. Those methods and structures may include forming a nickel coating on a first and second side of a core, forming a conductive plating on the nickel coating, forming building up layers on the conductive plating to form two panels on the core, de-paneling the panels from the core to form two coreless substrates, forming a laminate on the first and second sides of the coreless substrates, and forming an LSC on a backside of the coreless substrates.

Abstract: A frame module is adapted to be disposed in a housing of a computer for fixing first and second electronic devices. The computer includes a motherboard unit with a socket connector. The frame module includes a frame body having top and bottom surfaces adapted to be connected respectively to the first and electronic devices. An adaptor board includes a board body connected transversely to a rear edge of the frame body and having an edge connector adapted to be inserted into the socket connector, and first and second electrical connectors for electrical connection with the first and second electronic devices, respectively.

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract: The present invention relates to an electronic circuit arrangement (10) comprising: a substrate (12) having a first surface (12a) and a second surface (12b), an electronic circuit, an electrical connection part (16) for providing an electrical connection to the electronic circuit and being arranged on the first surface (12a), and at least one electrical wire (18). The electrical wire (18) comprises at least one conductive core (20) and an isolation (22) surrounding the conductive core (20). An end portion (18a) of the electrical wire (18) is an isolation-free portion for allowing access to the conductive core (20), wherein the end portion (18a) of the electrical wire (18) is connected to the electrical connection part (16). At least one through-hole (24) extending from the first surface (12a) to the second surface (12b) is provided in the substrate (12), wherein the electrical wire (18) is arranged through the through-hole (24).

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: There is disclosed a watch type mobile terminal including a case comprising a front surface in which a display is mounted, and a first connecting hole connected to the mounting space in which a main board is mounted; a connector comprising a connecting passage having one end inserted in the first connecting hole, penetrating from the end and the other end; a strap comprising an inner space and a second connecting hole connected to the inner space, with one end hingedly coupled to the other end of the connector; and a flexible circuit board extended from the mounting space of the case to the inner space of the strap via the connecting passage, with one end connected to the main board, wherein a connected state between the second connecting hole and the connecting passage is maintained when the hinged coupling is rotated.

Abstract: An image display device includes a display to output an image, a first support plate disposed at a rear surface of the display for support, a second support plate spaced apart from a rear surface of the first support plate, and having electronic devices mounted thereon, and at least one hinge unit to connect the first support plate and the second support plate to each other by a hinge such that the second support plate resists transformation during transformation of the first support plate.

Abstract: A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.

Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

Abstract: The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly.

Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Abstract: Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided.

Abstract: An electronic device is provided. In the electronic device, a cover is securely fitted to a predetermined positioning hole formed in a printed board using a ready-made cover without using solder when the cover is installed in the printed board, so that the cover is prevented slipping from the printed board. The positioning hole is formed in a predetermined position of the printed board, and a cover claw that can be fitted to the positioning hole of the cover is formed in the cover, so that the cover covers the principal surface of the printed board to provide an electronic device.

Abstract: An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

Abstract: A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules comprising at least one processor module and a plurality of test modules, each having the same physical footprint, including respective racking mechanisms and inter-module interface connectors; and a backplane with connectors connecting with a respective inter-module connector, and bus-work interconnecting the respective modules through the inter-module interface connectors and the backplane connectors. The backplane may comprise a battery and display connector. The chassis may comprise a display mounting receptacle configured to receive a display unit having a display connector configured to interface with the backplane display connector. A battery receptacle may receive a battery unit, such as a rechargeable battery.

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract: A thermally deformable assembly is formed in an integrated-circuit metallization level. The physical behavior of the metal forming the assembly brings the assembly into contact with a stop-forming body when subjected to a temperature change caused by a current flow. A natural rollback to the initial configuration in which the assembly is a certain distance away from the body is prevented. The state or configuration of the assembly is determined by a capacitive reader.

Abstract: The present invention discloses a circuit board, including a substrate and a magnetic core, where the magnetic core is embedded into the substrate, at least one turn of a winding conductor wound around the magnetic core is arranged on the substrate, each turn of the winding conductor includes a first end-surface conductor and a second end-surface conductor that are separately arranged on two ends of the magnetic core, and each turn of the winding conductor further includes a first side-surface conductor that penetrates through the magnetic core from an inner side of the magnetic core and a second side-surface conductor that penetrates through the magnetic core from an outer side of the magnetic core. The circuit board and the power conversion apparatus having the circuit board provided by the present invention, achieve larger inductance, save materials, and reduce cost for fabricating a power conversion apparatus.

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract: A display includes an upper surface adapted to present visual information to a device user and an outer perimeter proximate the upper surface. An optically transparent lens is carried by a housing and overlies the display. The optically transparent lens and the upper portion of the housing together define an upper surface of the portable electronic device. An optically transparent resin is carried between the display and the optically transparent lens. The optically transparent resin includes a perimeter portion disposed between the outer perimeter of the display and the side portion of the housing. The resin can be cured using light.

Abstract: A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side.

Abstract: According to one embodiment, an electronic apparatus includes a substrate with a plurality of conductors, a component with a plurality of first terminals, and a deformation suppressing member attached to the substrate. The first terminals of the component are arranged in a first direction and connected to the conductors. When a certain bending deformation occurs in the substrate, the deformation suppressing member is configured to convert the certain bending deformation into a bending deformation in a direction perpendicular with the first direction.

Abstract: A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.

Abstract: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member, in which at least one clamping depression is formed on an inner wall of the locking member corresponding to the clamp hook, and the clamp hook is clamped in one clamping depression.

Abstract: An electronic device includes a substrate; and a plurality of thin-film elements formed on the substrate. Further, the thin-film element includes a thin-film section having a function selected from a group including piezoelectric effect, inverse piezoelectric effect, charge storage, semiconductivity, and conductivity, and the plurality of thin-film elements includes the thin-film sections having two or more different functions.

Abstract: Safety devices are provided having a power generating part and a safety-critical part. A conducting ring is provided at least around the power generating part. The ring may be connected to a reference potential such as ground.

Abstract: In one embodiment, the display device includes a display panel and a support frame. The display panel includes a flexible upper substrate, at least one light emitting diode, and a flexible lower substrate (30). The display panel has a display area formed at a portion corresponding to the light emitting diode, and a non-display area formed at a portion other than the display area. The display panel is coupled to the support frame such that a portion of the non-display area is bent with respect to the display area.

Abstract: There are disclosed a digital signage including a display panel, a first support panel coupled to a rear surface of the display panel, the first support panel comprising a plurality of first grooves formed in one direction, a second support panel coupled to a rear surface of the first support panel, the second support panel comprising a plurality of second grooves formed in an orthogonal direction with respect to the first grooves, a driving circuit board provided in a rear surface of the second support panel to control driving of the display panel, and a case comprising the display panel arranged in one surface thereof and an inner space where the first support panel, the second support panel and the driving circuit board are mounted, wherein both ends of the first grooves are open toward the inner space of the case to induce air flow in the case, and both ends of the second grooves are in communication with the outside via a hole formed in the case to flow external air there through, such that the support s

Abstract: A method for testing an electronic device comprises providing a device under test (DUT) defined on a printed circuit board (PCB). The DUT includes a measurement target layer forming part of the PCB, and a transmission line which is in contact with the measurement target layer. The method further comprises applying an electric power to the transmission line, measuring a capacitance of the measurement target layer while the electric power is being applied, and computing a thickness of the measurement target layer based on the measured capacitance.

Abstract: A mobile terminal includes a terminal body, a case defining an appearance of the terminal body, the case formed of a non-metal, and a metal frame formed of a metal, at least part of the metal frame extending through the case from inside to outside of the terminal body so as to be externally exposed, wherein the case and the metal frame are integrally formed with each other. Accordingly, a specific pattern can be realized at the appearance of the terminal body to arouse distinctive attraction to the appearance, thereby providing a terminal with such attractive appearance.

Abstract: A daughter circuit board of a brushless DC motor for interface signal conversion, having circuit units integrated on the daughter circuit and eight ports for communicating with a control system of a user terminal. The daughter circuit board is plugged into a motor controller for signal conversion so that the motor controller communicates with the control system of the user terminal. The eight ports include a signal input port of analog control, a signal port for activating a fan mode, signal ports of speed feedback, a reserved signal port, a port of COM, a port of DC power supply, and a R/T port.

Abstract: An electrical assembly for a motor vehicle is configured to contact a connector. Contact surfaces are provided on a circuit board of the assembly. The connector has contact elements for contacting the contact surfaces. A housing of the assembly has an inner chamber and a contacting chamber directed toward the connector area, with the inner wall therebetween to separate the chambers. The circuit board including the electrical components is arranged in the inner chamber and only a contacting area with the contact surfaces protrudes through the inner wall into the contacting chamber.

Abstract: The invention relates to a circuit board sensor (1) for measuring physical variables, comprising a substrate board (2) and a second board (3) both made of glass, wherein at least the second board (3) is designed such that said board is elastically deformable, wherein the substrate board (2) and the second board (3) each comprise a first and a second side (2a, 2b, 3a, 3b), wherein the second side (2b) of the substrate board (2) and the first side (3a) of the second board (3) are disposed opposite each other, and wherein a spacer element (7) is disposed between the substrate board (2) and the second board (3) and holds the substrate board (2) and the second board (3) at a mutual distance, wherein the substrate board (2) and the second board (3) extend in particular parallel to each other, wherein the second side (2b) of the substrate board (2) comprises a first metal or polymer surface (5a) and the first side (3a) of the second board (3) comprises a second metal or polymer surface (5b), and wherein the first an

Abstract: A structure such as a button may have a substrate. Components such as switches may be mounted on the substrate. The substrate may be a printed circuit board with solder pads. A snap member may be soldered to one of the solder pads. A metal clip may have a snap arm with an opening. The metal clip may be attached to the printed circuit board. When attached, the opening in the snap arm may mate with the snap member that is soldered to the solder pad on the printed circuit board. The printed circuit board may be attached to a button housing member. A button cover member may be attached to the clip. A ground connection may be formed between the metal clip and the snap member by providing the snap member with structures that bear against the metal clip and form an electrical connection.

Abstract: A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed.

Abstract: An electronic device and a display module used therein are provided. The display module includes a display panel, a backlight module and a sensing antenna. The backlight module has a light exit surface and a reflective plate opposite to the light exit surface, and the display panel is stacked on the light exit surface. The sensing antenna is disposed on a surface of the reflective plate opposite to the light exit surface and has a body and two signal connecting terminals connecting the body. The electronic device includes the display module, a system circuit module, and a conductive device. The system circuit module is disposed on a back side of the display module and has a signal connecting parts corresponding to and connecting the signal connecting terminals.

Abstract: Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.