Abstract: A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.

Abstract: A printed circuit board (PCB) assembly includes a first printed circuit board that includes first circuit traces formed of copper. A second printed circuit board includes second circuit traces that are formed of nickel/gold plated copper and terminations that are soldered to the first circuit traces. An electrical component contacts the second circuit traces.

Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.

Abstract: Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

Abstract: A portable electrical energy source provides power for a portable electronic device and includes a base, a chargeable battery, and a connector. The base includes a first surface and a second surface facing away from the first surface. The base defines a receiving room between the first surface and the second surface. The chargeable battery is received in the receiving room. The connector is positioned on the first surface and is electrically connected to the chargeable battery, which is electrically connected to the portable electronic device. The chargeable battery charges the portable electronic device through the connector.

Abstract: An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.

Abstract: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

Abstract: A plug-in unit includes: a printed circuit board on which a connector is mounted; and a cover in which the printed circuit board is accommodated; wherein the cover allows the connector to be exposed when the plug-in unit is inserted into a housing and to be covered when the plug-in unit is in a standalone state in which the plug-in unit is not inserted into the housing.

Abstract: The present invention provides a box-type housing for a multiplexer having a generally flat base plate, a circuit board disposed on the base plate, and at least one partition member arranged on top the circuit board to isolate components of the circuit board and to mechanically secure the circuit board to the base plate. The invention also provides a method of isolating components of a circuit board in a box-type housing for a multiplexer and a method of providing a ground connection to a base plate of a box-type housing for a multiplexer.

Abstract: An electronic device includes a metallic housing having a front wall with a mounting hole communicating with an interior thereof, and a front cover spaced apart from the front wall and having an access slot corresponding in position to the mounting hole. A circuit module includes a circuit board disposed within the metallic housing and having an extension protruding out of the front wall via the mounting hole, and an electrical connector disposed on the extension. A conductive ground element is disposed pivotally within the metallic housing in proximity to the mounting hole, and abuts against the electrical connector to conduct static electricity of the electrical connector to the metallic housing.

Abstract: The electric box includes a box body, a control assembly and a protection structure. The box body has a chamber. The control assembly is received in the chamber. The protection structure includes a protector and at least one passing hole located on a side of the box body and communicating with the chamber. The protector is received in the chamber and located on a side of the control assembly. The protector is provided with at least one through hole corresponding to the at least one passing hole. The passing hole and through hole are used for being passed by a wire.

Abstract: A continuous substrate including a first portion with a plurality of electronic components, and at least one strain relief area located proximate a fastening location, wherein the at least one strain relief area is located between the first portion and the fastening location.

Abstract: In described embodiments, a printed circuit board assembly capable of discharging electro-static discharge (ESD) surges includes an isolation trench track provided in the printed circuit board in close proximity to the peripheral edges between the peripheral edges and the mounting area, and a discharge path formed of conductive material to ground provided between the isolation trench track and the peripheral edges. The discharge path includes the board mounting screws and connects to a power connector ground of the printed circuit board.

Abstract: A power supply module suitable for a server is provided. The server includes a base and a main board. The main board is disposed on the base. The power supply module includes a frame and a first power connector. The frame is disposed on the base and adjacent to an edge portion of the main board. The first power connector is slidably disposed on the frame. When the first power connector slides to a first position, the first power connector protrudes from the frame and the edge portion of the main board is located between the first power connector and the base. When the first power connector slides to a second position, the first power connector is located in the frame.

Abstract: A semiconductor module includes a circuit substrate, a first semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a first frequency band, a second semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a second frequency band, and a control device substrate that is arranged between the first and second semiconductor device substrates and that controls the first and second semiconductor device substrates.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Abstract: A mounting apparatus for mounting a circuit board to a bottom plate includes a positioning member, a mounting member and a maintaining member; the mounting member is mounted to the positioning member and adapted to removably mount the positioning member to the bottom plate; the maintaining member defines a top surface and a bottom surface, and a maintaining piece extends from the bottom plane; the positioning member defines a first maintaining plane and a second maintaining plane, and a distance between the first maintaining plane and the bottom plate is larger than that between the second maintaining plane and the bottom plate; the maintaining member is mounted to the positioning member in a first position, where the maintaining piece abuts the second maintaining plane, or a second position, where the maintaining piece abuts the first maintaining plane; the circuit board abuts the top surface of the maintaining member.

Abstract: A mounting apparatus for fixing a conversion card to a motherboard of a chassis includes a main body and an assistant member. The assistant member includes a top board, and a side board to which the conversion card is fixed. The assistant member includes a handle mounted to the top board and adjacent to the conversion card. The handle is operated to move the mounting apparatus together with the conversion card away from the motherboard.

Abstract: A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically connected between the metal board and the power layer. The power layer is made of a number of wires.

Abstract: An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “”-like profile in its center. The connector includes two sub-connectors, and an insulative portion having a “”-like or inverted “m”-like profile in the center.

Abstract: A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

Abstract: A motherboard assembly includes a motherboard and an expansion apparatus. The motherboard includes a first expansion slot. An edge connector is set on a bottom side of the expansion apparatus to be detachably engaged in the first expansion slot. A number of SATA interfaces and a number of second expansion slots are arranged on the expansion apparatus, and are connected to signal pins and power pins of the edge connector.

Abstract: A server rack system includes a rack and a network board card. The rack includes rack layer type spaces arranged along a vertical axis direction. The rack layer type spaces are used for receiving a network switch unit and a server unit slidably inserted along a horizontal axis direction. The network board card is disposed along the vertical axis direction and between the top and the bottom of the rack. The network board card includes network interfaces. The network interfaces are arranged along the vertical axis direction on the network board card. The network interfaces include a first type network interface used for being connected to the network switch unit and a second type network interface used for being connected to the server unit. The first type network interface is connected to the second type network interface by an integrated circuit deployed in the network board card.

Abstract: A wired pipe coupler that carries at least a data signal includes a carrier having a plurality of electrical components disposed therein and one or more antennas supported by and spaced from the carrier, the one or more antennas being electrically coupled to the carrier through respective ones of the plurality of electrical components.

Abstract: An electronic substrate includes a non-conductive body and one or more conductive features coupled to the non-conductive body. Each of the conductive features includes a base layer. To preserve the performance and conductivity of the one or more conductive features, each of the conductive features includes a protective layer formed over the base layer. The protective layer may include a first layer of silver formed over the base layer and a second layer of palladium formed over the first layer. By depositing the protective layer over the base layer of each of the conductive features, oxidation and exposure of the conductive features is prevented, or at least substantially reduced, since the first layer and the second layer provide a migration barrier for the metal in the base layer. However, the performance and conductivity of the conductive features are maintained due to the low resistivity of silver and palladium.

Abstract: A laminated structure includes a first substrate, an adhesive, a graphene, and a second substrate. The adhesive is provided on a principal surface of the first substrate, and the adhesive has a storage elastic modulus of 7.2*104 Pa or more and 6.1*105 Pa or less at 23° C. The graphene is bonded to the adhesive, and the graphene has one or a plurality of layers. The second substrate is bonded to the graphene.

Abstract: An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.

Abstract: A three dimensional (3D) package includes a helix substrate having a columnar part including a top surface, a bottom surface and a sidewall, and a plurality of steps arranged along the sidewall of the columnar part in the form of a helix. Semiconductor integrated circuits (dies) may be attached on supporting surfaces of the steps. The columnar part, the steps and the dies can be covered with a mold compound. I/Os are formed at either the sides of the steps and/or the top and/or bottom of the columnar part.

Abstract: A portable electronic device includes a housing and a chip card holder. The chip card holder includes a base fixed to the housing, a drawer slidably fixed to the base. The drawer includes at least two stacked receiving grooves, each receiving groove receives one of the chip cards.

Abstract: An electronic component and housing interlocking system is provided. The system includes a device housing configured to hold a printed circuit board. The printed circuit board includes a projection from a side of the printed circuit board. The system also includes a locking member having a tab coupled at a first end of the tab to a side wall of the device housing and free at a second end of the tab such that the tab is configured to flex about the first end when the printed circuit board is slid into the device housing and the projection is pushed against the second end of the tab. The tab includes an opening configured to receive the projection after being slid past the second end such that the tab engages the printed circuit board within the device housing in a locked position.

Abstract: A method of manufacturing a cover structure is provided. A first insulating layer is provided. The first insulating layer has a first surface and a second surface opposite to each other. A second insulating layer is provided. The second insulating layer has a third surface and a fourth surface opposite to each other and an opening passing through the third surface and the fourth surface. A thickness of the second insulating layer is greater than a thickness of the first insulating layer. The first insulating layer and the second insulating layer are laminated to each other, so that the third surface of the second insulating layer connects to the second surface of the first insulating layer. A cavity is defined by the opening of the second insulating layer and the first insulating layer. A metal layer is formed on the cavity.

Abstract: A printed wiring board includes a board body that includes a signal line embedded at a predetermined wiring position and a through hole electrically connected to the signal line, and a connector that includes a connector plate including a connection terminal electrically connected to the signal line via the through hole, and electrically connects the connection terminal to the signal line by insertion of the connection terminal of the connector plate into the through hole in a direction of one of a front surface and a rear surface of the board body according to a wiring position of the signal line so that a transmission path of the connection terminal on a stub side is shorter than a transmission path of the connection terminal on an input and output side.

Abstract: A power metal mesh and a semiconductor memory device including the same are provided. As the power metal mesh configured to reduce noise coupling generated between adjacent chips disposed on an interposer, a band stop filter unit including an inductor and a capacitor coupled in parallel is disposed between the adjacent chips to effectively reduce the noise coupling of a specific frequency band generated between the adjacent chips.

Abstract: An electronic device includes a circuit board and a card bracket. The card bracket includes a base panel and a pair of latching pieces extending from opposite sides of the base panel. Each of the pair of latching pieces includes a resilient arm extending perpendicularly from the base panel and a latching flange extending from the resilient arm at an angle that is slightly less than 90 degrees. The latching piece includes a curling edge. A circuit board includes a pair of mounting holes corresponding to the pair of latching flanges. The resilient arm is deformable and movable between a first position and a second position. In the first position, the latching flange is removable from a corresponding one pair of mounting holes. In the second position, the curling edge abuts against the circuit board for preventing the card bracket from detaching from the circuit board.

Abstract: In an aspect, a substrate for a display device that includes a plastic substrate and a planarization layer is provided.

Abstract: A PCB and an LCD device with the same are disclosed. The PCB and the LCD device force an LED to directly contact either a heat radiation member or a metal plate. As such, heat generated in the LED is directly transferred to the heat radiation member or the metal plate without passing through wiring and prepreg layers. Therefore, the heat is effectively discharged to the exterior through a bottom cover. In other words, heat generated in the LED can be effectively discharged because of passing through the shortened heat radiation path.

Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.

Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.

Abstract: Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.

Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.

Abstract: A differential transmission circuit includes a pair of transmission line conductors and a ground conductor layer, wherein the pair of transmission line conductors include a first straight line region where both the pair of transmission line conductors extend in parallel to each other in a first direction with a first width in a first layer, a first cross region where one of the pair of transmission line conductors is formed in the first layer, the other thereof is formed in a second layer, and the pair of transmission line conductors cross the each other in a three-dimensional manner, the first cross region being disposed on the front side of the first straight line region, and wherein each of the widths of the pair of transmission line conductors in the first cross region is smaller than the first width.

Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Abstract: An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures by incorporating surface mountable chip chokes in the underlying circuit design, These conditions that result in undesirable CAF include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: According to one embodiment, an electronic apparatus includes a housing including a transparent portion, a printed circuit board contained in the housing, a light source provided on the printed circuit board, a first member, a second member, and a reinforcing plate. The first member includes a first opening portion configured to allow light emitted from the light source to the transparent portion to pass therethrough, and a duct-shaped first main body defining the periphery of the first opening portion. The second member includes a second opening portion configured to allow light emitted from the light source to the transparent portion to pass therethrough, and a duct-shaped second main body defining the periphery of the second opening portion, and brought into contact with the first member so that the first opening portion communicates with the second opening portion.

Abstract: A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer.

Abstract: A printed-circuit board to be fixed to a battery of accumulators includes a substrate comprising conductive tracks, a circuit for measuring voltage connected to the conductive tracks, and an electric interconnection element formed by a single piece, which is conductive and flexible, the interconnection element having a thickness of 0.3 mm to 1.5 mm. The interconnection element comprises a single portion fixed to the substrate by several force-fittings and electrically connected to one of the conductive tracks, and at least two portions overhanging the fixed portion and mobile relative to the substrate. The overhanging portions are formed at ends of a conductive strip disposed to be overhang the fixed portion. The conductive strip connects to the fixed portion by a junction that is narrower than the conductive strip.

Abstract: An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

Abstract: A circuit board includes control circuit patterns and first drive circuit patterns. A base maintains the circuit board in a state in which the base is opposed to a portion of the circuit board, in which the control circuit patterns are formed, across a space that allows control circuit elements to be mounted at the circuit board. A line module includes second drive circuit patterns electrically connected to the first drive circuit patterns so as to constitute a part of lines of a drive circuit, and is sandwiched between a portion of the circuit board, in which the first drive circuit patterns are formed, and the base.

Abstract: In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.