Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Abstract: A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines.

Abstract: A board attachment structure includes a frame, a plurality of board holders and a plurality of engagement mechanisms. The board holders are detachably coupled to the frame. The board holders are configured to hold a circuit board between a pair of adjacent board holders of the board holders. The adjacent board holders have mutually facing surfaces with grooves, respectively. The grooves of the adjacent board holders are configured to support opposite edge portions of the circuit board, respectively, when the board holders hold the circuit board. The engagement mechanisms detachably couple the board holders to the frame, respectively. The engagement mechanisms have engagement holes that are provided to the frame and hooks that are disposed on the board holders. The hooks of the board holders are detachably engaged with the engagement holes of the frame, respectively.

Abstract: In a housing case for housing an electronic circuit board, comprising a case body, a cover, a pedestal formed on the case body to support the board, a holder formed on the cover at a location to face the pedestal to hold the board from opposite side of the pedestal, a recess formed at the case body near the pedestal, and a convex formed on the cover at a position corresponding to the recess, it is configured such that the convex is inserted in and adhered to the recess to attach the cover to the case body. With this, it becomes possible to change the amount of adhesive member in accordance with the environment, etc., with the simple structure.

Abstract: A fully reflective and highly thermoconductive electronic module includes a metal bottom layer, a transparent ceramic layer and a patterned metal wiring layer. The metal bottom layer has a lower reflective surface. The transparent ceramic layer has an upper surface and a lower surface. The lower surface of the transparent ceramic layer is bonded to the lower reflective surface of the metal bottom layer. The metal wiring layer is bonded to the upper surface of the transparent ceramic layer. The lower reflective surface reflects a first light ray, transmitting through the transparent ceramic layer, to the upper surface of the transparent ceramic layer. A method of manufacturing the fully reflective and highly thermoconductive electronic module is also disclosed.

Abstract: According to an exemplary embodiment, a bondwireless power module residing on a top surface of a substrate includes at least one input power pad providing power to the module and at least one output current pad providing output current from the module. At least one press-fit input power clamp engages a top side of the at least one input power pad, and engages a bottom surface of the substrate. Also, at least one press-fit output current clamp engages a top side of the at least one output current pad, and engages the bottom surface of the substrate. The at least one press-fit input power clamp can include at least one top prong and at least one bottom prong. Furthermore, the at least one bottom prong can press the input power pad into the at least one top prong.

Abstract: Circuit modules and methods of construction thereof that contain composite meta-material dielectric bodies that have high effective values of real permittivity but which minimize reflective losses, through the use of host dielectric (organic or ceramic), materials having relative permittivities substantially less than ceramic dielectric inclusions embedded therein. The composite meta-material bodies permit reductions in physical lengths of electrically conducting elements such as antenna element(s) without adversely impacting radiation efficiency. The meta-material structure may additionally provide frequency band filtering functions that would normally be provided by other components typically found in an RF front-end.

Abstract: An apparatus is provided. The apparatus generally comprises a plurality of pairs of differential transmission lines. The plurality of pairs of differential transmission lines includes a set of pairs of differential transmission lines with each pair of differential transmission lines from the set of pairs of differential transmission lines including at least one twist to alternate current direction. Also, the plurality of differential transmission lines are arranged such that alternating current directions substantially eliminate cross-talk across the plurality of pairs of differential transmission lines.

Abstract: There is provided an apparatus for accommodating at least two different sized cards, the apparatus comprising a card housing comprising one or more card slots, each card slot being adaptable for inserting the at least two different sized cards; and a card guide system for adapting said one or more card slots for insertion of at least one of the at least two different sized cards. There is also provided a modified mezzanine card having at least one increased non-standard physical dimension relative to a standard mezzanine card suitable for insertion in the apparatus using the card guide system.

Abstract: The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section.

Abstract: A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.

Abstract: A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is provided. The circuit substrate has a first surface and a first circuit layer. The first dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The first dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit layer and an intaglio pattern. The antagonistic activation layer is disposed on the second surface of the dielectric layer. The first conductive layer is disposed in the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer via the first conductive layer.

Abstract: A mounting apparatus for mounting an expansion card includes a bracket, and a mounting member mounted to the bracket. The mounting member includes a base mounted to the bracket, and a clamping member extending from a first side of a top of the base to clamp a rear end of the expansion card.

Abstract: Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.

Abstract: Embodiments of methods of non-destructively testing whether a laminated substrate satisfies structural requirements are disclosed herein. Additionally, laminated substrates that can be non-destructively tested are also disclosed along with methods of manufacturing the same. To non-destructively test whether the laminated substrates satisfies the structural requirement, an electrical characteristic of the laminated substrate may be detected. Since the detected electrical characteristic is related to a structural characteristic being tested, whether the structural characteristic complies with the structural requirement can be determined based on the electrical characteristic.

Abstract: A connector for electrical and mechanical interconnection of first and second mechanically adjacent modules with one another. The first module includes a first electrical connector and an alignment pin and the second module includes a printed circuit board floatingly and displacably mounted on the second module with at least one alignment hole aligned for alignment with the alignment pin of the first module and a second electrical connector aligned for engagement with a corresponding first electrical connector of the first module. During assembly, the alignment pin of the first module engages the alignment hole of the second module and displaces the printed circuit board to align the second electrical connector with the first electrical connector.

Abstract: Protective containers for electronic equipment, and methods of testing and manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.

Abstract: Disclosed herein is a display device including: a display substrate having wires on a particular one of the surfaces of the display substrate, and having penetration holes each provided at a position exposed to the wire and penetrating the display substrate from the particular surface to the other display-substrate surface; and a wiring substrate provided on the side of the other surface of the display substrate and electrically connected to the wires through the penetration holes.

Abstract: A circuit layout of an image capturing device comprises a circuit board, an image capturing circuit, a flashlight circuit and a groove. The circuit board is a multilayered structure. The image capturing circuit is built on the circuit board. The flashlight circuit is built on the circuit board. The groove is formed on the multilayered structure of the circuit board and divides the circuit board into two areas where the image capturing circuit and the flashlight circuit are respectively disposed. The image capturing circuit is located at a first area, and the flash circuit is located at a second area. Therefore, the groove can prevent the interference between the image capturing circuit and the flashlight circuit.

Abstract: A fixing apparatus includes a circuit board and a support member. A connector is installed on the circuit board. The support member includes a first connection portion to be electrically connected to an electronic device, and a second connection portion formed below the first connection portion and electrically connected to the first connection portion. The second connection portion is plugged into the connector of the circuit board, to elevate the electronic device.

Abstract: According to an aspect of an embodiment, a flexible circuit board for connecting a first device and a second device, the flexible circuit board comprises: a base material comprising a flexible material having a first end adapted to connect with the first apparatus, a second end adapted to connect with the second apparatus and a hollow arranged between the first end and the second end; a signal line arranged on a surface of the base material, the signal line capable of electrically connecting the first apparatus and the second apparatus, the signal line having a constant characteristic impedance along the signal line in association with the base material; and a line arranged on the base material and over the hollow, the line capable of electrically connecting the first apparatus and the second apparatus.

Abstract: A key button mechanism and a portable electronic device using same are provided. The key button mechanism includes a key button and an elastic element integrally formed with the key button. The elastic element includes a main body and two elastic arms extending out, backward from the main body and located at two opposite ends of the main body respectively. The main body includes two resisting blocks protruding from one surface thereof away from the key button side and are located adjacent to the two opposite ends of the main body.

Abstract: Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board (2) is provided with a base (5) and a through hole conductor (11). The base is provided with a fiber layer (9) and a through hole (S). The fiber layer has a single fiber (8) arranged along one direction and a resin for covering the single fiber (8). The through hole (S) penetrates the fiber layer (9), and the through hole conductor is formed in the through hole. The single fiber (8) partially protrudes to the side of the through hole conductor (11) from an inner wall surface of the through hole (S), and the protruded part is covered with the through hole conductor (11).

Abstract: An electronic device includes a supporting member, a circuit board fixed to the supporting member, a bottom cover assembled with the supporting member, and at least one conductive resilient sheet fixed on the circuit board. The conductive resilient sheet includes a fixing portion fixed on the circuit board and a conductive portion. The conductive portion defines a first elastic sheet and a second elastic sheet. The bottom cover is fixed between the first elastic sheet resisting the outer side of the bottom cover and the second elastic sheet resisting the inner side of the bottom cover.

Abstract: An assembly includes an expansion card, an enclosure, a mounting bracket, and a sliding member. The expansion card includes a first terminal and a second terminal. The mounting bracket secures the first terminal of the expansion card. The securing bracket is mounted on the enclosure. The securing bracket includes a main body. The second terminal of the expansion card is placed on the main body. A positioning piece is located on the main body. The positioning piece comprising a free end on which a first protrusion is located. The sliding member is slidably mounted on the main body. The sliding member includes a pressing piece. A second protrusion is located on the pressing piece. The sliding member is adapted to slide on the main body between a first position and a second position. At the first position, the pressing piece presses the second terminal on the main body, and the first protrusion blocks the second protrusion to prevent the sliding member sliding from the first position.

Abstract: Disclosed herein is a radio frequency (RF) communication module. The RF communication module includes: a main substrate having a plurality of electronic components mounted on an upper surface thereof and having at least one ground pad formed at corners thereof; an insulating material encapsulating the electronic components mounted on the upper surface of the main substrate and having a metal layer formed on an upper surface thereof; and a side shielding layer formed on a side of the insulating material.

Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.

Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position.

Abstract: A modem, in particular for subsea power line communication, has electronic components on a circuit board, and a metal encapsulation, wherein the encapsulation forms at least two chambers separated by at least one wall, wherein each of the chambers surrounds at least one of the electronic components.

Abstract: Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is opened with a window. The heat substrate includes a base. The multi-layer circuit board is attached to the base. The heat substrate further includes a projecting part extending from the base into the window of the multi-layer circuit board. The circuit module is received in the window and placed on the projecting part. The circuit module is electrically connected with an outer conductor layer of the multi-layer circuit board.

Abstract: A lighting module and a power connecting set are provided. The lighting module includes two circuit boards, two light emitting elements and a power connecting set. The light emitting elements are disposed on the circuit boards respectively. The power connecting set includes two connecting bases and a flexible circuit board. The connecting bases are disposed on the circuit boards and electronically connected to the circuit boards respectively. Two ends of the flexible circuit board are connected to the connecting bases for electrically connecting a power path of the circuit boards.

Abstract: A power supply includes an integrated cable manager board. The integrated cable manager board is configured to integrate elements of the power supply on the integrated cable manager board. The integrated cable manager board includes a circuit monitoring device and a plurality of connectors. The circuit monitoring device is disposed on the integrated cable manager board and monitors the circuit status of the power supply. The connectors are disposed on the integrated cable manager board and each of the connectors is operable to provide power.

Abstract: A portable electronic device includes a main body, a circuit board in the main body, a rear cover, at least one first conductive member exposed through the rear cover and electrically connected to the circuit board, and a support assembly. The support assembly includes a hollow support detachably connected to the rear cover, at least one second conductive member connected to the hollow support and staying in contact with the at least one second conductive member, and at least one cable extending through the hollow support and comprising a first end electrically connected to the at least one second conductive member, and a second end extending out of the hollow support for connecting with a peripheral.

Abstract: A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.

Abstract: This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.

Abstract: A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.

Abstract: Disclosed is a device substrate wherein an insulating layer (60) having a terminal (24) formed on the surface thereof is formed over the entire surface of a glass substrate (20), excluding a display section, and therefore, the border (outer periphery) of the insulating layer (60) does not approach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). This prevents the insulating layer (60) from being peeled off from the border thereof by the NCF (81), and thereby prevents the terminal (24) from breaking. Furthermore, the terminal (24) and a bump electrode (40a) are permanently pressure-bonded to each other by the elasticity of the insulating layer (60), and a stable electrical connection therebetween can be ensured.

Abstract: A system and method of making an apparatus for managing heat distribution in an oscillator system is disclosed. In an example embodiment, the apparatus includes a resonator configured to provide a periodic signal, a circuit coupled to the resonator configured to compensate for changes in the periodic signal due to variation in temperature, and further includes a heat source configured to generate heat that heats the resonator and the circuit. At least one of the resonator, circuit, and heat source is embedded in a substrate, and the resonator, circuit, and heat source are arranged to heat the resonator and circuit substantially the same amount.

Abstract: A mounting apparatus for mounting a data storage device includes a bracket and a locking member. The bracket includes a first clamping arm and a second clamping arm pivotable relative to the first clamping arm. A number of mounting pins extend from each of the first and second clamping arms. The second clamping arm includes a first hook. The locking member is pivotably mounted to the first clamping arm and includes a second hook. When the second clamping arm is pivoted towards the first clamping arm, the first hook of the second clamping arm drives the locking member to rotate, until the second hook engages with the first hook and the mounting pins engage in opposite sidewalls of the data storage device.

Abstract: In a case where the first component and the third component are mountable on the first circuit board pattern of the first individual board and the second component is mountable on the second circuit board pattern of the first individual board, or in a case where the first component is mountable on the first circuit board pattern of the second individual board, and the second component and the third component are mountable on the second circuit board pattern of the second individual board, in the first and second individual boards, traces for the third component are provided so that electrical connections between the third component and the other components are identical between the case where the third component is mounted on the first circuit board pattern, and the case where the third component is mounted on the second circuit board pattern.

Abstract: A communication module includes a filter element, a package substrate on which the filter element is mounted, and a module substrate on which the package substrate is mounted. Each of the package substrate and the module substrate is formed of a laminate of a plurality of metal layers and a plurality of insulation layers. An outermost insulation layer forming a mounting surface of the package substrate that is a surface on which the filter element is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the package substrate. An outer insulation layer forming a mounting surface of the module substrate that is a surface on which the package substrate is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the module substrate.

Abstract: A method for manufacturing an electronic component includes a step of preparing a plurality of electrical elements, a step of preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively, a step of forming a resin on the base, a step of pressing the plurality of electrical elements against the resin to join portions of side surfaces of the plurality of electrical elements to the resin, a step of grinding the plurality of electrical elements to thin the plurality of electrical elements, and a step of dividing the base to form the plurality of board into individual pieces.

Abstract: A printed wiring board has a metal layer, a resin structure having a first resin layer portion formed on a first surface of the metal layer, a second resin layer portion formed on a second surface of the metal layer, and a filler resin portion filling an opening portion of the metal layer, a first circuit formed on the first resin portion, a second circuit formed on the second resin portion, and a through-hole conductor formed through the first resin, filler resin and second resin portions and connecting the first and second circuits. The through-hole conductor has a first portion narrowing from the first circuit toward the second resin portion and a second portion narrowing from the second circuit toward the first resin portion, and the first portion is connected to the second portion at a connected position shifted from the middle point of the thickness of the metal layer.

Abstract: A solenoid for use with a fuel injector, the solenoid comprising a housing able to be attached to an injector; a core able to be located within the housing; a coil able to be located within the core; and an electrical cable electrically connected to the coil wherein at least the coil and the electrical cable connection to the coil is encapsulated by encapsulant.

Abstract: Multilayered composite system comprising (A) a sheetlike substrate, (B) optionally a bonding layer, which may be formed uniformly or partially, (C) a foam layer, (D) optionally a bonding layer of the same material as said bonding layer (B) or of a material other than said bonding layer (B), (E) a polymer layer which includes capillaries extending through the entire thickness of said polymer layer (E), wherein said polymer layer (E) includes a pattern with a fishscale or sharkskin appearance.

Abstract: The invention relates in particular to a passenger service unit 1 for aircraft cabins. The passenger service unit 1 comprises a plurality of service functions implemented on the basis of functional electronic units. The functional electronic units are accommodated without cabling on a common circuit board 3.

Abstract: A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.

Abstract: A mounting apparatus is provided to mount a data storage device includes a bracket and a number of fastening members. The bracket includes two opposite clamping arms to sandwich the data storage device. The fastening members extend through the clamping arms to be locked to the data storage device. Two resilient portions are respectively formed on a top and a bottom of each clamping arm.

Abstract: In at least one embodiment of the disclosure, a display device includes a first substrate and a second substrate. A layer is located between the first substrate and the second substrate. The layer includes a first region and a second region. The first region comprises an electrophoretic display layer having electrophoretic particles. The second region is located between the first region and an edge of the first substrate and includes a contact portion. The distance between the first substrate and the second substrate corresponding to the second region is smaller than the distance between the first substrate and the second substrate corresponding to the first region.

Abstract: A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern (3) including mounting pads (8, 10), on which an electronic device (5) is mounted, a second wiring pattern (21) having lower impedance than the first wiring pattern (3), ICT wirings (13, 15) extending from the mounting pads (8, 10) of the first wiring pattern (3), and ICT pads (17, 19) formed at distal ends of the ICT wirings (13, 15). The ICT wirings (13, 15) extend towards the second wiring pattern (21) so that the ICT pads (13, 15) are in the vicinity of the second wiring pattern (21), and discharge gaps (G) are formed between the ICT pads (13, 15) and the second wiring pattern (21).