Abstract: A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal.

Abstract: A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.

Abstract: Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

Abstract: An display device package including a first substrate, an display device, a second substrate, a welding glue, and a first adhesive layer is provided. The display device is disposed on the first substrate. The second substrate is disposed above the first substrate and the display device. The welding glue is welded with the first substrate and the second substrate and surrounds the display device, wherein the welding glue has a continuous pattern. The first adhesive layer is adhered to the first substrate and the second substrate, wherein the first adhesive layer is disposed between the display device and the welding glue and surrounds the display device, and the material of the first adhesive layer and the material of the welding glue are different.

Abstract: There is herein described a method and apparatus for photoimaging. In particular, there is described a method and apparatus for photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits.

Abstract: A wiring substrate of the present invention has, on a first dummy wiring disposing section (105a) in a first lead-out wiring section (105), a dummy wiring line (2) that is formed of a light-shielding metal in positions that correspond to a front and a rear of a bent portion (10) of a wiring line (1) by having an insulating layer therebetween. As a result, sufficient countermeasures against disconnection of the wiring line (1) are taken in the first lead-out wiring section, and a sufficient aperture ratio for seal curing with UV radiation can be ensured.

Abstract: This disclosure provides systems, methods and apparatus for interposers in compact three-dimensional (3-D) device packages. In one aspect, one or more methods of fabricating an interposer using an additive process are provided. The additive process can involve depositing flowable dielectric material around a plurality of metal interconnect posts after forming the plurality of metal interconnect posts on a carrier substrate. In another aspect, an interposer including through-glass vias and one or more passive devices is provided.

Abstract: An electronic device includes a conductor plate, a circuit board placed with a distance to a surface of the conductor plate, a connector provided on the circuit board, a flexible cable having one end connected to the connector and laid down along the surface of the conductor plate, and a cable holding member which includes a sloped holding surface for holding at least part of a portion of the flexible cable ranging from the connector to the surface of the conductor plate and which is electrically connected to the conductor plate.

Abstract: An electronic control unit-mounting electric junction box having a versatile structure configured to accommodate both external and built-in electronic control units. The junction box includes an external upper case that forms the mounting space of an electronic control unit by means of a recessed containing section opening to the outer surface of a case, and a built-in upper case that internally forms the mounting space of an electronic control unit by raising outward the bottom wall of the recessed containing section in the external upper case are standardized in a basic section with the position of the bottom wall excluded, and a lower case and a conducting path that are combined with the external upper case and the built-in upper case are standardized.

Abstract: A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.

Abstract: A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading.

Abstract: The various embodiments of the present invention provide a novel chip-last embedded structure, wherein an IC is embedded within a one to two metal layer substrate. The various embodiments of the present invention are comparable to other two-dimensional and three-dimensional WLFO packages of the prior art as the embodiments have similar package thicknesses and X-Y form factors, short interconnect lengths, fine-pitch interconnects to chip I/Os, a reduced layer count for re-distribution of chip I/O pads to ball grid arrays (BGA) or land grid arrays (LGA), and improved thermal management options.

Abstract: An electronic card including a substrate and a display panel is provided. The substrate has a first surface, a second surface opposite to the first surface, a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, wherein the first surface and the second surface are surrounded by the first side, the second side, the third side and the fourth side. The display panel is disposed on the first surface and is roughly near the first side, the third side and the fourth side. Therefore, a disposition area of the display panel is wider.

Abstract: An electronic apparatus includes a case; a circuit board mounted in the case; and a connector. The connector includes at least two connection terminals electrically connected with the circuit board, and a base portion attached to the case. The base portion holds the at least two connection terminals. An electronic component is attached to the at least two connection terminals to electrically connect the at least two connection terminals with each other through the electronic component.

Abstract: A method of manufacture of a foldable electrical connector-housing system includes: providing a first end panel having an outer first end panel side with first end panel contacts that substantially span from one edge of the outer first end panel side to an opposite edge of the outer first end panel side; providing a second end panel having an outer second end panel side, the second end panel and the first end panel with the outer second end panel side facing away from the outer first end panel side and the first end panel contacts exposed in a folded configuration; mounting an electronic component between the outer first end panel side and the outer second end panel side; and connecting a conductor to the first end panel contacts and the electronic component.

Abstract: An insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.

Abstract: In a display unit, measures against dropping of screws can be realized at low cost. The display unit includes: a wiring substrate in which wiring that is led out from a display panel is provided; a screw that fixes the wiring substrate to the display unit; and a substrate cover that covers the wiring substrate. The substrate cover has a screw covering region that covers a head of the screw, and part of the periphery of the screw covering region is separated from the other area of the substrate cover.

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract: An apparatus is provided comprising an enclosure for enclosing a printed circuit board (PCB). The PCB has a tab extending therefrom. The enclosure comprises first and second portions, one of which includes a recess arranged to receive the tab of the PCB.

Abstract: A control unit, e.g., for a motor vehicle, includes a circuit board, a high-impedance circuit component situated on the circuit board and having an impedance of 1 k? or higher in relation to ground of the control unit, and at least one conductive protection element electrically connected to ground and situated adjacent to the high-impedance circuit component. The protection element has a height within a protective distance from the high-impedance circuit component that is at least equal to the protective distance. A method for designing a circuit board of a control unit, and a computer program product for executing the method, include the steps of specifying a position of the high-impedance circuit component, and specifying a position of the protection element such that the protection element has a height within a protective distance from the high-impedance circuit component that is at least equal to the protective distance.

Abstract: A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding piece and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements.

Abstract: A motherboard assembly includes a motherboard and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) module with a circuit board. The motherboard includes an expansion slot and a storage device interface. An edge connector is set on a bottom edge of the circuit board to be detachably engaged in the expansion slot, and a notch is set on a bottom edge of the circuit board to engage in a protrusion of the expansion slot. A SATA connector of the circuit board is connected to the storage device interface of the motherboard.

Abstract: A method of creating a resistive pathway for an electronic assembly is disclosed. In one embodiment, the pathway can be formed with a resistive film in conjunction with a conductive adhesive and a coverlay. In another embodiment, the resistive film, the conductive adhesive and the coverlay can be relatively transparent. In yet another embodiment, the resistive pathway can couple directly with traces on an electronic assembly saving space and easing assembly.

Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

Abstract: The present invention provides a display device comprising a display panel and a conductive pattern, in which the conductive pattern comprises an irregular pattern.

Abstract: The present invention relates to a surveillance device, which includes a device body, a display module mounted to at least one side surface of the device body, and at least one light-emitting diode mounted to at least one side of the device body. The display module can be a liquid crystal display (LCD) or an LED display screen. With the above arrangement, the operation of light-emitting diode helps identifying the location where the device body is mounted and also helps identifying if the device body is in normal operation and further, the arrangement of the display module provides practical advantages of criminal deterrence, advertisement effect, status notification, and information transmission.

Abstract: This invention is related to compositions that prepare substrate surfaces to enable temporary wafer bonding during microelectronics manufacturing, especially using a zonal bonding process. This invention, which comprises compositions made from fluorinated silanes blended in a polar solvent, can be used to form surface coatings or treatments having a high contact angle with water (>85°). The resulting silane solutions are stable at room temperature for longer than one month.

Abstract: The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity.

Abstract: A touch sensor may be formed from a flexible substrate such as a sheet of polymer. The flexible substrate may have a main rectangular portion and a protruding portion. Capacitive touch sensor electrodes may be formed on the upper and lower surfaces of the flexible substrate. Signal lines may be coupled to the touch sensor electrodes. The ends of the signal lines may extend onto the protruding portion. Signal lines may be formed on upper and lower surfaces of the flexible substrate. The signal lines may be coupled to circuitry on a printed circuit using a connector that receives the end of the protruding portion. Ground structures on the protruding portion may be configured to overlap the signal lines or may be laterally interposed between upper surface signal lines and lower surface signal lines.

Abstract: An interconnect structure includes an insulative web having a first surface and a second surface; a logic device secured to the second surface of the insulative web; a frame panel assembly including a frame base having a first surface and a second surface, a first frame insulative layer disposed between the frame base first surface and the insulative web second surface, an aperture extending through the frame base and first frame insulative layer, wherein at least a portion of the logic device is disposed within the aperture, and a first frame connector disposed between a first electrically conductive layer located on the frame base first surface, and a second electrically conductive layer located on a surface of the first frame insulative layer; a device connector disposed between an I/O contact on a surface of the logic device and a third electrical conductor located on a surface of the insulative web; and an insulative layer connector that is disposed between the third electrical conductor located on a sur

Abstract: A solid state drive includes a printed circuit board, at least one memory and a controller. The at least one memory stores data. The at least one memory is embedded in the substrate of the printed circuit board. The controller controls the at least one memory to perform a write operation or a read operation. The controller is also embedded in the substrate of the printed circuit board.

Abstract: A protection circuit board for a secondary battery is constructed with an electrically insulating substrate, a printed circuit board pattern formed on the electrically insulating substrate, a protection circuit part electrically connected to the printed circuit board pattern, a charge-and-discharge terminal formed on the electrically insulating substrate and electrically connected to the printed circuit board pattern and the protection circuit part, and a test terminal formed on the electrically insulating substrate and electrically connected to the printed circuit board pattern and the protection circuit part. The test terminal is constructed with an electroless plated layer formed on the test terminal.

Abstract: A low-profile personal computer (PC) motherboard has memory modules mounted to an edge of the motherboard rather than mounted perpendicular using standard memory module sockets. The PC motherboard has a lower profile since memory module sockets are removed from the top surface of the PC motherboard. Expansion card sockets are also removed by integrating expansion functions into chips on the PC motherboard, or using an edge-mounted connector to the expansion card or to an external peripheral. Motherboard metal contacts are formed on an extended plug region near the edge of the PC motherboard. A first opening or slot of an edge connector fits over the motherboard metal contacts, while a second opening or slot of the edge connector fits over metal contacts on a standard memory module. The memory module and the PC motherboard each have printed-circuit boards (PCBs) that are in the same plane, thus reducing the overall height.

Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.

Abstract: Provided is a highly reliable ceramic circuit board which can be manufactured at a low cost and is friendly to environment as a material from which lead is eliminated in forming the multilayered structure.

Abstract: A function expansion device is electrically connected to an electronic apparatus by being inserted in a socket included in the electronic apparatus and expands a function of the electronic apparatus. The function expansion device includes a substrate on which a component is mounted, a first connecting terminal that is formed at an end portion of the substrate and is electrically connected to a first signal line that connects the electronic apparatus and the component in a one-to-one fashion, a second connecting terminal that is formed at the end portion of the substrate and is electrically connected to a second signal line that connects the electronic apparatus and the component redundantly, and a protection member that is formed to cover only the second connecting terminal.

Abstract: One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract: A portable electronic device may have an inverted dome switch assembly. The switch assembly may have an inverted dome that has a base and a conductive underside. The base may be attached to a button member. Two electrical contacts in the button member may face the conductive underside. Corresponding conductive traces may be connected to the contacts. The dome may bear against a housing member. The button member may be movable with respect to the housing member from an unactuated position to an actuated position. The dome switch may form a footprint based upon the dome base area. The housing member may extend into a portion of the footprint and not into the remaining portion of the footprint allowing that space to be otherwise utilized.

Abstract: A sheet metal cover for a printed circuit board (PCB) includes a plurality of legs continuous with a substantially planar elevated section. The legs are attached to the PCB, and electrical connections are provided between the legs and an internal ground plane of the PCB at the attachment locations. The sheet metal cover is thereby grounded, inhibiting the transmission of electromagnetic signals through the sheet metal cover. The elevated section of the sheet metal cover prevents select electronic devices on the PCB from being viewed or probed. Openings through the sheet metal cover allow heat sinks or heat generating electronic devices (e.g., inductors) to be exposed through these openings, thereby facilitating cooling of these elements by airflow. An electrically conductive gasket attached to the underside of the elevated section may contact the heat sinks, further minimizing the radiation of EMI emissions.

Abstract: A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.

Abstract: A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material.

Abstract: A printed circuit includes a number of conductive wires. Each of the conductive wires includes a first conductive wire section, a second conductive wire section, and a first connection section. The first connection section includes a first end and a second end opposite to the first end, the first end of the first connection section is connected to the first conductive wire section, and the second end of the first connection section is connected to the second conductive wire section. An angle between the first conductive wire section and the first connection section can be in a range from about 90 degrees to about 180 degrees.

Abstract: Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial wiring patterns each forming a current path from the power source to the LSIs are provided by forming gaps in the power supply wiring.

Abstract: A printed circuit includes a number of conductive wires. The conductive wires include at least one first conductive wire section, at least one second conductive wire section, and at least one first connection section. An angle between the at least one first conductive wire section and the at least one first connection section is defined as angle ?n, the angle ?n is in a range from about 90 degrees to about 180 degrees. An angle between the at least one second conductive wire section and the at least one first connection section is defined as angle ?n, the angle ?n is in a range from about 90 degrees to about 180 degrees. The angle ?n and ?n are not simultaneously be 180 degrees. ?n??n-1?0, ?n??n-1?0, wherein n is the number of the plurality of conductive wires.

Abstract: Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate.

Abstract: A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part.

Abstract: An electronic device includes a main frame structure, a plurality of functional modules fixed to the main frame structure, a plurality of cables connecting the functional modules, a cable collector board fixed to the main frame structure, and a motherboard detachably connected to the main frame structure. The cable collector board includes a plurality of first printed circuits electrically collecting the cables, and a first connector electrically collecting the first printed circuits. The motherboard includes a plurality of second printed circuits and a second connector collecting the second printed circuits. The second connector is detachably electrically connected to the first connector.

Abstract: One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements.

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.