Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract: Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract: A flexible printed circuit board is pulled out to the outside from an end portion of the bottom surface portion. A notch is formed on a tip end of the end portion of the bottom surface portion such that an inner edge of the notch and an outer edge which projects from the notch are contiguously formed. A side of the flexible printed circuit board is arranged so as to overlap the notch. The outer edge of the bottom surface portion which projects overlaps the flexible printed circuit board. An angle made by a straight line which connects an intersecting point between the side of the flexible printed circuit board and the inner edge and a point of inflection between the inner edge and the outer edge and the side of the flexible printed circuit board is set to 45° or less.

Abstract: An isolator includes a core isolator mounted on a circuit board and including a ferrite and permanent magnets to apply a direct-current magnetic field to the ferrite, and includes no yoke for controlling the leakage of the direct-current magnetic field out of the isolator. Power amplifiers are arranged in a straight line along with the core isolator interposed therebetween. A metal case covers the core isolator and the power amplifiers. The heights of the power amplifiers are greater than that of the core isolator.

Abstract: An electrical communication system includes a printed circuit board (PCB) having first and second ground plates and a plurality of signal vias and a plurality of ground vias extending between and through the first and second ground plates. Each of the plurality of signal vias are electrically connected to a respective conductive trace on a surface of the PCB. Cables connect to the PCB at a right angle, with a connector attached to an opposite side of the PCB. Each cable has two signal wires and a ground wire extending therefrom. The two signal wires define a differential pair. The signal wires are symmetrical with respect to the ground wire. Each of the signal wires electrically connects to a respective one of the plurality of signal vias. The ground wire connects to one of the plurality of ground vias. The cables are offset with respect to one another on the first and second ground plates and within the PCB.

Abstract: The power generating device has a power generating section including a piezoelectric body; and a plurality of electrode pairs each constituted by a pair of electrodes placed on opposite sides of the piezoelectric body with regard to a thickness direction thereof to define a functional section therebetween, each of the functional sections is cooperated with the related electrode pair to define a power generating element. A plurality of the power generating elements includes a first and second power generating elements that give a polarization orientation opposite to each other in the thickness direction. The first and second power generating elements have the corresponding electrodes that are connected to each other by means of a wiring member on the same surface of the piezoelectric body with regard to the thickness direction thereof, such that all of the plurality of the power generating elements are connected in series.

Abstract: In one embodiment, an apparatus includes a substrate, a touch sensor, and a passive electrical component. The touch sensor is disposed on the substrate. The passive electrical component is disposed on a surface of the substrate. The passive electrical component is formed at least in part of conductive material.

Abstract: There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 401 of the transformer facing the surface of the circuit board. There is provided a display device including such a power module.

Abstract: Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical connection pattern. The electrical connection pattern of each set is distinct from the electrical connection pattern on every other set. Each distinct electrical connection pattern represents a unique identifier of the corresponding IC thereby enabling the controller to distinguish between the ICs.

Abstract: A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.

Abstract: A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released.

Abstract: An exemplary electronic includes a casing and a circuit board. The casing includes a bottom plate and two side plates extending upward from two opposite sides of the bottom plate, respectively. Hooks are formed on the bottom plate. Two guiding members are located at the side plates, respectively. The circuit board defines engaging slots corresponding to the hooks of the bottom plate, respectively. During assembly of the circuit board to the casing, the circuit board is inserted into the casing and slides between the side plates with two opposite lateral sides thereof sliding along the guiding members, until the hooks of the bottom plate are received in the engaging slots of the circuit board and the circuit board is thereby secured in the casing.

Abstract: A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.

Abstract: The present application discloses a transformer conductive structure, which comprises a primary coiling, a printed circuit board and a secondary coiling unit comprising a plurality of conductive sheets; wherein each conductive sheet comprises an annular body and an output terminal arranged at the edge of the annular body and protruded to the outside; the annular bodies of the conductive sheets and the primary coiling are staggered arrangement together; and the output terminal of the conductive sheet directly clamps on the printed circuit board. The present application further discloses a transformer, which can effectively reduces the output path of the transformer, the AC and DC loss and the volume of the transformer device, so as to increase the power density and efficiency of power supply.

Abstract: A fan-out circuit electrically connected to a driver and a plurality of signal lines is provided. The fan-out circuit includes a first fan-out trace including a first and a second conductive line, and a second fan-out trace including a third and a fourth conductive line. The second conductive line is connected between the first conductive line and one of the signal lines. The length of the second and fourth conductive lines are L1? and L2? respectively. An obtuse included angle is formed between the first and second conductive lines. The width of the first and third conductive lines is W1. The fourth conductive line is electrically connected to the third conductive line and another one of the signal lines. The obtuse included angle is formed between the third and fourth conductive lines. The width of the second and fourth conductive lines is W2, and (W2/L1?)>(W2/L2?) and L1?<L2?.

Abstract: A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors.

Abstract: Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 ?m.

Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.

Abstract: A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.

Abstract: The present invention relates to an apparatus for supporting a function key of a mobile communication terminal. The apparatus includes a flexible printed circuit for electrically connecting a plurality of function keys to the mobile communication terminal, wherein the flexible printed circuit is conformable to a shape of a mounting space the plurality of function keys are mounted in, and a plurality of supporting members, wherein each supporting member corresponds to at least one of the plurality of function keys for supporting the at least one of the plurality of function keys within the mounting space, wherein the flexible printed circuit connects the plurality of supporting members to each other by attaching to a surface of the supporting members.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second edge connector is arranged on an end of the circuit board. The cable member includes a cable, a first storage device interface extending from a first end of the cable to be connected to a second storage device interface of the motherboard, and a third edge connector formed on a second end of the cable and soldered to the second edge connector.

Abstract: A display module is disclosed which includes a display panel, a printed circuit board, a flexible printed circuit board interconnecting the display panel and the printed circuit board, and a reinforcing piece interconnecting the display panel and the printed circuit board for supporting the printed circuit board. The reinforcing piece prevents drooping or shifting of the printed circuit board relative to the display panel during assembly or transport, thereby preventing severed wires of the flexible printed circuit board.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a module in the housing, and an electrical interconnection. The housing includes a first portion, a second portion including a step between the first portion and the second potion, and a slope between the first portion and the second portion. The electrical interconnection extends from the first portion to the second portion via the slope and is electrically connected to the module.

Abstract: The present invention provides a display device back panel with adjustable PCB mounting seat, which includes a hollow body and paired mounting seats. The mounting seats are arranged in a hollow portion of the body and have opposite ends extended to connect to the body. Each of the mounting seats includes a first bracket and a second bracket that are symmetrically arranged and a connection board connected between the first bracket and the second bracket. The first bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The second bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The first bracket has a first bent section that is bent downward, and the second bracket has a second bent section that is bent down. The pair of mounting seats forms a receiving space between the two first bent sections and the two second bent sections that receive a PCB supported and mounted thereon.

Abstract: The present invention discloses a backlight module, a backplane and an LCD device. The backlight module comprises a backplane, a PCB and locking pieces for fixing the PCB on the backplane; the backplane surface is provided with multiple through holes, and the locking pieces are selectively arranged in the through holes. In the present invention, because the backplane surface is provided with through holes for arranging hillocks, the hillocks are arranged in the through holes in random positions. Thus, the hillocks are arranged in the through holes in the corresponding positions in accordance with the PCB size, so that the backplane can be adapted for PCBs of different size, and its generality can be increased. In addition, hillocks and through holes of corresponding number can be arranged in accordance with the number of different components. Thus, the backplane has higher generality, and then the production cost and the processing cost of the backplane can be reduced.

Abstract: There is provided a method for producing a capacitor which is capable of producing a capacitor having a high withstand voltage and low leakage current, the method for producing a capacitor which is a method for producing a capacitor having a substrate serving as one electrode, a dielectric layer formed on top of the substrate, and the other electrode formed on top of the dielectric layer, the method including a step for forming an amorphous titanium oxide layer which is to become the dielectric layer on top of the substrate by anodizing the substrate, which is composed of titanium or titanium alloy, in an electrolyte solution containing hydrogen peroxide and having a temperature of 3° C. or less; and a step for forming the other electrode on top of the dielectric layer.

Abstract: The present invention discloses a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: forming a first circuit pattern on a metal layer formed on one surface of a base substrate; forming a second circuit pattern after laminating a first insulating layer in which the first circuit pattern is embedded; sequentially laminating a second insulating layer and a preliminary third circuit pattern on the second circuit pattern; separating the base substrate and forming a hole in the separated substrate; and forming a third circuit pattern, a landless first fill-plating layer, and a second fill-plating layer by performing fill-plating on the entire surface of the substrate in which the hole is formed, forming an insulating film layer on the other surface of the substrate, and performing an etching process on one surface and the other surface of the substrate.

Abstract: The present invention provides a back frame and a backlight system of a flat panel display device. The back frame includes at least two assembling pieces that are joined to form the back frame. The back frame further includes a bracing piece fixed to the assembling pieces and the bracing piece functions to fix a circuit board and an electromagnetic shielding piece. The bracing piece includes a bracing body, a first suspension section, a first bearing section, and a first resilient bent section. The bracing body is fixed to the assembling pieces. The first suspension section extends from the bracing body toward one side of the bracing body. The first bearing section is spaced from the bracing body and extends from the first suspension section toward one side of the first suspension section. The first resilient bent section is located between the first bearing section and the bracing body and is bent from the first suspension section toward one side of the first suspension section.

Abstract: A portable electronic device is provided. The portable electronic device includes a body, an operation interface, a supporting element and an image capturing unit. A receiving recess is formed on the body. The operation interface is disposed on the body. The supporting element is rotated between a first orientation and a second orientation relative to the body, wherein when the supporting element is in the first orientation, the supporting element is in the receiving recess, and when the supporting element is in a second orientation, a supporting included angle is formed between the supporting element and the body, wherein the supporting included angle is greater than 0 degree. The image capturing unit is disposed in the supporting element.

Abstract: The present invention discloses a backplane, a backlight module and an LCD device. A backplane, comprising a plurality of ribs which intersect vertically and horizontally to form a plurality of meshes. In the present invention, because ribs are adopted as basic members of the backplane and the comprehensively intersected ribs form the meshes, all components and parts of the backplane module required to be fixed to the backplane can be fixed to the meshes. The ribs are standard and universal; the meshes formed by the ribs are arranged on the whole backplane and can absolutely satisfy the fixation needs of the components and the parts of different positions and different installation dimensions; therefore, for backplanes of different dimensions, as long as the ribs of different lengths are selected, a standard and universal backplane, a backlight module and an LCD device can be formed.

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Abstract: Disclosed is a device and method for intelligently heating a component of a printed circuit board (PCB) to bring it within a specified operating temperature range quickly. A temperature sensor positioned in proximity to the component and is coupled with a logic circuit that receives a reading from the temperature sensor and compares it to a threshold temperature value. A heating element positioned in proximity to the component is coupled with a power source and a switch. The switch is triggered by the logic circuit to activate the heating element when the temperature sensor reading is cooler than the threshold temperature value thereby causing the component to warm up. The switch is triggered again by the logic circuit to de-activate the heating element when the temperature sensor reaches the threshold temperature value or a predetermined timeout period expires.

Abstract: A modular mass storage system and method that enables cableless mounting of ATA and/or similar high speed interface-based mass storage devices in a computer system. The system includes a printed circuit board, a system expansion slot interface on the printed circuit board and comprising power and data pins, a host bus controller on the printed circuit board and electrically connected to the system expansion slot interface, docking connectors connected with the host bus controller to receive power and exchange data therewith and adapted to electrically couple with industry-standard non-volatile memory devices without cabling therebetween, and features on the printed circuit board for securing the memory devices thereto once coupled to the docking connectors.

Abstract: An assembly includes an LED with two conductive leads, two conductive wires in which an insulator surrounds a conductor, and a housing. The two conductive wires are inserted into and held by a wire cavity of the housing. Each of the two conductive leads is inserted into a different LED lead hole of the housing. Electrical contact is made by each of the two conductive leads with the conductor of one of the two conductive wires and the LED is held by the housing. The conductive leads can have a sharp point that penetrates the insulator and the conductor when the LED is inserted into the housing. The LED can be seated in a LED cavity of the housing while insertion of the LED into the LED cavity creates an interference fit in which conductive portions of the wires opposite the exposed conductors are compressed against the housing.

Abstract: An extractable storage apparatus for electronic devices and electronic equipment therewith are disclosed. The electronic equipment includes an equipment frame, a signal processing apparatus, a plurality of electronic devices, and the extractable storage apparatus. The signal processing apparatus and the extractable storage apparatus are disposed on the equipment frame. The extractable storage apparatus includes a casing, a bracket, and a power connection mechanism. The bracket is disposed in an accommodating space of the casing in an extractable way and includes a plurality of storage slots to accommodate the electronic devices. The power connection mechanism is disposed in the casing and is electrically connected to the electronic devices to supply power to the electronic devices. When the bracket is extracted out the casing, the power connection mechanism keeps powering the electronic devices, which is convenient for a user to perform a hot-plug operation on one of the electronic devices.

Abstract: An output termination board for a safety system is disclosed herein. The termination board provides simplified wiring between the output modules and the remote devices operated by the controller in the system. Redundant output signals are generated within each pair of output modules and combined such that one control signal is sent to each remote device. In addition, a program executing on the controller of the safety system performs a test to determine if each output module is operating normally. If the program detects a fault in either output module, the safety system may alternately shut down according to a fail-safe procedure or continue operating under a fault-tolerant mode of operation.

Abstract: To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Abstract: A control system for achieving high-speed torque for a joint of a robot includes a printed circuit board assembly (PCBA) having a collocated joint processor and high-speed communication bus. The PCBA may also include a power inverter module (PIM) and local sensor conditioning electronics (SCE) for processing sensor data from one or more motor position sensors. Torque control of a motor of the joint is provided via the PCBA as a high-speed torque loop. Each joint processor may be embedded within or collocated with the robotic joint being controlled. Collocation of the joint processor, PIM, and high-speed bus may increase noise immunity of the control system, and the localized processing of sensor data from the joint motor at the joint level may minimize bus cabling to and from each control node. The joint processor may include a field programmable gate array (FPGA).

Abstract: An electronic circuit includes: a semiconductor chip provided with a single-ended I/F including a pad on which single-ended signals are exchanged; and a mounting unit on which a differential transmission path transmitting a differential signal is formed, and on which the semiconductor chip is mounted so that the pad of the single-ended I/F is directly electrically connected to a conductor configuring the differential transmission path.

Abstract: A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like portion formed of a plurality of connection walls crossed with one another is provided to an insulating plate interposed between two printed circuit boards, and the connection walls are positioned with clearances from the two printed circuit boards, respectively, by a plurality of supporting ribs protruding from the connection walls toward at least one of the two printed circuit boards.

Abstract: An apparatus including a user interface panel having a plurality of substrate layers and a plurality of electrically conductive lines on the substrate layers. The substrate layers form perimeter side edges of the user interface panel. The electrically conductive lines each have an end forming an electrical contact pad at the perimeter side edges. The electrical contact pads are arranged in rows at more than one of the perimeter side edges. Each electrical contact pad is configured to directly connect to a separate contact of a user interface panel receiving socket.

Abstract: The invention relates to a device comprising a first electric contact (8, 98) and a substrate (1, 91). The first electric contact (8, 98) comprises a first area (10, 110) with a first wettability, and the substrate (1, 91) comprises a second area (3) with a second wettability and a third area (2) with a third wettability and being adjacent to the second area (2). The first electric contact (8, 98) is attached on the substrate (1, 91) so that the first area (10, 110) of the first electric contact (8, 98) is adjacent to the second area (3), and the second area (3) is located between the first area (10, 110) and the third area (2). The first and the second wettability are higher than the third wettability. The invention also relates to a transponder (T1, T2, T3) which comprises the substrate (1, 91), an electric device (50, 80) and an antenna (7, 93).

Abstract: An expansion card has at least one connector electrically coupled with at least one expansion slot of a server, and includes a shell defining at least one through slot, a main body, and a transmission element received in the shell. The transmission element includes a locating element, a connecting pole, and a fixing shaft. The connecting pole includes a head portion and a tail portion. The head portion defines a notch sleeving on the locating element. The tail portion extends outwards from the shell and defines a first hole. The fixing shaft is fixed on the shell and extends through the first hole. When the tail portion is pushed, the connecting pole rotates around the fixing shaft, the head portion drives the at least one connector to extends outwards or inwards from the at least one through slot, to electrically connected or disconnected to the at least one expansion slot.

Abstract: The invention discloses a backplane, a back light module, and an LCD device. The backplane comprises a backplane surface and side walls arranged on the sides of the backplane surface. The backplane further comprises at least one layer of stacked plate fixed to the side walls in a stacked mode. Because the side walls of the backplane of the invention are provided with at least one layer of stacked plate fixed to the side walls in stacked mode, the thickness of each side wall of the backplane is increased and thus reinforces the strength of each side wall, and the total strength of the backplane is reinforced under the support of the side walls and the stacked plates thereof. Besides, that the strength of the side walls is reinforced avoides the arrangement of stiffeners on the backplane surface, which reduces the total thickness of the backplane.

Abstract: An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.

Abstract: A control circuit is molded with a package portion and connected with first terminals. A wiring portion includes second terminals connected with the first terminals and partially molded with a molded portion. The molded portion includes a first fitting portion surrounding the control circuit. A cover portion includes a second fitting portion fitted to the first fitting portion to cover the control circuit. The first and second fitting portions form a gap therebetween. The gap extends in a crank form along a first direction and extends in a crank form along a second direction, which is perpendicular to the first direction.

Abstract: An electronic device includes a front frame, a back cover, a support stand rotatably connected to the back cover, a display panel and a circuit board. The display panel and the circuit board are fixed between the front frame and the back cover. The circuit board includes a first contact and a number of second contacts. The second contacts surround the first contact. The support includes a central shaft and a third contact. The central shaft is electrically connected to the first contact. The third contact rotates with the rotation of the central shaft to contact each of the second contacts. The circuit board includes a circuit and a processor. The electric circuit generates different signals when the first contact is connected different second contacts. The processor adjusts an orientation of display content on the display panel to rotate based on the signal.

Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.