Abstract: According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.

Abstract: A power semiconductor module in which a substrate is provided with at least one power semiconductor and has first and second contact areas, wherein a first load connection element with first contact elements provided thereon is supported on the first contact areas and a second load connection element with second contact elements provided thereon is supported on the second contact areas. Wherein at least one spring element is provided for producing a pressure contact between the contact elements and the contact areas. To reduce the structural size of the module, the pressure contact between the contact elements and the contact areas is exerted by at least one electrical component arranged between the spring element and one of the load connection elements.

Abstract: In a laminated glass sheet with a fixing device introduced into a through-hole for objects, particularly for antennas, the through-hole is made up of holes of different sizes in two rigid sheets of the lamination, and the fixing device includes at least two parts introduced into the through-hole, pressing against surfaces around the edge of the through-hole, which surfaces are situated one facing the other. The two parts of the fixing device press from both sides against the surfaces around the edge surrounding the smaller hole made in the sheet, in that region of the walls of a smaller hole that exhibits an edge compression stress that is increased by heat treatment by comparison with the remainder of the surface of the sheet.

Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.

Abstract: A card structure includes a first substrate, a second substrate, an intermediate unit, and a connector. The first substrate includes a base surface. The second substrate is disposed on the base surface of the first substrate and coupled to the first substrate. The connector is disposed on the base surface of the first substrate to juxtapose the second substrate via the intermediate unit and coupled to the first substrate.

Abstract: A cable holder includes: a pair of arm portions to form a holding space for holding a cable; and a guide portion, provided at an end portion of each of the pair of guide portions to block the holding space, to guide the cable into the holding space while elastically deforming the pair of arm portions in directions in which the pair of arm portions move away from each other when contacting with the cable.

Abstract: An apparatus having a power converter circuit having a first active layer having a first set of active devices disposed on a face thereof, a first passive layer having first set of passive devices disposed on a face thereof, and interconnection to enable the active devices disposed on the face of the first active layer to be interconnected with the non-active devices disposed on the face of the first passive layer, wherein the face on which the first set of active devices on the first active layer is disposed faces the face on which the first set of passive devices on the first passive layer is disposed.

Abstract: An electronic device is provided, including a printed circuit board, a male connector and a female connector. The printed circuit board has at least one functional circuit. The male connector is coupled to the printed circuit board. The female connector is coupled to the printed circuit board and mated with the male connector, in which the electronic device is coupled to another electronic device in a daisy-chain configuration.

Abstract: A plurality of display panels (10A and 10B) are provided on a single substrate (2). Data signal lines (11A), scanning signal lines (12A), a data signal line drive circuit (20A) for driving the data signal lines (11A), and a scanning signal line drive circuit (30A) for driving the scanning signal lines (12A) are provided for the display panel (10A). Data signal lines (11B), scanning signal lines (12B), a data signal line drive circuit (20B) for driving the data signal lines (11B), and a scanning signal line drive circuit (30B) for driving the scanning signal lines (12B) are provided for the display panel (10B). Input signal lines (17A and 17B) are provided so as not intersect each other in a plan view. This allows a reduction in power consumption and an increase in flexibility in design in a display panel which includes a plurality of display panels on a single substrate.

Abstract: A motherboard includes a main circuit board, a CPU socket, and an interface. The main circuit board includes a holding surface and a side wall connected to the holding surface. The CPU socket is positioned on the holding surface. The interface is positioned on the side wall. The interface is electrically connected to the CPU socket. The interface provides a connection between the main circuit board and a sub-circuit board.

Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.

Abstract: A structure for fixing circuit board, adapted for fixing a circuitboard at the rear of a cage, is disclosed, which comprises: a circuitboard; and a clamp, configured with a clipping part, a fixing part and an elastic part; wherein, the clipping part is coupled to the fixing part while the fixing part is coupled to the elastic part; the clipping part has a first hook formed at a surface facing toward the fixing part; the elastic part has a second hook formed extruding out form a surface facing away from the fixing part; the clipping part and the fixing part are arranged straddling across the top edge of the circuitboard while enabling the first hook to couple to a fastener of the circuitboard; and the elastic part is arranged facing toward the cage while enabling the second hook to secure to the bottom of the cage.

Abstract: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.

Abstract: A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

Abstract: An integrated circuit board includes a substrate, a plurality of electronic components and at least one antenna. The substrate has a central area and two edge areas, wherein the central area is between the two edge areas. The electronic components are disposed on the central area. The antenna is disposed on at least one of the two edge areas, wherein there is predetermined distance between the antenna and the electronic components.

Abstract: A security protection device includes a cover circuit board, at least one inner wiring layer being included within the cover circuit board. The device also includes a base circuit board, at least one inner wiring layer being included within the base circuit board. The device further includes a security frame between the base circuit board and the cover circuit board, at least one electrically conductive wire being wound and included within the security frame to form at least one winding protection layer around sides of the security frame. The cover circuit board, the security frame, and the base circuit board form an enclosure enclosing a security zone, and the at least one inner wiring layer within the cover circuit board, the at least one inner wiring layer within the base circuit board, and the at least one electrically conductive wire within the security frame are connectable to a security mechanism configured to detect an intrusion into the security zone.

Abstract: An electronic device includes a housing, a capacitive touch button, a PCB and a connection mechanism. The capacitive touch button is secured in the housing and includes a number of button bodies. The PCB is secured in the housing. The connection mechanism includes a circuit board and a connection element. The circuit board is secured in the housing and includes a number of sensor electrodes and a number of electrical protrusions, which are all arranged corresponding to the number of button bodies of the capacitive touch button. The sensor electrodes are connected to the capacitive touch button and the electrical protrusions. The connection element includes a first end and a second end. The first end is fixed on the PCB. The second end resists against the electrical protrusions for electrically connecting the capacitive touch button and the controller of the PCB.

Abstract: A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.

Abstract: An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical edge connector, a sensor, and a heat sink. The sensor may be a pressure sensor. The controller may be connected to a throttle body such that the overmold sealing material provides a first seal between the controller and the throttle body allowing the pressure sensor to be in fluid communication with the interior of the throttle body. A wire harness may be connected to the controller such that the overmold sealing material provides a second seal between the wire harness and the controller protecting the electrical connection. The overmold sealing material may also be translucent.

Abstract: A removable electric controller for a garage door opener includes a base unit, a cover and a control box unit. A box lid of the control box unit is slidably connected to a connecting surface of the cover. A guide insertion end of a control circuit board of the control box unit is connected to a main connecting port module of a circuit terminal connecting plate on the base unit. The cover and the control box unit are detachable. A driving member, a light source member, an inductive circuit line and a power member of the base unit are connected to wiring port modules of the circuit terminal connecting plate, so that the wiring is in the way of modulization. The control circuit board of the control box unit can be replaced with ease, providing a convenient and simply assembly.

Abstract: A display device includes: circuit board 6 provided inside a display panel; flat cable 10 attached to connector 11 provided on the board 6; outlet section 10A which is provided in a position on the rotational axis side of the display panel at substantially the same height as that of the board 6, of which the corner of the open edge part is formed by a radius of curvature of a predetermined value or more, and which draws the cable 10 attached to the connector 11 to the outside of the panel; and a draw path section of flat part 4b and contact part 13, of which the corner coming into contact with the cable 10 attached to the connector 11 is formed by a radius of curvature of a predetermined value or more, and which leads the cable 10 to the section 10A without bending.

Abstract: A semiconductor structure including a high-voltage transistor; voltage dropping circuitry, at least part of which is overlapping the high-voltage transistor; at least one intermediate contact point to the voltage dropping circuitry, connected to at least one intermediate position between a first and a second end of the voltage dropping circuitry; and at least one external connection connecting the at least one intermediate contact point to outside of the semiconductor structure.

Abstract: A multi-phase voltage regulator is disclosed where each phase is comprised of an array of high and low side transistors that are integrated onto a single substrate. Further, a system of mounting the voltage regulator onto a flip chip and lead frame is disclosed wherein the source and drain lines form an interdigital pattern.

Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

Abstract: The invention relates to a circuit board sensor (1) for measuring physical variables, comprising a substrate board (2) and a second board (3) both made of glass, wherein at least the second board (3) is designed such that said board is elastically deformable, wherein the substrate board (2) and the second board (3) each comprise a first and a second side (2a, 2b, 3a, 3b), wherein the second side (2b) of the substrate board (2) and the first side (3a) of the second board (3) are disposed opposite each other, and wherein a spacer element (7) is disposed between the substrate board (2) and the second board (3) and holds the substrate board (2) and the second board (3) at a mutual distance, wherein the substrate board (2) and the second board (3) extend in particular parallel to each other, wherein the second side (2b) of the substrate board (2) comprises a first metal or polymer surface (5a) and the first side (3a) of the second board (3) comprises a second metal or polymer surface (5b), and wherein the first an

Abstract: A ceramic package includes a chip mounting portion, a photodiode (PD) mounting portion, a plurality of connecting terminals, and a gold-plated portion. The chip mounting portion is a portion on which a surface-emitting laser array chip is mounted on a first ceramic layer. The PD mounting portion is provided to a second ceramic layer stacked on the positive side in a c-axis direction of the first, ceramic layer. Openings are formed at four corners of the PD mounting portion. A scale is formed on a portion that can be observed through the opening of the second ceramic layer on the surface of the positive side in the c-axis direction of the first ceramic layer.

Abstract: The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

Abstract: A circuit panel of an electronic device is disclosed. The circuit panel includes a substantially flat surface including an active area of the electronic device; a bent border area contiguous with and extending from the active area of the substantially flat surface; and a plurality of traces coupled to the active area and routed in the bent border area.

Abstract: A handheld device includes a body, a back cover and a latch mechanism. The body has a back portion. The back cover coves the back portion. The latch mechanism is disposed between the body and the back portion to lock the back portion to the body. Reliving the lock connection between the body and the back cover performed by the latch mechanism causes the back cover is able to depart from the body.

Abstract: A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a and 21b) each having wiring on its both sides, and a relaxing connection layer (15) for interconnecting the printed wiring boards (21a and 21b). The relaxing connection layer (15) contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board (11) is prevented from warpage by making the relaxing connection layer (15) disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.

Abstract: A substrate with a built-in component is constructed such that a resin reliably goes around a clearance provided in a lower portion of the component and is thus filled in without expansion of a clearance in a height direction when various components such as an LW reversal type chip component are to be built in. The substrate includes a component to be embedded in a resin layer, and a land electrode (a component mounting electrode) to which external electrodes of the component are to be bonded, the land electrode being provided with a concave groove extending in a transverse direction through which an uncured resin of the resin layer flows, and the uncured resin of the resin layer flows through the concave groove and sufficiently goes around a lower side of the component so that the resin is well filled in when the component in a mounting state is to be embedded in the resin layer.

Abstract: An apparatus for fixing an expansion card includes a circuit board, a fixing device, and a latching device. The expansion card includes a protrusion formed on a first end of the expansion card, and a positioning hole defined adjacent to a second end of the expansion card away from the first end. The fixing device is mounted to the circuit board for supporting the first end of the expansion card, and defines a through hole for allowing the protrusion of the expansion card to extend through the through hole. The latching device is mounted to the circuit board for supporting the second end of the expansion card, and includes a post for engaging in the positioning hole of the expansion card, and a resilient hook for engaging with a top of the expansion card.

Abstract: An exemplary power conversion circuit is to convert a voltage from one voltage level to another. The circuit includes an input port, an output port, a main body circuit, a first solder bridge, and a second solder bridge. The input port of the power conversion circuit is an output port of one power conversion circuit previous in sequence to the power conversion circuit, the output port of the power conversion circuit is an input port of one power conversion circuit next in sequence to the power conversion circuit. The first solder bridge is arranged between the input port of the power conversion circuit and the main body circuit of the power conversion circuit. The second solder bridge is arranged between the output port of the power conversion circuit and the main body circuit of the power conversion circuit.

Abstract: A USB plug includes: a USB terminal; a PCB connected to one end of the USB terminal; a cable connected to the PCB; a hinge coupling member including first and second through-holes allowing the cable to pass through; and a connection terminal disposed at the end of the cable extending through the first and second through-holes of the hinge coupling member. The USB plug provides an electrical connection between the PCB of the USB modem and the PCB of the USB plug to ground the antenna.

Abstract: A silicon-ceramic composite substrate includes a low-temperature ceramic having at least one pre-formed ceramic layer and a silicon substrate. The low-temperature ceramic forms a carrier layer and the silicon substrate surface has a contact area with nanostructures) that completely penetrate into the low-temperature ceramic.

Abstract: This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.

Abstract: A portable electronic device includes an integration unit and a main circuit. The integration unit includes a carrier and at least one electronic element disposed on the carrier. The electronic element includes an antenna unit, a button input unit or a sound transmission unit. The main circuit is electrically connected to the electronic element through a conducting wire.

Abstract: In a circuit board, a laminate includes a plurality of laminated insulating material layers made of a flexible material. First external electrodes are provided on an upper surface of the laminate, and an electronic component is mounted thereon. Second external electrodes are provided on a lower surface of the laminate and mounted on a wiring board. An internal conductor is provided between first and second adjacent insulating material layers, fixed to the first insulating material layer, and not fixed to the second insulating material layer. The internal conductor is arranged so as to extend across regions obtained by connecting certain ones of the second external electrodes to certain ones of the first external electrodes located closest to the certain ones of the second external electrodes.

Abstract: A device for insulating an electrically conducting plane having a first electric potential relatively to a second electric potential is provided. The device comprises an insulating substrate including two parallel planar surfaces, and a first conducting outer layer and an electrostatic field reducer. The electrostatic field reducer reduces the value of the electrostatic field in a point of the peripheral edge, the reducer includes at least one conducting area distinct from the first outer layer, positioned on the first surface of the insulating substrate and/or in the insulating substrate. The reducer reduces the value of the electrostatic field in this point relative to the value of the electrostatic field in this point in the absence of the conducting area. The conducting area has a potential with a value strictly comprised between the values of the first and second potentials.

Abstract: A semiconductor memory card includes a semiconductor memory, a controller, input/output terminals, resistive elements, first wires, and second wires. The semiconductor memory is mounted on one surface of a substrate. The controller is mounted on the other surface of the substrate and controls the semiconductor memory. The input/output terminals input and output signals to and from the semiconductor memory via the controller. The resistive elements electrically connect input/output terminals to the controller. The first wires connect one-side ends of each of the resistive elements to the controller and each of which has a wire length of 4.0 mm or less. The second wires connect the other-side ends of each of the resistive elements to the input/output terminals.

Abstract: An electrical component system and method is provided. In an embodiment, the electrical component system includes a circuit carrier onto which at least one electrical component has been mounted. The circuit carrier is injection molded around using a molding compound. An embedding length of a circuit-board conductor in the molding compound, situated between the contacting area on the circuit carrier and the exit location, is maximized.

Abstract: An object of the present invention is to provide a display device including a cushioning member which is unlikely to be shifted from a predetermined position and has a function of effectively preventing EMI and/or ESD. In a display device according to the present invention, a cushioning member (50), located between a front surface of a peripheral portion (10b) of a display panel (10) and a back surface of a bezel facing the front surface, includes an elastic main body (52) formed of an elastic material and a conductive cover member (54) located on a surface of the elastic main body. At least a part of the conductive cover member is formed in a mesh pattern as a result of a plurality of conductive linear members (60) crossing each other and/or being located side by side.

Abstract: Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved.

Abstract: An electronic component includes a circuit element, a circuit board that is connected to the circuit element, and a connection terminal that is connected to the circuit board. The connection terminal includes a main body, a spring member that is formed so as to be elastically deformable in two directions including a direction of moving closer to the circuit board disposed on the main body and a direction of moving away from the circuit board, and a pair of arm portions that is extended from the main body so as to position the spring member therebetween. The pair of arm portions passes through the circuit board, ends of the respective arm portions far from the main body are bent toward the spring member, and the circuit board is held between the ends and the spring member.

Abstract: An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.

Abstract: A bracket is used to support a motherboard. The bracket includes a framework, a first supporting element, and a second supporting element. The framework includes a front bar, a back bar, and two side bars, corporately bounding a receiving space. The first and second supporting elements are received in the receiving space and connected to the two side bars. A number of through holes corresponding to a number of through holes of the motherboard are defined in the framework, the first supporting element, and the second supporting elements to fix the motherboard on the bracket via a plurality of screw pillars extending through the plurality of through holes of the bracket and the plurality of through holes of the motherboard.

Abstract: A protection circuit board for a secondary battery includes: a printed circuit board; a protection circuit attached to the printed circuit board and electrically connected thereto; a conducting pad electrically connected to a conducting pad of the protection circuit; a charging/discharging terminal electrically connected to the protection circuit and the conducting pad; a lead plate electrically connected to the conducting pad, the lead plate including at least one soldering hole arranged on a surface thereof to couple the lead plate to the conducting pad.

Abstract: A mounting apparatus for expansion cards includes a cage of a chassis, a bracket secured to the cage, a positioning member, and a circuit board. The cage includes an installation plate. The installation plate is adapted to secure a first end of a first expansion card. The positioning member is removably mounted to the cage and includes a top wall. The top wall is adapted to secure a third end of a second expansion card with a height smaller than the first expansion card. The circuit board is secured to the bracket and is adapted to secure a second end of the first expansion card and a forth end of the second expansion card. A distance between the installation plate and the top wall is substantially equal to an altitude difference between the first expansion card and the second expansion card.

Abstract: Disclosed herein are exemplary embodiments of an EMI shielding apparatus. A frame of the apparatus has a sidewall and an inwardly extending lip defining at least one opening along an upper portion of the frame. A reusable cover is attachable to the frame for at least substantially covering opening(s) of the frame. A first border portion of the cover includes one or more sliding members. A second border portion of the cover includes one or more stops. The sliding member(s) and stop(s) are configured to abut, in generally opposed directions, one or more lip edges generally facing the opening(s) when the cover is attached to the frame. The shielding apparatus is operable for shielding the component(s) on the substrate that are within an interior cooperatively defined by the frame and the cover.

Abstract: A mobile terminal includes a terminal body, a case defining an appearance of the terminal body, the case formed of a non-metal, and a metal frame formed of a metal, at least part of the metal frame extending through the case from inside to outside of the terminal body so as to be externally exposed, wherein the case and the metal frame are integrally formed with each other. Accordingly, a specific pattern can be realized at the appearance of the terminal body to arouse distinctive attraction to the appearance, thereby providing a terminal with such attractive appearance.