Physical vapor deposition sputtering target

- Applied Materials Inc.
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Description

FIG. 1 is a top perspective view of a physical vapor deposition sputtering target.

FIG. 2 is a top plan view thereof.

FIG. 3 is a bottom plan view thereof.

FIG. 4 is a front elevation thereof.

FIG. 5 is a back elevation view thereof.

FIG. 6 is a right elevation view thereof.

FIG. 7 is a left elevation view thereof; and,

FIG. 8 is an enlarged partial front elevation view showing portions of the design in greater detail.

The broken lines shown in the drawings depict portions of the physical vapor deposition sputtering target that form no part of the claimed design. The dot-dash lines encircling portions of the physical vapor deposition sputtering target in FIGS. 4 and 8 indicate enlargements and form no part of the claimed design.

Claims

The ornamental design for a physical vapor deposition sputtering target, as shown and described.

Referenced Cited
U.S. Patent Documents
5320728 June 14, 1994 Tepman
D351450 October 11, 1994 Maryska
D363464 October 24, 1995 Fukasawa et al.
D376744 December 24, 1996 Eisenblatter
D381030 July 15, 1997 Tepman
D395483 June 23, 1998 Maryska
D423026 April 18, 2000 Shimazu
D425919 May 30, 2000 Burkhart et al.
6086725 July 11, 2000 Abburi et al.
6114216 September 5, 2000 Yieh et al.
D446231 August 7, 2001 Kuraoka et al.
6390905 May 21, 2002 Korovin et al.
6599399 July 29, 2003 Xu
6659850 December 9, 2003 Korovin et al.
D487254 March 2, 2004 Suenaga
D496951 October 5, 2004 Brasseur et al.
6815352 November 9, 2004 Tamura et al.
D503729 April 5, 2005 Leeuw et al.
D529057 September 26, 2006 Willson
D553104 October 16, 2007 Oohashi et al.
D557226 December 11, 2007 Uchino
D559066 January 8, 2008 Tano et al.
D559993 January 15, 2008 Nagakubo et al.
D559994 January 15, 2008 Nagakubo et al.
D562856 February 26, 2008 Hawley et al.
D570310 June 3, 2008 Sasaki et al.
D571383 June 17, 2008 Ota et al.
D571831 June 24, 2008 Ota et al.
D571833 June 24, 2008 Ota et al.
D572733 July 8, 2008 Ota et al.
7402098 July 22, 2008 Severson et al.
D582949 December 16, 2008 Yamashita
D584591 January 13, 2009 Tano et al.
D592029 May 12, 2009 Tano et al.
D592030 May 12, 2009 Tano et al.
D600660 September 22, 2009 Sato
D600989 September 29, 2009 Tano et al.
D614593 April 27, 2010 Lee et al.
D616389 May 25, 2010 Takahashi
D616390 May 25, 2010 Sato
D633452 March 1, 2011 Namiki et al.
D649126 November 22, 2011 Takahashi
D669509 October 23, 2012 Krink et al.
8371904 February 12, 2013 Jindal et al.
D678745 March 26, 2013 Nguyen
8398833 March 19, 2013 Lee et al.
D683806 June 4, 2013 Dueck
D687790 August 13, 2013 Krishnan et al.
D687791 August 13, 2013 Krishnan et al.
D691974 October 22, 2013 Osada
D694790 December 3, 2013 Matsumoto et al.
D703162 April 22, 2014 Tamaso
D716742 November 4, 2014 Jang et al.
D724553 March 17, 2015 Choi et al.
D732094 June 16, 2015 Jussel et al.
D741823 October 27, 2015 Tateno et al.
D741921 October 27, 2015 Jarvius et al.
D750728 March 1, 2016 Kremer
D754468 April 26, 2016 Nason
D767234 September 20, 2016 Kirkland et al.
D769200 October 18, 2016 Fukushima et al.
9475996 October 25, 2016 Mandle
D770992 November 8, 2016 Tauchi et al.
D787458 May 23, 2017 Kim et al.
D790039 June 20, 2017 Hawrylchak et al.
D790041 June 20, 2017 Jang et al.
D793572 August 1, 2017 Kozuka et al.
D794753 August 15, 2017 Miller
D795208 August 22, 2017 Sasakl et al.
D796458 September 5, 2017 Jang et al.
D797067 September 12, 2017 Zhang et al.
D797691 September 19, 2017 Joubert et al.
D798248 September 26, 2017 Hanson et al.
D801942 November 7, 2017 Riker et al.
D804230 December 5, 2017 Allan et al.
D808349 January 23, 2018 Fukushima et al.
D810705 February 20, 2018 Krishnan et al.
D813181 March 20, 2018 Okajima et al.
D819580 June 5, 2018 Krishnan et al.
D825504 August 14, 2018 Zhang et al.
D825505 August 14, 2018 Hanson et al.
D830435 October 9, 2018 Wakisaka et al.
D830981 October 16, 2018 Jeong et al.
D836572 December 25, 2018 Riker et al.
D837755 January 8, 2019 Riker et al.
D839224 January 29, 2019 Yamaki et al.
D846514 April 23, 2019 Yoshida et al.
D851613 June 18, 2019 Johanson et al.
10442056 October 15, 2019 Namiki et al.
D868124 November 26, 2019 Riker et al.
D869409 December 10, 2019 Riker et al.
D877101 March 3, 2020 Johanson et al.
D880437 April 7, 2020 Lee et al.
10662520 May 26, 2020 West
D888903 June 30, 2020 Gunther et al.
D890572 July 21, 2020 Saiki
D891382 July 28, 2020 Koppa et al.
D893441 August 18, 2020 Rao et al.
D894137 August 25, 2020 Johanson et al.
10811232 October 20, 2020 Srikantaiah et al.
D902165 November 17, 2020 Johanson et al.
D908645 January 26, 2021 Savandaiah et al.
D913979 March 23, 2021 Babu et al.
D913980 March 23, 2021 Lee et al.
D922229 June 15, 2021 Jun et al.
D933725 October 19, 2021 Koppa et al.
D940765 January 11, 2022 Gunther et al.
D946638 March 22, 2022 Riker et al.
D966357 October 11, 2022 Gunther et al.
D970566 November 22, 2022 Riker et al.
D971149 November 29, 2022 Smith
D980813 March 14, 2023 Shin
D980814 March 14, 2023 Shin
D981970 March 28, 2023 Inada
D984972 May 2, 2023 Shi
D1005974 November 28, 2023 Shin
D1007449 December 12, 2023 Gunther et al.
D1030687 June 11, 2024 Huang
D1034248 July 9, 2024 Shinozaki
D1038901 August 13, 2024 Zhang
D1067204 March 18, 2025 Huang
D1071886 April 22, 2025 Liang
D1085029 July 22, 2025 Iyengar
D1092423 September 9, 2025 Kim
20040149567 August 5, 2004 Kosyachkov
20050152089 July 14, 2005 Matsuda et al.
20050193952 September 8, 2005 Goodman et al.
20070076345 April 5, 2007 Bang
20080173541 July 24, 2008 Lee et al.
20080308416 December 18, 2008 Allen et al.
20090260982 October 22, 2009 Riker et al.
20100096261 April 22, 2010 Hoffman et al.
20100108500 May 6, 2010 Hawrylchak et al.
20100170786 July 8, 2010 Wang et al.
20120033340 February 9, 2012 Roy et al.
20120263569 October 18, 2012 Priddy et al.
20130056347 March 7, 2013 West
20130316628 November 28, 2013 Jang et al.
20140261180 September 18, 2014 Yoshidome et al.
20150170888 June 18, 2015 Riker et al.
20150357169 December 10, 2015 Yuan et al.
20160002776 January 7, 2016 Nal et al.
20160002788 January 7, 2016 Nal et al.
20160035547 February 4, 2016 Johanson et al.
20170009367 January 12, 2017 Harris et al.
20220356560 November 10, 2022 Wu
20220359174 November 10, 2022 Wang
20230175113 June 8, 2023 Kim
20240133023 April 25, 2024 Marro
20240271271 August 15, 2024 Wang
20250163566 May 22, 2025 Song
Foreign Patent Documents
206573738 October 2017 CN
306731322 August 2021 CN
D1420846 August 2011 JP
D1421157 August 2011 JP
D1422692 September 2014 JP
D1640252 September 2019 JP
223429 May 1994 TW
223430 May 1994 TW
D146490 April 2012 TW
188898-0001 September 2016 TW
D 197321 May 2019 TW
D 197827 June 2019 TW
D 202101 January 2020 TW
Other references
  • Applied Materials, (date retrieved Jan. 7, 2026), Endura ALPS PVD, Appliedmaterials.com, URL: (https://www.appliedmaterials.com/us/en/product-library/endura-alps-pvd-alps-co-ni.html), (Year: 2026).
  • Gasworld, (date posted Nov. 13, 2023), Semiconductor supply chain problems: Running rampant?, Gasworld.com, URL: (https://www.gasworld.com/feature/semiconductor-supply-chain-problems-running-rampant/2130290.article/), (Year: 2023).
  • Ulvac, (date retrieved Jan. 7, 2026), Sputtering Targets for Semiconductor Applications, Ulvac.co.jp, URL: (https://www.ulvac.co.jp/en/products/materials/for_semiconductor/), (Year: 2026).
  • Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
  • Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019.
  • Search Report for Taiwan Design Application No. 1077303086 dated Jul. 6, 2018.
  • Sputtering Targets, posted at Angstrom Sciences, posting date May 5, 2016. Site visited Apr. 1, 2019. URL: <https://web.archive.org/web/20160505015447/https://www.angstromsciences.com/sputtering-targets> (Year: 2016).
  • Sputtering Targets for LSis, posted at JX Nippon Mining & Metals, posting date Mar. 22, 2016. Site visited Apr. 1, 2019. URL: <https://web .archive .org/web/20160322055046/http :1/www.nmm.jx-group.co.jp/english/products/04_supa/target_adv.html> (Year: 2016).
  • Search Report for Taiwan Design Application No. 110302622 dated May 21, 2021.
  • Search Report for Taiwan Design Application No. 113300257 dated May 4, 2023.
  • The basics of Physical Vapour Deposition _ Double Stone Steel, No Announcement Date [online], retrieved on May 31, 2024, retrieved from internet, https://web.archive.org/web/20170605050031/https://www.doublestonesteel.com/blog/metals/basics-physical-vapour-deposition/ (Year: 2024).
Patent History
Patent number: D1129517
Type: Grant
Filed: Jan 17, 2025
Date of Patent: Jun 9, 2026
Assignee: Applied Materials Inc. (Santa Clara, CA)
Inventors: Shane Lavan (Santa Clara, CA), Madan Kumar Shimoga Mylarappa (Bengaluru), Sundarapandian Ramalinga Vijayalakshmi Reddy (Bangalore), Avinash Nayak (Bangalore), Wei Dou (Sunnyvale, CA), Yong Cao (San Jose, CA), Kirankumar Neelasandra Savandaiah (Bangalore), Mingdong Li (Santa Clara, CA)
Primary Examiner: Richard Edgar
Assistant Examiner: Cheng Chen
Application Number: 29/986,121